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Method for preparing high thermal conductivity and low thermal expansion electronic packaging material

An electronic packaging material, low thermal expansion technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor thermal conductivity and mechanical properties, and achieve the effect of good mechanical properties and excellent electrical conductivity.

Inactive Publication Date: 2019-04-26
许文强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current electronic packaging materials have poor thermal conductivity and mechanical properties, which cannot meet the requirements of current electronic devices.

Method used

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  • Method for preparing high thermal conductivity and low thermal expansion electronic packaging material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for preparing an electronic packaging material with high thermal conductivity and low thermal expansion, comprising the following steps:

[0026] (1) Dissolve titanium tetrachloride in absolute ethanol and stir and mix uniformly to obtain solution A; dissolve cerium nitrate hexahydrate in deionized water to obtain solution B; dissolve citric acid in deionized water to obtain citric acid solution ; Wherein, the mass ratio of titanium tetrachloride, cerium nitrate hexahydrate, and citric acid is 1.5:3:0.05;

[0027] (2) Mix and stir solution B and citric acid solution to make a mixed solution, then add ammonia solution and solution A dropwise to the mixed solution at the same time, stir while adding, continue stirring for 30 minutes after the dropwise addition, and filter after the precipitation , dry the precipitate, and sinter the obtained solid at 600°C for 1 hour to obtain a composite oxide; wherein, the drip rates of ammonia solution and solution A are 1.5L / ...

Embodiment 2

[0032] A method for preparing an electronic packaging material with high thermal conductivity and low thermal expansion, comprising the following steps:

[0033] (1) Dissolve titanium tetrachloride in absolute ethanol and stir and mix uniformly to obtain solution A; dissolve cerium nitrate hexahydrate in deionized water to obtain solution B; dissolve citric acid in deionized water to obtain citric acid solution ; Wherein, the mass ratio of titanium tetrachloride, cerium nitrate hexahydrate, and citric acid is 2:3:0.05;

[0034] (2) Mix and stir solution B and citric acid solution evenly to prepare a mixed solution, then add ammonia solution and solution A dropwise to the mixed solution at the same time, stir while adding, continue stirring for 50 minutes after the dropwise addition, and filter after the precipitation , the precipitate was dried, and the obtained solid was sintered at 800°C for 3 hours to obtain a composite oxide; wherein, the drip rates of the ammonia solution...

Embodiment 3

[0039] A method for preparing an electronic packaging material with high thermal conductivity and low thermal expansion, comprising the following steps:

[0040] (1) Dissolve titanium tetrachloride in absolute ethanol and stir and mix uniformly to obtain solution A; dissolve cerium nitrate hexahydrate in deionized water to obtain solution B; dissolve citric acid in deionized water to obtain citric acid solution ; Wherein, the mass ratio of titanium tetrachloride, cerium nitrate hexahydrate, and citric acid is 1.6:3:0.05;

[0041] (2) Mix and stir solution B and citric acid solution evenly to prepare a mixed solution, then add ammonia solution and solution A dropwise to the mixed solution at the same time, stir while adding, continue stirring for 35 minutes after the dropwise addition, and filter after the precipitation , the precipitate was dried, and the obtained solid was sintered at 630°C for 1.5h to obtain a composite oxide; wherein, the drip rates of the ammonia solution ...

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Abstract

The invention discloses a method for preparing a high thermal conductivity and low thermal expansion electronic packaging material, and relates to the electronic packaging material. The method comprises the following steps that firstly, a composite oxide is prepared by titanium tetrachloride and cerium nitrate hexahydrate through multi-hydrolysis; a polyurethane / composite oxide material is prepared by an in situ polymerization method; and finally, the obtained polyurethane / composite oxide material, epoxidized soybean oil and zinc stearate are uniformly mixed and stirred and then extruded and granulated by a twin-screw extruder, and the electronic packaging material is obtained. The electronic packaging material prepared by the method has good thermal conductivity, a low thermal expansion coefficient and good mechanical properties.

Description

Technical field: [0001] The invention relates to an electronic packaging material, in particular to a preparation method of an electronic packaging material with high thermal conductivity and low thermal expansion. Background technique: [0002] Based on the main functions of packaging mechanical support, heat dissipation, signal transmission, and chip protection, the overall requirements for the performance of packaging materials are: good chemical stability, high thermal conductivity, low thermal expansion coefficient, good mechanical strength and low cost. In primary and secondary packaging, thermal conductivity (TC) is a very important performance index to ensure that the heat generated by highly integrated ICs is released in time. At the same time, the coefficient of thermal expansion (CTE) should be taken into account, so that the CTE of the materials used should be similar, preferably consistent with the chip material, so as to avoid thermal stress or creep, fatigue a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L91/00C08K3/22C08K5/098C08G18/32C08G18/73C08G18/34C09K5/14
CPCC08G18/3206C08G18/341C08G18/73C08L75/04C08L2203/206C09K5/14C08L91/00C08K3/22C08K5/098
Inventor 许文强
Owner 许文强