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Copper powder and method for manufacturing same

A manufacturing method and technology of copper powder, applied to the conductive layer on the insulating carrier, conductor, transportation and packaging, etc., can solve the problems of copper layer peeling, excessive difference, copper layer cracks, etc., and achieve high shrinkage initiation temperature, The effect of low oxygen content

Pending Publication Date: 2019-08-09
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When copper powder is used as a material for sintering conductive paste to form conductor circuits or electrode contact members on ceramic substrates or dielectric layers, due to the difference between the sintering temperature of copper powder and the temperature at which ceramic shrinkage or dielectric sintering occurs, If the difference is too large, when the conductive paste is fired to form a copper layer, there will be a difference in shrinkage speed between the conductive paste and the ceramic substrate or dielectric, and there will be a difference in the copper layer from the ceramic substrate or (by sintering the dielectric) Formed) ceramic layer peeling, cracks on the copper layer, etc.

Method used

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  • Copper powder and method for manufacturing same
  • Copper powder and method for manufacturing same
  • Copper powder and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] While the oxygen-free copper balls are heated to 1600°C in a nitrogen atmosphere and the melt is dripping from the lower part of the casting tray in a nitrogen atmosphere, high-pressure water (pH value 10.3 Alkaline water) to make it freeze and solidify rapidly, separate the solid and liquid of the obtained paste, wash the solid with water, dry, disintegrate, and classify by wind to obtain copper powder.

[0052] The BET specific surface area, tap density, oxygen content, carbon content, and particle size distribution of the copper powder thus obtained were determined.

[0053] The BET specific surface area is measured by using a BET specific surface area measuring device (4 Sorbe US manufactured by Yuasa Ionix Co., Ltd. (Yuasa Ionix Co., Ltd.)), and degassing the measuring device by flowing nitrogen gas at 105° C. for 20 minutes. , in a mixture of nitrogen and helium (N 2 : 30% by volume, He: 70% by volume) and measured by the BET one-point method. As a result, the B...

Embodiment 2

[0062] Except that the water pressure is 106MPa and the water yield is 165L / min, the copper powder is obtained by the same method as in Example 1, and the BET specific surface area, tap density, oxygen content, carbon content, particle size distribution, and particle size distribution are obtained for the copper powder obtained. Grain size (Dx) and roundness coefficient mean values, and thermomechanical analysis (TMA) of copper powder was carried out.

[0063]As a result, the BET specific surface area is 0.28m 2 / g, the tap density is 4.9g / cm 3 . The oxygen content is 0.12% by mass, and the ratio of the oxygen content of the copper powder to the BET specific surface area (O / BET) is 0.43% by mass g / m 2 , the carbon content is 0.004% by mass. Cumulative 10% particle size (D 10 ) is 1.4μm, cumulative 50% particle size (D 50 ) is 3.8μm, cumulative 90% particle size (D 90 ) is 7.9 μm. The crystallite diameter (Dx) was 136.9 nm for the (111) plane, 47.2 nm for the (200) plane...

Embodiment 3

[0065] Except that the water pressure is 105MPa and the water yield is 163L / min, the copper powder is obtained by the same method as in Example 1, and the BET specific surface area, tap density, oxygen content, carbon content, particle size distribution, and particle size distribution are obtained for the copper powder obtained. Grain size (Dx) and roundness coefficient mean values, and thermomechanical analysis (TMA) of copper powder was carried out.

[0066] As a result, the BET specific surface area is 0.31m 2 / g, the tap density is 4.8g / cm 3 . The oxygen content is 0.12% by mass, and the ratio of the oxygen content of the copper powder to the BET specific surface area (O / BET) is 0.38% by mass g / m 2 , the carbon content is 0.007% by mass. Cumulative 10% particle size (D 10 ) is 1.4μm, cumulative 50% particle size (D 50 ) is 3.7μm, cumulative 90% particle size (D 90 ) is 6.8 μm. The crystallite diameter (Dx) was 140.1 nm for the (111) plane, 50.2 nm for the (200) plan...

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Abstract

Provided are an inexpensive copper powder and a method for manufacturing the same, the copper powder having a low oxygen content despite having a small particle diameter, and the copper powder havinga high shrinkage initiation temperature when heated. In the present invention, high-pressure water is blown in a non-oxidizing atmosphere into molten copper heated to a temperature 250-700 DEG C (preferably 350-650 DEG C, and more preferably 450-600 DEG C) higher than the melting point of copper while the molten copper is dropped, and the molten copper is rapidly solidified, whereby a copper powder having an average particle diameter of 1-10 [mu]m, a crystalline diameter Dx(200) in the (200) face of 40 nm or greater, and an oxygen content of 0.7% by mass or less is manufactured.

Description

technical field [0001] The present invention relates to a copper powder and a method for producing the same, and in particular, to a copper powder suitable for use as a material of a firing-type conductive paste and a method for producing the same. Background technique [0002] Conventionally, metal powder such as copper powder has been used as a material of a firing-type conductive paste for forming a conductor circuit or a contact member of an electrode. [0003] When copper powder is used as a material for sintering conductive paste to form conductor circuits or electrode contact members on ceramic substrates or dielectric layers, due to the difference between the sintering temperature of copper powder and the temperature at which ceramic shrinkage or dielectric sintering occurs, If the difference is too large, when the conductive paste is fired to form a copper layer, there will be a difference in shrinkage speed between the conductive paste and the ceramic substrate or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08B22F1/00B22F1/05B22F1/10
CPCB22F7/04H01B1/22H01B1/026C22C9/00C22C1/0425B22F2009/0828B22F2201/11B22F2999/00B22F2009/0848B22F2998/10B22F2009/0832B22F1/05B22F1/10B22F1/09B22F2203/13B22F9/082H01B5/14B22F2009/0844B22F2301/10B22F2009/086B22F2201/013B22F2201/02B22F2201/04B22F2303/01B22F2304/10
Inventor 吉田昌弘井上健一江原厚志道明良幸山田雄大
Owner DOWA ELECTRONICS MATERIALS CO LTD
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