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Sintered lead-free low-temperature silver paste thick film method for surface modification of aluminum alloy

A technology for aluminum alloy surface modification, applied in metal material coating process, coating, etc., can solve problems such as the adhesion of silver thick film on aluminum alloy surface, improve wettability and weldability, and improve wettability Sexuality, effect of promoting densification

Active Publication Date: 2019-05-24
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The main purpose of the present invention is to provide a method of modifying and sintering lead-free low-temperature silver paste thick film on the surface of aluminum alloy to solve the problem of preparation of lead-free low-temperature sinter silver paste and the problem of adhesion of silver thick film on the surface of aluminum alloy

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  • Sintered lead-free low-temperature silver paste thick film method for surface modification of aluminum alloy
  • Sintered lead-free low-temperature silver paste thick film method for surface modification of aluminum alloy

Examples

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Embodiment 1

[0046] This embodiment provides the first aluminum alloy surface modification sintering lead-free low temperature silver paste thick film method, which specifically includes the following steps:

[0047] The composition of raw materials for preparing glass powder is in mole percentage: Bi 2 O 3 Is 35%; H 3 BO 3 Is 50%; ZnO is 10%; Al 2 O 3 2%, Li 2 CO 3 1%, SiO 2 2%;

[0048] 1. The preparation of lead-free low-temperature sintered glass powder by fusion quenching method includes the following steps:

[0049] (1) Calculate the percentage of moles Weigh the raw materials, put each component in a beaker, add an appropriate amount of absolute ethanol to ultrasonically disperse for 10 min, stir for 2 h, mix well and dry at 80 ℃;

[0050] (2) Take out the dried powder and grind it into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min and the heating rate is increased to 1300 ℃ for 30 min; then the molten liquid is poured into deionized water for smelting. Aft...

Embodiment 2

[0063] This embodiment provides the second method of aluminum alloy surface modification and sintering lead-free low temperature silver paste thick film method, which specifically includes the following steps:

[0064] The composition of raw materials for preparing glass powder is in mole percentage: Bi 2 O 3 Is 35%; H 3 BO 3 Is 50%; ZnO is 10%; Al2O 3 2%, Li 2 CO 3 1%, SiO 2 Is 2%.

[0065] 1. The preparation of lead-free low-temperature sintered glass powder by fusion quenching method includes the following steps:

[0066] (1) Calculate the percentage of moles Weigh the raw materials, put each component in a beaker, add an appropriate amount of absolute ethanol to ultrasonically disperse for 10 min, stir for 2 h, mix well and dry at 80 ℃;

[0067] (2) Take out the dried powder and fully grind it into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min and the heating rate is increased to 1300 ℃ for 30 min; then the molten liquid is poured into deionized wa...

Embodiment 3

[0080] This embodiment provides a third aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method, which specifically includes the following steps:

[0081] The composition of raw materials for preparing glass powder is in mole percentage: Bi 2 O 3 Is 35%; H 3 BO 3 Is 50%; ZnO is 15%.

[0082] 1. The preparation of lead-free low-temperature sintered glass powder by fusion quenching method includes the following steps:

[0083] (1) Calculate the percentage of moles. Weigh the raw materials, put each component in a beaker, add an appropriate amount of absolute ethanol for ultrasonic dispersion for 10 minutes, stir for 2 hours, mix well and dry at 80 ℃;

[0084] (2) Take out the dried powder and grind it into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min and the heating rate is increased to 1300 ℃ for 30 min; then the molten liquid is poured into deionized water for smelting. After quenching, dark brown glass ...

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Abstract

The invention provides a sintered lead-free low-temperature silver paste thick film method for surface modification of an aluminum alloy, and belongs to the technical field of the surface modificationof the aluminum alloy. The sintered lead-free low-temperature silver paste thick film method comprises the steps that a lead-free low-temperature sintered conductive silver paste is prepared, the silver paste is applied on the surface of the aluminum alloy by means of silk screen printing or metal stencil printing or dip coating, a silver thick film is formed on the surface of the aluminum alloyafter short-time low-temperature sintering, and a thick film layer has good bonding force with an aluminum alloy substrate, so that the surface modification of the aluminum alloy is realized, the wettability of a tin alloy brazing material on the surface of the aluminum alloy is greatly improved, the ohmic contact between the silver thick film and the aluminum alloy surface is maintained, and theapplicability of the aluminum alloy is further enhanced. The sintered lead-free low-temperature silver paste thick film method has a low temperature, environmental protection and no pollution and is simple and feasible, can obviously improve the wettability and weldability of the tin alloy brazing material on the surface of the aluminum alloy, is suitable for industrial production, and has excellent industrial application prospects.

Description

Technical field [0001] The invention belongs to the technical field of surface modification of aluminum alloys, in particular to a method for surface modification and sintering of aluminum alloys with a lead-free low-temperature silver paste thick film method to improve the solderability of tin alloy solder on the surface. Background technique [0002] Aluminum alloy is the most widely used non-ferrous metal structural material in industrial production and application. Because it is formed by adding alloy elements such as copper, zinc, manganese, silicon, magnesium, etc., it can maintain the advantages of pure aluminum and its light weight. Its specific strength is better than many alloy steels, making it an ideal structural material, which is widely used in aviation, aerospace, shipbuilding, automobiles, machinery and electronics and chemical industries. [0003] With the rapid development of science and technology and industrial economy, the demand for aluminum alloy welded struc...

Claims

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Application Information

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IPC IPC(8): C23C24/10C03C12/00
Inventor 李明雨孙钦
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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