A kind of graphene composite cooling film and preparation method thereof

A graphene composite and heat-dissipating film technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc. Operational cost reduction effect

Active Publication Date: 2020-09-25
国宏中晶集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a novel method for preparing a graphene heat-conducting film to solve the problem that the graphene heat-conducting film of the prior art cannot prepare a high-quality heat-conducting film at low cost. Without the use of high temperature and expensive raw materials such as polyimide film, improving the performance of graphene thermal film to a satisfactory level points out the direction

Method used

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  • A kind of graphene composite cooling film and preparation method thereof
  • A kind of graphene composite cooling film and preparation method thereof

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Embodiment 1

[0016] A kind of graphene composite cooling film and preparation method thereof, it has prepared the graphene composite cooling film as claimed in claim 4, is characterized in that, comprises the following steps: 1) graphene microchip preparation step: with prefabricated a large amount of expansion Graphene flakes are used as raw materials, and the graphene microflake dispersion is generated by high-frequency ultrasonic peeling in absolute ethanol for more than 1-2 hours; the solvent absolute ethanol of the graphene microflake dispersion is supplemented to more than 200-300ml, and the high-strength Sonicate for 3-5 minutes, immediately discard half of the dispersion in the upper layer, and then replenish to a volume of 200-300ml or more, repeat the above process at least 5-10 times, until some samples are taken and observed by SEM or AFM. The average radial size is higher than 5-10um; all solvents are evaporated by rotary evaporation to obtain graphene microplates with large ra...

Embodiment 2

[0021] As in the method given in Example 1, in step (1), the solvent absolute ethanol of the graphene microchip dispersion is supplemented to more than 220ml, high-intensity ultrasonic vibration is performed for 4min, and half of the dispersion in the upper layer is discarded immediately, and then added To a volume of more than 220ml, repeat the above process at least 8 times until the average radial size of the graphene microflakes is higher than 5um.

[0022] In the step (3), put in 270 parts by weight of anhydrous chloroform after washing and drying, and heat to 26°C at a speed of 3-5 revolutions / second of the stirring bar and keep it, and the graphene sieve bucket The lower surface is a polyurethane porous plate with an average aperture of 100-150um; then use the quantum dot sieve bucket to sieve 0.8 parts by weight of ZnO quantum dots from a certain opening of the four-necked bottle, and the lower surface of the quantum dot sieve bucket is Polyurethane porous plate with a...

Embodiment 3

[0025] As in the method given in Example 1, in step (1), the solvent absolute ethanol of the graphene microchip dispersion is supplemented to more than 270ml, high-intensity ultrasonic vibration is performed for 5min, and half of the dispersion in the upper layer is discarded immediately, and then added To a volume of more than 270ml, repeat the above process at least 10 times until the average radial size of the graphene microflakes is higher than 6um.

[0026]In the step (3), after washing and drying, put 320 parts by weight of anhydrous chloroform, under the speed of 5-7 rpm of the stirring rod, heat to 28 ° C and keep, the graphene sieve bucket The lower surface is a polyurethane porous plate with an average pore diameter of 150-200um; the ZnO quantum dots of 1.2 parts by weight are screened in from a certain opening of the four-necked bottle with a quantum dot sieve bucket, and the lower surface of the quantum dot sieve bucket is Polyurethane porous plate with an average ...

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Abstract

The invention relates to a graphene composite heat dissipation film. The composite heat dissipation film is a laminated sheet layer of at least 20 layers or more, and comprises 100 parts by weight ofgraphene nanoplatelets with large radial sizes and 0.5-2 parts by weight of ZnO quantum dots 90% attached to the surface of graphene. The preparation steps include a graphene nanoplatelets preparationstep, a preparation step, a dispersion liquid preparation step and a heat dissipation film preparation step.

Description

technical field [0001] The invention relates to the technical field of a composite heat dissipation film containing graphene, in particular to a composite heat dissipation film containing graphene and a preparation method thereof. Background technique [0002] Graphene is a two-dimensional material composed of carbon atoms with a thickness of only one atom. It has excellent physical and chemical properties, such as excellent mechanical properties, high electrical conductivity, and good thermal conductivity. It is considered to be the most One of the potential nanomaterials. As a one-dimensional carbon nanomaterial, carbon nanofiber has the advantages of good mechanical properties, large specific surface area and good chemical stability. These special properties make it widely used in catalyst supports, polymer nanocomposites, energy Flexible substrate materials for conversion and storage devices, etc. Taking graphene microchip as an example, it not only has good physical p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/373
CPCH01L21/4871H01L23/3735H01L23/3738
Inventor 张岩付吉国董伟赵然周卫东曾蕾
Owner 国宏中晶集团有限公司
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