Processing method of glass product

Abstract

The invention provides a processing method of a glass product. The processing method comprises the following steps: 1) cutting incoming glass to obtain appearance and inner through holes required by aproduct by using picosecond laser, wherein the cut product is still connected with excess materials; 2) carrying out pickling thinning and reinforcing treatment on the product and the excess materials together; 3) intensively marking the central position of the inner through holes of the product by using CO2 laser, wherein glass excess materials in the inner through holes are heated and softenedfirst, protrude downwards and extend out under the action of gravity, and then are naturally separated from the product by cooling shrinkage; and 4) applying external force to completely separate theproduct with the other glass excess materials. The method overcomes the problems that processing efficiency is low and the glass surface is easily damaged in a conventional computer numerical control(CNC) punching process, so that hole walls of the inner through holes of the product are smooth, and the advantages that high strength, high yield and no easy cracking are achieved.

Description

technical field [0001] The invention relates to the technical field of glass product processing, in particular to a glass product processing method. Background technique [0002] In the current society, the development trend of electronic products such as smartphones, liquid crystal displays, and tablet computers tends to be thinner, lighter, and more technologically advanced. The common feature of the above products is that they all include an integrally formed glass cover in structure. Since the internal components covered by current electronic products (such as convex camera modules and fingerprint recognition modules, etc.) need to be installed on the integrally formed glass Holes are opened on the cover plate, thus greatly improving the processing difficulty and processing accuracy of the integrally scribed glass cover plate. [0003] The existing processing methods for glass with internal through holes mainly include CNC milling processing method and laser cutting pro...

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Problems solved by technology

[0005] However, this method has the following problems: Most of the existing glass raw materials are non-grinding glass, and Jingdiao equipment can easily cause slight scratches to the product when processing such glass raw materials, and the scratch rate exceeds 50%, which not only seriously affects The mass production of the product, and these scratches will be enlarged in the subsequent chemical polishing process, resulting in product scrapping, or changes in the diameter of the through hole on the product, making it difficult to control the size of the product

[0007] Although the processing efficiency of this method is high, the inner wall of the processed through-hole is relatively rough, and the hole wall is prone to produce tiny cracks during processing, and the micro-cracks will be enlarged in the subsequent ultrasonic cleaning process, resulting in a decrease in product strength or even rupture.

In addition, this processing method cannot be used on strengthened glass products, because the material structure inside the chemically strengthened glass changes, and laser cutting will cause the entire glass product to shatter

[0008] Therefore, the industry needs a new method for processing glass products with in-band through-holes, which can overcome the problems of low processing efficiency, high cost loss, and many scratches and cracks on the product surface that affect the strength of the product in the traditional method. technical problem

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