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Halogen-free epoxy resin composition and preparation method and application thereof

A technology of halogenated epoxy resin and epoxy resin, which is applied in the field of epoxy resin composition and its preparation, can solve the problems of high brittleness, difficult processing, high cost, etc., achieve low thermal expansion coefficient, good peel strength, excellent The effect of heat resistance

Inactive Publication Date: 2019-06-07
江西省宏瑞兴科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Halogen-free copper-clad laminates have been facing obstacles such as high brittleness, high water absorption and high cost since the initial development. Up to now, the processability of PCB manufacturers for halogen-free products is still inferior to that of ordinary FR-4 materials. If it is worse, it will be more difficult to process, and the cost of PCB processing will also increase accordingly. Therefore, the industry generally needs to solve these long-standing problems faced by halogen-free materials.

Method used

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  • Halogen-free epoxy resin composition and preparation method and application thereof
  • Halogen-free epoxy resin composition and preparation method and application thereof
  • Halogen-free epoxy resin composition and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] 1. The mass percent composition of solids in the resin composition is 66%, and all the other are organic solvents (such as propylene glycol methyl ether), wherein, the formula of solids is shown in the following table 1 (by weight)

[0064] Table 1

[0065] raw material

Solid Weight (g)

Phosphorous epoxy resin

22

Isocyanate Modified Epoxy Resin

18

Phenoxy resin

1.5

Phosphorus-containing phenolic resin

15

Phenolic Resin

18

Dicyandiamide curing agent

0.8

2-Ethyl-4-methylimidazole (2E4MZ)

0.005

PX-200

2

silica

20

Aluminum hydroxide

10

[0066] 2. The preparation method of epoxy resin composition:

[0067] (1) Add 55 grams of organic solvent propylene glycol methyl ether and dicyandiamide curing agent, phosphoric acid ester flame retardant in the stirring tank according to the above weight, open the agitator, rotate at 900 rpm, and continue stirr...

Embodiment 2

[0076] 1. The mass percent composition of the solids in the resin composition is 62%, and all the other are organic solvents (such as propylene glycol methyl ether), wherein, the formula of the solids is shown in the following table 3 (by weight)

[0077] table 3

[0078]

[0079] 2. The preparation method of epoxy resin composition:

[0080] (1) Add 70 grams of organic solvent propylene glycol methyl ether, dicyandiamide curing agent, and phosphoric acid ester flame retardant into the stirring tank according to the above weight, turn on the agitator, rotate at 1000 rpm, and continue stirring for 120 minutes until the dicyandiamide The amine curing agent and PX-200 are completely dissolved; then add silicon dioxide and aluminum hydroxide, and keep stirring for 80 minutes after the addition is complete.

[0081] (2) Add phosphorus-containing epoxy resin, isocyanic acid-modified epoxy resin, phenoxy resin, phosphorus-containing phenolic resin, and phenolic resin in sequence ...

Embodiment 3

[0089] 1. The mass percent composition of solids in the resin composition is 69%, and all the other are organic solvents (such as propylene glycol methyl ether), wherein, the formula of solids is shown in the following table 5 (by weight)

[0090] table 5

[0091]

[0092] 2. The preparation method of epoxy resin composition:

[0093] (1) Add 53 grams of organic solvent propylene glycol methyl ether and dicyandiamide curing agent and phosphoric acid ester flame retardant into the stirring tank according to the above weight, turn on the agitator, rotate at 1000 rpm, and continue to stir for 120 minutes until the dicyandiamide The amine curing agent and PX-200 are completely dissolved; then add silicon dioxide and aluminum hydroxide, and keep stirring for 80 minutes after the addition is complete.

[0094] (2) Add phosphorus-containing epoxy resin, isocyanic acid-modified epoxy resin, phenoxy resin, phosphorus-containing phenolic resin, and phenolic resin in sequence accordi...

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Abstract

The invention discloses a halogen-free epoxy resin composition, which is characterized in that the halogen-free epoxy resin composition comprises the following components in parts by weight: phosphorus-containing epoxy resin 10%-25%; isocyanate modified epoxy resin 10%-25%; phenoxy resin 0.4%-3%; phosphorus-containing phenolic resin 5%-20%; dicyandiamide curing agent 0.2%-2%; phenolic resin 10%-25%; epoxy resin cure accelerator 0.002-0.05%; phosphate flame retardant 1%-10%; inorganic filler 20%-40%. The invention also discloses a preparation method thereof. The epoxy glass cloth-based copper clad laminates prepared by the invention all have medium glass transition temperature (Tg>=150 DEG C), excellent heat resistance and low coefficient of thermal expansion (CTE<=3.4%), low water absorption and good peel strength and make it suitable for the production of medium Tg halogen-free and environmentally friendly lead-free processes and multilayer boards (PCBs).

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates for electronic materials, and relates to an epoxy resin composition suitable for medium-Tg halogen-free substrate materials, a preparation method and applications thereof. Background technique [0002] From the introduction of the concept of halogen-free to the development until now, the environmental protection and halogen-free of electronic products has always been the general trend, and the use of halogen-free products suitable for low, medium and high fields is increasing day by day. In order to adapt to the world's environmental protection trends and green laws and regulations, halogen-free is the current environmental protection trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated mass production schedules for halogen-free electronic products for their electronic products. [0003] Printed circui...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L71/12C08L61/14C08L61/06C08K3/36C08K3/22C08K3/34
Inventor 况小军叶志
Owner 江西省宏瑞兴科技股份有限公司
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