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Flexible base composite substrate and preparation method thereof

A composite substrate and flexible technology, which is applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve the problem of not being able to take into account the physical properties and flexibility of the device, achieve good flexibility and ductility, and the preparation method is simple , the effect of good flexibility

Active Publication Date: 2019-08-27
合肥九州龙腾科技成果转化有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The patent of the present invention is to overcome the defect that the electronic device substrate in the prior art cannot take into account the excellent physical properties and flexibility of the device, and provides a flexible material with good flexibility and ductility under the premise of stable physical properties. base composite substrate, and also provides the preparation method of the flexible base composite substrate

Method used

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  • Flexible base composite substrate and preparation method thereof

Examples

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Embodiment 1

[0032] A flexible base composite substrate, the composite substrate comprises a layer of flexible organic polymer layer 1 made of polydimethylsiloxane, the thickness of which is 10 μm, and bonded and cured to form a whole The silicon single crystal slice 2 has a thickness of 0.5 μm.

[0033] A method for preparing a flexible matrix composite substrate as described above, the preparation method comprising the following steps:

[0034] (S.1) Spin coating: Mix polydimethylsiloxane toluene solution with a solid content of 90% and Dow Corning Sylgard184 curing agent at a mass ratio of 10:1, and then spin coat on a glass substrate to form a flexible film;

[0035] (S.2) Semi-curing: Curing the flexible film at 50°C for 30 minutes to a semi-cured state;

[0036] (S.3) Composite curing: transfer the single crystal sheet to the surface of the semi-cured flexible film, continue to cure for 30 minutes until it is completely cured, and peel it off from the glass substrate to obtain a fle...

Embodiment 2

[0039] A flexible matrix composite substrate, said composite substrate comprising a flexible organic polymer layer (1) made of polyethylene terephthalate, the thickness of which is 25 μm, bonded and cured The magnesium oxide single crystal flake 2 as a whole has a thickness of 10 μm.

[0040] A method for preparing a flexible matrix composite substrate as described above, the preparation method comprising the following steps:

[0041] (S.1) Spin coating: mix polyethylene terephthalate tetrahydrofuran solution with a solid content of 50% and polyisocyanate curing agent at a mass ratio of 20:1, and then spin coat on a glass substrate to form a flexible film;

[0042] (S.2) Semi-curing: Curing the flexible film at 120°C for 2 minutes to a semi-cured state;

[0043] (S.3) Composite curing: transfer the single crystal sheet to the surface of the flexible film in a semi-cured state, continue to cure for 3 minutes until it is completely cured, and peel it off from the glass substrat...

Embodiment 4

[0053]A flexible base composite substrate, said composite substrate includes a flexible organic polymer layer 1 made of polytetrafluoroethylene, the thickness of which is 100 μm and a PZT single crystal sheet that is bonded and cured to form a whole 2. Its thickness is 30 μm.

[0054] A method for preparing a flexible matrix composite substrate as described above, the preparation method comprising the following steps:

[0055] (S.1) Spin coating: Mix polytetrafluoroethylene emulsion with a solid content of 70% and polyisocyanate curing agent at a mass ratio of 20:1, and then spin coat on a glass substrate to form a flexible film;

[0056] (S.2) Semi-curing: Curing the flexible film at 300°C for 20 minutes to a semi-cured state;

[0057] (S.3) Composite curing: transfer the single crystal sheet to the surface of the semi-cured flexible film, continue to cure for 30 minutes until it is completely cured, and peel it off from the glass substrate to obtain a flexible matrix compos...

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Abstract

The invention belongs to the technical field of nanocomposite material synthesis, and particularly relates to a flexible base composite substrate and a preparation method thereof. The composite substrate comprises a flexible organic polymer layer and a single crystal sheet which is bonded with the flexible organic polymer layer to form a whole. The preparation method comprises the steps of mixingan organic polymer solution main agent with a curing agent according to a certain ratio and then spin-coating a glass substrate with a mixture to form a flexible thin film; then curing the flexible thin film to be in a semi-cured state; transferring the single crystal sheet to the surface of the flexible thin film in the semi-cured state, and stripping the single crystal sheet from the glass substrate after the flexible thin film is completely cured to obtain the flexible base composite substrate. The flexible base composite substrate overcomes the defects that a substrate of an electronic device cannot give consideration to excellent physical properties and flexibility of the device in the prior art, so that the flexible base composite substrate has the advantages of relatively high flexibility and ductility on the premise of stable physical properties; and meanwhile, the preparation method disclosed by the invention has the characteristics of simplicity and effectiveness, and no needof complex instruments and expensive reagents.

Description

technical field [0001] The invention belongs to the technical field of nano composite material synthesis, and in particular relates to a flexible base composite substrate and a preparation method thereof. Background technique [0002] Traditional electronic products rely on rigid circuit board printing technology. This rigid substrate has the obvious advantages of stable physical properties during use, but it also has the disadvantages of poor flexibility and ductility. With the rapid development of soft robots, foldable displays, and flexible medical devices, people's demand for flexible electronic devices is becoming more and more urgent. In this regard, researchers have proposed some solutions, such as using organic semiconductors instead of single crystal silicon, or thinning rigid electronic devices to the micro-nano level, but these technologies cannot take into account the excellent physical properties and flexibility of the device at the same time. Great feature. ...

Claims

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Application Information

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IPC IPC(8): H01L23/14H01L51/00
CPCH01L23/145H10K71/00H10K77/111Y02E10/549
Inventor 赵晓宇温嘉红余森江卢晨曦李领伟
Owner 合肥九州龙腾科技成果转化有限公司
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