Integrated high-heat-conductivity substrate LED (light-emitting diode) lamp

A technology for LED lamps and LED strips, applied in lighting and heating equipment, semiconductor devices of light-emitting components, non-polymer adhesive additives, etc. The problem of the large size of the power LED light board is to achieve the effect of good self-heating performance, high power and small size

Inactive Publication Date: 2019-04-19
安徽皇广实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the thermal conductivity of the imported silicone potting compound of type OS 925 (A/B) is only 0.92W/(m·k), which cannot meet the requirements of high thermal conductivity.
Therefore, the current thermal conductivity of LED lamps is li

Method used

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  • Integrated high-heat-conductivity substrate LED (light-emitting diode) lamp

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0016] Example 1

[0017] Such as figure 1 As shown, the integrated high thermal conductivity substrate LED lamp includes a thermally conductive lamp body 10 and an LED light bar 20. The outer side wall of the thermally conductive lamp body 10 is provided with a plurality of receiving grooves 11 for accommodating the LED light bar 20. The LED light bar 20 includes a high thermal conductivity aluminum substrate and LED lamp beads 21 arranged in an array on the front surface of the high thermal conductivity aluminum substrate. The high thermal conductivity aluminum substrate includes a circuit layer, a high thermal conductivity insulating layer, and a copper plate layer. The lamp beads 21 are electrically connected, the high thermal conductivity insulating layer is fixed between the circuit layer and the copper plate layer; the copper plate layer and the containing groove 11 are encapsulated with high thermal conductivity LED packaging glue.

[0018] Mix and stir 100Kg epoxy resin, ...

Example Embodiment

[0020] Example 2

[0021] 110Kg epoxy resin, 4Kg tertiary amine curing agent, 1.5Kg imidazole accelerator, 3Kg silane coupling agent, 106Kg high thermal conductivity filler and 55Kg solvent are mixed and stirred to make a glue, which is cured by heat Thermally conductive insulating layer. Wherein, the high thermal conductivity filler is aluminum nitride powder with a particle size of less than or equal to 0.6 μm. The thermal conductivity of the high thermal conductivity insulating layer is 2.12 W / (mk).

[0022] Mix 100Kg silicone potting glue, 11Kg polydimethylsiloxane, 36Kg hexagonal boron nitride powder with a particle size of less than or equal to 0.6μm into the initial compound, and add it to the initial compound under moisture-proof conditions 0.56Kg methyltrimethoxysilane and 0.21Kg 3-aminopropyltrimethoxysilane are mixed uniformly to form a high thermal conductivity LED packaging glue. The thermal conductivity of the high thermal conductivity LED packaging glue is 1.39 W / ...

Example Embodiment

[0023] Example 3

[0024] 120Kg epoxy resin, 4.3Kg tertiary amine curing agent, 1.6Kg imidazole accelerator, 3.6Kg silane coupling agent, 110Kg high thermal conductivity filler and 60Kg solvent are mixed and stirred to make a glue, which is made by heat curing. Into a high thermal conductivity insulating layer. Wherein, the high thermal conductivity filler is aluminum nitride powder with a particle size of less than or equal to 0.6 μm. The thermal conductivity of the high thermal conductivity insulating layer is 2.08W / (mk).

[0025] Mix 100Kg silicone potting glue, 12Kg polydimethylsiloxane, 40Kg hexagonal boron nitride powder with a particle size of less than or equal to 0.6μm into the initial compound, and add it to the initial compound under moisture-proof conditions 0.6Kg methyltrimethoxysilane and 0.22Kg 3-aminopropyltrimethoxysilane are mixed uniformly to form a high thermal conductivity LED packaging glue. The thermal conductivity of the high thermal conductivity LED pack...

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Abstract

The invention relates to an integrated high-heat-conductivity substrate LED (light-emitting diode) lamp which comprises a heat-conduction lamp body and LED lamp strips. A plurality of containing grooves for containing the LED lamp strips are formed in the outer side wall of the heat-conduction lamp body, the LED lamp strips comprises high-heat-conductivity aluminum substrates and LED lamp beads are arranged on the fronts of the high-heat-conductivity aluminum substrates in an array manner, the high-heat-conduction aluminum substrates comprise circuit layers, high-heat-conductivity insulating layers and copper board layers, the circuit layers are electrically connected with the LED lamp beads, the high-heat-conductivity insulating layers are fixedly arranged among the circuit layers and thecopper board layers, and space among the copper board layers and the containing grooves are sealed by high-heat-conductivity LED packaging adhesives. The integrated high-heat-conductivity substrate LED lamp is excellent in heat conducting property, good in self-cooling performance, lighting temperature of the LED lamp beads can be reduced by the excellent heat conducting property, so that LED lamp beads with high power and higher brightness can be mounted, and an LED lamp with great power, high brightness and small size can be produced finally.

Description

technical field [0001] The invention relates to an LED lamp with an integrated high thermal conductivity base material, belonging to the technical field of LED lamps. Background technique [0002] LED lamps have the advantages of small size, low power consumption, long service life, high brightness, low heat, durability, and variety, and have gradually replaced incandescent lamps in the lighting market. [0003] In the production process of LED lamps, the packaging material is epoxy resin adhesive. For example, the main material of LED lamps is aluminum substrate. Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel is composed of three layers, which are circuit layer (copper foil), insulating layer and metal base layer. The insulating layer is glued with epoxy resin. agent made. Since the circuit layer (copper foil) and the metal base layer have excellent heat dissipation ability, the heat dissipati...

Claims

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Application Information

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IPC IPC(8): F21K9/23F21K9/238F21V19/00F21V29/87C09J183/04C09J11/06C09J11/04F21Y115/10
CPCC08K2003/385C08K2201/005C08L2203/206C08L2205/025C09J11/04C09J11/06C09J183/04F21K9/23F21K9/238F21V19/002F21V19/0025F21V29/87F21Y2115/10C08L83/04C08K3/38C08K5/5419C08K5/544
Inventor 张彩霞
Owner 安徽皇广实业有限公司
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