High-thermal conductivity and high-insulation epoxy composite material, and preparation method and application thereof

A composite material and high insulation technology, which is applied in the direction of heat exchange materials, organic insulators, plastic/resin/wax insulators, etc., can solve the problems of reduced insulation performance of materials, no significant improvement in thermal conductivity of materials, and complex preparation processes, etc. , to achieve the effect of improving electrical insulation performance, improving thermal conductivity, and simple preparation method

Inactive Publication Date: 2019-06-14
TSINGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the low addition amount, the thermal conductivity of the material has not been significantly improved
[0005] CN106566197A discloses an aluminum oxide epoxy resin heat conducting composite material, wherein 10wt.% of nano-scale aluminum oxide is used, and the thermal conductivity is 0.36W / m -1 K -1 , while the thermal conductivity of pure epoxy resin is 0.23W / m -1 K -1 , due to the small addition of nano-alumina, an effective heat conduction network has not been formed, and the increase in thermal conductivity is not large
[0006] CN107189348A discloses an epoxy resin thermally conductive composite material, in which 3vol.%-15vol.% of boron nitride coated with polyglycidyl methacrylate is dispersed in the epoxy resin, and the thermal conductivity can reach 0.39W / m -1 K -1 -1.21W / m -1 K -1 , but the pretreatment of boron nitride is complicated, the preparation process is cumbersome, the cost is high, and it is difficult to put it into practical application on a large scale
[0007] CN109206853A discloses a high thermal conductivity epoxy resin-based composite material and its preparation method and application, in which micron alumina, thixotropic agent nano-silica, and one-dimensional material carbon nanotubes are added to the epoxy resin, and the thermal conductivity can reach 0.32 W / m -1 K -1 , but due to its cumbersome preparation process and high cost, it is difficult to put it into practical application on a large scale;
[0008] CN 108299791A discloses a resin composition, an article prepared from the resin composition and a preparation method thereof, using boron nitride nanotubes, epoxy resin, and heat-conducting particles such as aluminum nitride and alumina, but the preparation process is complicated, A large number of solvents are used in the preparation process, such as ethanol and methyl ethyl ketone, etc. The existence of a large number of small molecules may reduce the insulation performance of the material
The use of boron nitride nanotubes and aluminum nitride is high, the cost is high, and it is difficult to put it into production

Method used

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  • High-thermal conductivity and high-insulation epoxy composite material, and preparation method and application thereof
  • High-thermal conductivity and high-insulation epoxy composite material, and preparation method and application thereof

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Embodiment 1

[0047] The high thermal conductivity and high insulation epoxy composite material prepared in this embodiment, wherein the components and their mass parts are:

[0048] 100 parts of epoxy E-51, 98 parts of pyromellitic anhydride curing agent, 2 parts of N,N-dimethylaniline accelerator, 5 parts of nylon 6, 50 parts of micron boron nitride;

[0049] The particle size of the micron boron nitride is 10±2 μm.

[0050] The preparation method of the epoxy resin composite material with high thermal conductivity and high insulation comprises the following steps:

[0051] (1) Weigh the raw materials according to the parts by weight of the formula components, mix the epoxy resin, curing agent, accelerator and reinforcing agent evenly, the mixing temperature is 40°C, and the mixing time is 30min;

[0052] (2) Slowly add the homogeneously mixed material in step (1) into the three-roll mixer, and add inorganic particles in batches to make the dispersion more uniform.

[0053] (3) kneading...

Embodiment 2

[0056] The high thermal conductivity and high insulation epoxy composite material prepared in this embodiment, wherein the components and their mass parts are:

[0057] 100 parts of epoxy E-51, 95 parts of pyromellitic anhydride and dodecyl-substituted maleic anhydride (mass ratio is 3:2) mixed curing agent, 2 parts of trimethylhexamethylene diamine accelerator Agent, 5 parts of nylon 6, 50 parts of micron boron nitride;

[0058] The particle size of the micron boron nitride is 10±2 μm.

[0059] The preparation method of the epoxy resin composite material with high thermal conductivity and high insulation comprises the following steps:

[0060] (1) Weigh the raw materials according to the parts by weight of the formula components, mix the epoxy resin, curing agent, accelerator and reinforcing agent evenly, the mixing temperature is 50°C, and the mixing time is 60min;

[0061] (2) Slowly add the homogeneously mixed material in step (1) into the three-roll mixer, and add inorg...

Embodiment 3

[0065] The high thermal conductivity and high insulation epoxy composite material prepared in this embodiment, wherein the components and their mass parts are:

[0066] 100 parts of epoxy E-44, 95 parts of methyl endomethylene tetrahydrophthalic anhydride and pyromellitic anhydride mixed curing agent (mass ratio is 4:1), 2 parts of N,N-dimethyl Aniline and trimethylhexamethylenediamine mixed accelerator (mass ratio is 4:1), 5 parts of nylon 6, 50 parts of micron boron nitride;

[0067] The particle size of the micron boron nitride is 10±2 μm.

[0068] The preparation method of the epoxy resin composite material with high thermal conductivity and high insulation comprises the following steps:

[0069] (1) Weigh the raw materials according to the weight parts of the formula components, mix the epoxy resin, curing agent, accelerator, and reinforcing agent evenly, the mixing temperature is 50 ° C, and the mixing time is 60 minutes; (2) Step (1) Slowly add the uniformly mixed mat...

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Abstract

The invention discloses a high-thermal conductivity and high-insulation epoxy composite material, and a preparation method and an application thereof. The epoxy composite material comprises, by mass,100 parts of epoxy resin, 95-98 parts of a curing agent, 1-2 parts of a promoter, 10-50 parts of inorganic particles and 2-5 parts of a reinforcing agent. The epoxy resin composite material produced in the invention solves the problem of reduction of the electrical performances of the material, caused by the agglomeration and sedimentation of particles in the composite material when the addition amount of particles is high. The epoxy resin composite material prepared in the invention has a significantly improved thermal conductivity, and also has excellent electrical insulation properties.

Description

technical field [0001] The invention relates to a packaging material for power electronic equipment, in particular to a high thermal conductivity and high insulation epoxy composite material and its preparation and application. Background technique [0002] With the increasing use of large-scale integration and high-power equipment, the heat dissipation of electric power and electronic equipment has become an urgent problem to be solved. Epoxy resin (EP) is widely used in machinery, electronics, automobiles and aviation as adhesives, coatings and composite materials because of its high mechanical properties, small curing shrinkage, excellent electrical insulation and good stability. Aerospace and other fields. [0003] Wu (Xinfeng Wu, Ying Wang, Liyuan Xie, Jinhong Yu, Fei Liu, Pingkai Jiang) and others synthesized EP / Al by casting method 2 o 3 Composite materials, when Al 2 o 3 When the content of micron particles is 400phr, EP / Al 2 o 3 The thermal conductivity of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L77/02C08K3/38C08K7/14C09K5/14H01B3/40
Inventor 党智敏王思蛟张翀杨威蒋春霞赵金城
Owner TSINGHUA UNIV
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