Method for improving interface of copper-aluminum composite material by using silver plating

A copper-aluminum composite material and composite material technology, applied in the field of metal composite materials, can solve the problems of reducing interface bonding strength and electrical conductivity, and achieve the effect of improving interface bonding and electrical conductivity.

Inactive Publication Date: 2019-05-24
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for improving the interface of copper-aluminum composite materials by silver plating, so as to solve the problem of the formation of brittle intermetallic compounds on the interface during the preparation, processing and heat treatment of copper-aluminum composite materials, thereby reducing the interface bonding strength and conductivity. The problem
Therefore, the method of silver-plating between copper-aluminum metals can improve the interface problem of copper-aluminum composite materials caused by the production of copper-aluminum intermetallic compounds.

Method used

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Embodiment 1

[0023] The invention provides a method for improving the interface of copper-aluminum composite materials by silver plating, comprising the following steps: degreasing and polishing a copper-nickel-silicon tube with an outer diameter of 30mm and an inner diameter of 27mm to remove the oxide film, and immersing it in a copper-nickel silicon tube made of mercuric chloride, etc. In the prepared solution, carry out mercury treatment, so that a layer of mercury film is plated on the surface of the pipe, and then the pipe is used as the cathode, and the pure silver plate is used as the anode, immersed in silver potassium cyanide made of silver nitrate and potassium cyanide. In the electrolyte solution, electroplating is performed, and the thickness of the plating layer is 10 μm. The silver-plated copper-nickel-silicon tube and the aluminum-magnesium-silicon alloy rod with a diameter of 26.8 mm are drawn in multiple passes to form a composite wire with a diameter of 0.5 mm. Annealed ...

Embodiment 2

[0025] The invention provides a method for improving the interface of copper-aluminum composite materials by silver plating, which comprises the following steps: degreasing and polishing a pure copper strip with a thickness of 4 mm and a width of 50 mm to remove the oxide film, and immersing it in a solution made of mercuric chloride, etc. In the process, mercury treatment is carried out to coat a layer of mercury film on the surface of the workpiece, and then the workpiece is used as the cathode, and the pure silver plate is used as the anode, and immersed in the silver cyanide potassium electrolyte composed of silver nitrate and potassium cyanide. In, electroplating is carried out, and the thickness of the plating layer is 5 μm. Composite rolling the silver-plated copper strip and the pure aluminum strip of the same specification, the initial pass processing rate is 70%, followed by multi-pass cold rolling processing, the pass processing rate is 10%-25%, until the thickness ...

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Abstract

The invention provides a method for improving an interface of a copper-aluminum composite material by using silver plating, and belongs to the field of metal composite materials. The method comprisesthe following steps of plating a layer of metallic silver on the interface of a copper product in contact with an aluminum material, or plating a layer of metallic silver on the interface of the aluminum material in contact with the copper material, then processing and combining the copper material with the aluminum material, and preparing the copper-aluminum composite material after processing and heating treatment. According to the method, silver plating at the interface of copper and aluminum is adopted, so that the formation of brittle and poorly conductive intermetallic compounds at the interface between copper and aluminum is effectively hindered, and the interface bonding and electrical conductivity of the copper-aluminum composite material are improved.

Description

technical field [0001] The invention relates to a method for improving the interface of copper-aluminum composite materials by using silver plating, which belongs to the field of metal composite materials. Background technique [0002] Copper-aluminum composite material refers to a composite material in which copper is coated on the surface of aluminum so that copper and aluminum can be well bonded at the interface. Copper-aluminum composite materials not only have the advantages of copper's electrical conductivity, good thermal conductivity, low contact resistance, and beautiful appearance, but also have the advantages of aluminum's light weight, corrosion resistance, and economy. Using copper-aluminum composite materials to replace copper, which has a wide range of applications and a large demand, will have broad application prospects in the fields of power and signal transmission. Therefore, the development of high-efficiency and low-energy composite technology suitable ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46C25D5/44C25D5/34
Inventor 杨振米绪军黄国杰解浩峰彭丽军冯雪高宝东
Owner GRIMAT ENG INST CO LTD
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