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Wafer-level packaging structure and packaging method of floodlighting module

A technology of wafer-level packaging and flood lighting, which is applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problem of not meeting the needs of miniaturization and miniaturization of products in the electronics industry, and the requirement for device volume is not high , large device size and other issues, to achieve the effect of good consistency, excellent optical performance, and high alignment accuracy

Active Publication Date: 2021-11-30
华天慧创科技(西安)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the maturity of TOF (time of flight) and structured light 3D sensing technology, and the rapid development of the 3D camera industry, the ordinary floodlight module is far from meeting the market demand. For example, the camera module and the floodlight module work together. It has been widely used in 3D reconstruction, face recognition and other fields, but limited by the manufacturing process of existing module production, there is still room for improvement in product consistency and alignment accuracy.
[0003] The processing technology of traditional optical devices does not have high requirements on the volume of the device, and the size of the device is usually large, which can no longer meet the needs of miniaturization and miniaturization of products in the electronics industry.

Method used

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  • Wafer-level packaging structure and packaging method of floodlighting module
  • Wafer-level packaging structure and packaging method of floodlighting module
  • Wafer-level packaging structure and packaging method of floodlighting module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 As shown, a wafer-level packaging structure of a floodlighting module in this embodiment includes a substrate 1, a functional chip 2, spacers 4, and optical components 5; wherein, the substrate 1 is a ceramic substrate, and the substrate 1 is It has at least one pair of positioning marks (not shown); the functional chip 2 is arranged on the surface of the substrate, the functional chip 2 is a vertical cavity surface emitting laser, and the surface of the functional chip 2 is electrically connected to the surface of the substrate 1 through a metal wire 3; the functional chip 2 The peripheral substrate is provided with a spacer 4, the upper end of the spacer 4 is higher than the functional chip 2; the optical component 5 is arranged above the functional chip 2, and the two ends of the optical component 5 are respectively connected to the spacer 4 on the periphery of the functional chip 2. The top end of the optical component 5 and the spacer 4 jointly for...

Embodiment 2

[0038] A wafer-level packaging method for a floodlighting module, comprising the following steps:

[0039] 1. See figure 2 , providing a clean substrate 1 having at least one pair of alignment marks (not shown).

[0040] Two, see image 3 , integrating multiple functional chips 2 onto the substrate through a die bond process.

[0041] 3. See Figure 4 , using a wire bonding (wire bond) process to realize the electrical connection between the functional chip 2 and the surface of the substrate 1 through the metal wire 3 .

[0042] 4. Apply glue dispensing process to coat glue layer A (not shown) on the surface of the substrate between multiple functional chips 2;

[0043] 5. Use a lithography machine to complete the alignment of the spacer 4 and the substrate 1 through the semiconductor back side alignment (Back Side Alignment) method. After the alignment is completed, the lower end of the spacer 4 is in contact with the adhesive layer A; lock the substrate 1 and The space...

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Abstract

The invention provides a wafer-level packaging structure and packaging method of a floodlighting module, the structural substrate, functional chips, spacers, and optical components; the functional chip is arranged on the surface of the substrate, and between the surface of the functional chip and the surface of the substrate It is electrically connected by metal wires; a spacer is provided on the peripheral substrate of the functional chip, and the upper end of the spacer is higher than the functional chip; the optical components are arranged above the functional chip, and the two ends of the optical components are respectively connected to the peripheral spacer of the functional chip. The top is connected, the optical components and the spacer together form a cavity structure, and the functional chip is located under the cavity structure. The optical components of the present invention are formed by embossing with a photolithography machine, have high alignment accuracy with the substrate, and have a high yield rate of finished products; Pressed together, and then cut into a single module, it has the characteristics of small size, low height, and good consistency.

Description

technical field [0001] The invention relates to the field of photoelectric modules, in particular to a wafer-level packaging structure and packaging method of a floodlighting module. Background technique [0002] With the maturity of TOF (time of flight) and structured light 3D sensing technology, and the rapid development of the 3D camera industry, the ordinary floodlight module is far from meeting the market demand. For example, the camera module and the floodlight module work together. It has been widely used in 3D reconstruction, face recognition and other fields, but limited by the manufacturing process of existing module production, there is still room for improvement in product consistency and alignment accuracy. [0003] Traditional optical device processing technology does not have high requirements on the volume of the device, and the size of the device is usually large, which can no longer meet the needs of the miniaturization and miniaturization of products in th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/544H01L21/56
CPCH01L21/56H01L23/3107H01L23/3114H01L23/544H01L2224/48091H01L2224/97H01L2924/16195H01L2924/00014
Inventor 李卫士杨超
Owner 华天慧创科技(西安)有限公司
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