Modified graphene enhanced waterborne FEVE fluorine-carbon flexible protection paint and coating

Abstract

The invention discloses a modified graphene enhanced waterborne FEVE fluorine-carbon flexible protection paint. The modified graphene enhanced waterborne FEVE fluorine-carbon flexible protection paintis prepared from waterborne FEVE fluorine-carbon resin, a low-surface-energy auxiliary agent, a curing agent, a diluent and a grafting modified graphene function filler. According to the modified graphene enhanced waterborne FEVE fluorine-carbon flexible protection paint, through a silane coupling agent gamma-aminopropyl triethyl silicane, graphene is subjected to grafting modification, and the wettability of the graphene is effectively improved, so that the graphene is uniformly dispersed in a paint system; the grafting-modified graphene of a flaky structure is uniformly dispersed, stacked layer by layer and staggered in the waterborne FEVE fluorine-carbon resin to form a tight physical shielding structure, and water molecules and atmospheric corrosion mediums are effectively isolated from permeating a circuit board substrate or being diffused into the circuit board substrate; meanwhile, through the further combination of excellent low surface energy and hydrophobic properties of thefluororesin, the prepared protection paint has the functions of resisting water, dampness and salt-spray corrosion, and it is guaranteed that the protection paint has high reliability under extreme working conditions of high temperature, high humidity and high salt-spray corrosion.

Description

technical field [0001] The invention relates to a flexible protective coating for circuit boards and the coating, belonging to the technical fields of mechanical and electronic engineering and surface engineering. Background technique [0002] With the continuous advancement of the national marine development strategy, closely related marine equipment, naval weapons and equipment, and island infrastructure construction are also gradually developing. Different from the inland and offshore areas, the natural climate conditions in the blue water area, especially the South my country Sea, are quite harsh. The climate in this area is a typical tropical marine climate, and its atmospheric environment is characterized by high temperature, high humidity, and high salt spray corrosion. Taking Sansha City in my country as an example, the annual average temperature is 28°C, the annual average relative air humidity exceeds 80%, the atmospheric corrosiveness level is above C4, and some s...

AI Technical Summary

Problems solved by technology

[0003] At present, there are mainly four protection methods for electronic components such as circuit boards: (1) structural protection, that is, to effectively isolate the internal electrical part from the outside world through external packaging, but the actual protection effect is very limited; (2) potting, namely Use potting glue such as epoxy resin to wrap the entire circuit board in it, so as to achieve the purpose of waterproof, moisture proof, salt spray proof, shock resistance, etc., but potting has a huge impact on the heat dissipation performance of the circuit board and it is difficult or costly to repair (3) Three anti-paint coatings, such as acrylate, silicone, and polyurethane moisture-proof films, which not only affect heat dissipation performance but can only protect against moisture and a small amount of water, and there are also problems of organic solvent pollution to the environment; (4 ) Hydrophobic nano-coating, using the low surface energy characteristics of the coating to create a super-hydrophobic effect, so as to achieve the purpose of effective waterproofing. This coating technology can basically meet the waterproof needs of life, but the weather resistance and impact resistance of the coating are not good.

[0004] To sum up, at present, for the "three defenses" of circuit boards' waterproof, moisture-proof, and salt-spray corrosion resistance, although technical means such as packaging, filling, and coating have been developed successively, there are still poor protection performance and poor heat dissipation performance. and many other problems; relatively mature packaging, filling and conformal paint technologies cannot be used for flexible circuit boards, and hydrophobic coating technology is basically still in the research and development stage, and there are problems such as weak adhesion

As for the protection of circuit boards under the harsh working conditions of high temperature, high humidity, and high salt spray corrosion, there is currently no countermeasure

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