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Low-temperature metallurgical welding connection method of piezoelectric ceramic stack

A piezoelectric ceramic and welding connection technology, applied in the field of metallurgical welding, can solve the problems of ceramic thermal damage and high operating temperature, and achieve the effects of controllable thickness, simple process and wide application range

Inactive Publication Date: 2019-04-19
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The metallurgical welding method can obtain high-strength and stable joints, but the common electronic packaging solders and methods have high operating temperatures, which will cause thermal damage to ceramics.

Method used

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  • Low-temperature metallurgical welding connection method of piezoelectric ceramic stack
  • Low-temperature metallurgical welding connection method of piezoelectric ceramic stack

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0047] S1. A plurality of square-shaped piezoelectric ceramic sheets 2 are sequentially stacked to form a ceramic stack 1, and the surface of each piezoelectric ceramic sheet 2 includes a silver electrode layer;

[0048] S2. Add an alloy intermediate layer 4 based on the four elements of bismuth, lead, tin and cadmium between two adjacent piezoelectric ceramic sheets 2. The melting point of the intermediate layer 4 is 72°C, and it is a solder paste with a thickness of 0.05mm. ;

[0049] S3. Place the ceramic stack 1 in a heating device with an atmosphere of argon and a temperature of 100° C. for welding for 8 hours.

[0050] Such as figure 2 Shown is the cross-sectional SEM photograph of the piezoelectric ceramic stack prepared in Embodiment 1 of the present invention. The experiment uses the JEOLJEM-7001 scanning electron microscope produced by Hitachi to analyze the microscopic appearance of the cross-section of the welded joint. It can be seen from the figure that the ob...

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Abstract

The invention belongs to the technical field of metallurgical welding, in particular to a low-temperature metallurgical welding connection method of piezoelectric ceramic stack. The low-temperature metallurgical welding connection method of piezoelectric ceramic stack includes the following steps: S1, s stacking a plurality of piezoelectric ceramic sheets in sequence to form a ceramic stack, eachsurface of the piezoelectric ceramic sheet comprising a metal electrode layer a metal electrode layer; S2, adding an intermediate layer between two adjacent piezoelectric ceramic sheets; S3, placing the ceramic stack in a heating device for welding. The method has simple process and realizes metallurgical welding of piezoelectric ceramic stack at low temperature. The mechanical properties of the welded joints are excellent, and the thermal damage of temperature sensitive piezoelectric ceramic materials during packaging is avoided.

Description

technical field [0001] The invention belongs to the technical field of metallurgical welding, and in particular relates to a low-temperature metallurgical welding connection method for piezoelectric ceramic stacks. Background technique [0002] Piezoelectric ceramics, as a functional electronic ceramic material with piezoelectric properties, have been used in military, medical, industrial, civil and other fields. Among them, the piezoelectric ceramic stack with multilayer piezoelectric ceramic structure has more and more applications in energy conversion, driving, frequency control and sensing due to its piezoelectric effect, resonance and stretching characteristics. For example, new power supplies based on multilayer piezoelectric ceramic transformers, piezoelectric actuators for camera focusing, piezoelectric ceramic speakers, printer probes, etc. [0003] Due to the thermal depolarization characteristics of piezoelectric ceramic materials, the connection temperature shou...

Claims

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Application Information

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IPC IPC(8): C04B37/00
CPCC04B37/003C04B2237/12C04B2237/55
Inventor 李晓东叶灵敏孙旭东
Owner NORTHEASTERN UNIV
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