Preparation method of high-purity molybdenum plate for target material

Abstract

The invention discloses a preparation method of a high-purity molybdenum plate for a target material. A molybdenum alloy with the purity of 99.9% or above is produced by using a sputtering method as araw material, a high-purity molybdenum workblank is obtained by smelting by adopting an electron beam cooling bed furnace, wherein the purity of the high-purity molybdenum workblank is 99.9% or above, the surface of the molybdenum workblank is milled, after finely grinding is performed, cropping is performed on a molybdenum square billet, then the forging workblank is cut into the required size,and flaw detection is performed on the forged workblank, the qualified forged workblank is heated to 980-1020 DEG C, forging is performed on the forged workblank by adopting a three-upsetting and three-drawing method, and the forge piece is made into a required specification bar in a die forging mode during final drawing, after annealing is performed on the forge piece, the oxide skin on the surface of the bar is removed, and then sawing is performed to form small column blocks with the required specifications after forged caps of the two heads are removed; and two sawing end surfaces of the small column blocks are polished by lathe machining, turn milling is performed on the inner bottom, an edge is reserved, and the reserved edge is chamfered, and thread machining is further performed onthe other end part to obtain the cylindrical molybdenum sputtering target material after further clearing. According to the preparation method, the purity of the produced target material is not lessthan 99.8%, the grain size is controlled to be 100 micron or below, and the technical requirements of the sputtering target materials can be met.

Description

technical field [0001] The invention relates to a method for preparing a high-purity molybdenum plate for a target. Background technique [0002] The sputtering method is one of the main technologies for preparing thin film materials, and the raw material for sputtering deposited thin films is the target material. The film deposited by sputtering with the target has high density and good adhesion. Since the 1990s, new devices and new materials in the microelectronics industry have developed rapidly. Electronics, magnetism, optics, optoelectronics and superconducting thin films have been widely used in high-tech and industrial fields, prompting the expansion of the sputtering target market. Today, the target material has flourished into a specialized industry. [0003] Pure molybdenum sputtering targets are developed in the emerging fields of decorative coatings, mold coatings, glass coatings, semiconductor device coatings, electronic device coatings, and flat display coati...

AI Technical Summary

Problems solved by technology

Although some domestic research institutes and manufacturers have developed and trial-produced targets, high-quality targets are still in the stage of theoretical research and trial production, and the quality of targets actually produced is relatively low, and a large number of high-quality targets still need import