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Preparation method of high heat conduction composite silicone gasket

A composite type, silicone pad technology, applied in rubber insulators, biocide-containing paints, organic insulators, etc., can solve the problems of poor thermal conductivity of silicone pads, insufficient heat conduction channels of thermally conductive silicone, and limited application range, etc., to achieve good insulation Effect

Inactive Publication Date: 2019-05-21
贵州升皇兴实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Heat is mainly transferred through three ways: heat conduction, heat convection and heat radiation. For heat-conducting silica gel, its main heat-conducting mechanism is through heat conduction. The heat-conducting silica gel currently used has insufficient internal heat-conducting channels, resulting in the heat conduction of the silica gel pad. Poor performance, which limits its scope of application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment 1: a kind of preparation method of high thermal conductivity composite silica gel pad, comprises the following steps:

[0021] (1) Screening of spherical alumina particles: Sieve spherical alumina particles through a sieve to obtain spherical alumina particles with large particle size and small particle size. The diameter of the alumina particles is 70 μm, and the particle size of the small-sized alumina particles is 5 μm; the mass ratio of the large-sized alumina particles to the small-sized alumina particles is 1:3. ;

[0022] (2) Sintering of spherical alumina particles: sintering spherical alumina particles at high temperature to obtain sintered spherical alumina particles; the sintering temperature is 1350°C;

[0023] (3) Grinding: add methyl silicone oil, polysiloxane, silicon dioxide, methyl vinyl silicone rubber and silane coupling agent to a three-roll mill for grinding to obtain a uniformly mixed silicone rubber colloid;

[0024] (4) Stirring: Put...

Embodiment 2

[0029] Embodiment 2: a kind of preparation method of high thermal conductivity composite silica gel pad, comprises the following steps:

[0030] (1) Screening of spherical alumina particles: Sieve spherical alumina particles through a sieve to obtain spherical alumina particles with large particle size and small particle size. The diameter of the alumina particles is 50 μm, and the particle size of the small-sized alumina particles is 3 μm; the mass ratio of the large-sized alumina particles to the small-sized alumina particles is 1:1.5. ;

[0031] (2) Sintering of spherical alumina particles: Sintering spherical alumina particles at high temperature to obtain sintered spherical alumina particles; the sintering temperature is 1150°C;

[0032] (3) Grinding: add methyl silicone oil, polysiloxane, silicon dioxide, methyl vinyl silicone rubber and silane coupling agent to a three-roll mill for grinding to obtain a uniformly mixed silicone rubber colloid;

[0033] (4) Stirring: p...

Embodiment 3

[0038] Embodiment 3: a kind of preparation method of high thermal conductivity composite silica gel pad, comprises the following steps:

[0039] (1) Screening of spherical alumina particles: Sieve spherical alumina particles through a sieve to obtain spherical alumina particles with large particle size and small particle size, among which the particle size of large particle size alumina particles is The diameter of the alumina particles is 80 μm, and the particle size of the small-diameter alumina particles is 7 μm; the mass ratio of the large-diameter alumina particles to the small-diameter alumina particles is 1:4. ;

[0040] (2) Sintering of spherical alumina particles: Sintering spherical alumina particles at high temperature to obtain sintered spherical alumina particles; the sintering temperature is 1400°C;

[0041] (3) Grinding: Add methyl silicone oil, polysiloxane, silicon dioxide, methyl vinyl silicone rubber and silane coupling agent to a three-roll mill for grindi...

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Abstract

The invention discloses a preparation method of a high heat conduction composite silicone gasket. The preparation method comprises the following steps: sieving spherical alumina particles; sintering the spherical alumina particles; grinding methylsilicone oil, polysiloxane, silicon dioxide, methylvinyl silicone rubber and a silane coupling agent; stirring; vacuumizing; and vulcanization molding and the like. Compared with the prior art, the high heat conduction composite silicone gasket disclosed by the invention has the advantages that silicone components are reasonably proportioned, and thespherical alumina particles are sieved, so that the alumina particles are reasonably distributed in a silicone matrix and the heat conductivity coefficient of the alumina particles is improved; the silicone gasket disclosed by the invention has high insulating property; and in addition, the heat conductivity coefficient of the silicone gasket is improved to 6.0 W or above which is out of reach bythe prior art.

Description

technical field [0001] The invention relates to a preparation method of a silica gel pad, in particular to a preparation method of a high thermal conductivity composite silica gel pad. Background technique [0002] Silicone rubber is a special synthetic rubber with silicon-oxygen bonds as the main chain, while ordinary rubber has a structure of C-C bonds as the main chain. Due to the particularity of its structure, it has high and low temperature resistance, high voltage resistance, ozone aging resistance, radiation resistance, high air permeability, and excellent chemical inertness to lubricating oil and other media. In addition, it has a wide temperature range (-50°C-250°C), good elasticity, good resistance to tracking and electrical corrosion, especially after its surface is polluted, it still has good hydrophobic properties. Therefore, it is of great significance to use silicone rubber as a thermally conductive matrix and compound it with high thermally conductive fille...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08K7/18C08K3/36C09D5/14H01B3/28
Inventor 万涛
Owner 贵州升皇兴实业有限公司
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