Preparation method of high-power LED

A high-power, chip technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of shortened life of high-power LEDs, unstable light wavelength, and easy aging of the lens, and achieve oxidation resistance, UV resistance, and easy control , the effect of strong adhesion

Active Publication Date: 2019-06-28
东莞市谷麦光学科技有限公司 +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] High-power LEDs convert a large amount of electric energy into heat energy during use, which causes the lens to be prone to yellowing, which makes the output wavelength unstable; in addition, the lens is also prone to aging under long-term sunlight, which shortens the life of high-power LEDs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A method for preparing a high-power LED, comprising the steps of:

[0039] (1) Die-bonding: Fix the cut chip in the bracket with a die-bonding glue;

[0040] (2) One-time baking: Put it in a baking oven and bake until the crystal-bonding gel solidifies;

[0041] (3) Welding wire: welding the gold wire on the electrode;

[0042] (4) Encapsulation lens: Encapsulate the chip and bracket in the resin lens;

[0043] (5) Glue injection curing: use glue to bond the lens with the chip and the bracket;

[0044] (6) Secondary baking: Put it in a baking oven for secondary baking until the resin lens and glue are solidified;

[0045] (7) Welding: welding the LED on the substrate;

[0046] Wherein, the resin used in the resin lens described in step (4) includes the following raw materials in parts by weight: 15 parts of 1,4 cyclohexanediol, 30 parts of dodecyl cycloalkanediol, 45 parts of phthalic anhydride, 50 parts of bisphenol A novolac epoxy resin, 3 parts of powder non-tox...

Embodiment 2

[0057] The difference between embodiment 2 and embodiment 1 is that

[0058] The resin used in the resin lens described in step (4) includes the following raw materials in parts by weight: 30 parts of 1,4 cyclohexanediol, 30 parts of dodecyl cycloalkanediol, 60 parts of phthalic anhydride, bisphenol 60 parts of type A novolac epoxy resin, 5 parts of powder non-toxic phosphite, and 3 parts of phenyl o-hydroxybenzoate.

[0059]Further, the die-bonding glue in the step (1) is silver glue, and the height of the silver glue around the chip is 1 / 2 of the height of the chip.

[0060] Further, the baking process in the step (2) is as follows: the baking temperature is 175° C., and the baking time is 40 minh.

Embodiment 3

[0062] The difference between Example 3 and Example 1 is that the glue in the step (5) is epoxy resin glue, and the epoxy resin glue includes the following raw materials in parts by weight: 50 parts of bisphenol F type epoxy resin, diamino 20 parts of diphenylmethane, 20 parts of m-aminomethylamine, 0.05 parts of 2-ethyl-4-methylimidazole, and 0.05 parts of 1-benzyl-2-methylimidazole.

[0063] Further, the temperature of the secondary baking in the step (6) is 135°C, and the secondary baking time is 0.5h.

[0064] Further, the substrate in step (7) includes a copper substrate and an aluminum substrate welded to the bottom of the copper substrate, and the thickness ratio of the copper substrate to the aluminum substrate is 3:1.

[0065] Further, the soldering step described in step (7) uses silver-tin solder paste, and the silver-tin solder paste includes the following raw materials in parts by weight: 65 parts of silver; 40 parts of tin, 15 parts of dipropanol, nano silicon di...

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PUM

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Abstract

The invention belongs to the technical field of LEDs, and particularly relates to a preparation method of a high-power LED. The method comprises the following steps of die bonding, primary baking, wire bonding, lens packaging, glue injection curing, secondary baking and welding. The resin used by the lens contains the following raw materials: 1,4-cyclohexane diol, cyclododecane diol, phthalic anhydride, bisphenol A novolac epoxy resin, powdery non-toxic phosphite ester and phenyl salicylate. The high-power LED prepared through the preparation method is long in service life, stable in light emitting, not prone to yellowing, simple in preparation process, easy to control and suitable for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a preparation method of high-power LEDs. Background technique [0002] High-power LEDs convert a large amount of electrical energy into heat energy during use, causing the lens to easily yellow, which makes the wavelength of light output unstable; in addition, the lens is also prone to aging under long-term sunlight, resulting in shortened life of high-power LEDs. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a method for preparing high-power LEDs. The high-power LEDs prepared by this method have long service life, stable light output, and are not easy to yellow, and the preparation process is simple and easy. Control, suitable for large-scale production. [0004] The object of the present invention is achieved through the following technical solutions: ...

Claims

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Application Information

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IPC IPC(8): H01L33/58H01L33/56
Inventor 廖勇军张诺寒张立新陈伟豪张坤李萌萌
Owner 东莞市谷麦光学科技有限公司
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