Mesh type ultrasonic atomization sheet and manufacturing process thereof

An ultrasonic and atomizing sheet technology, applied in the field of mesh type ultrasonic atomizing sheet and manufacturing process, can solve the problems of low welding strength, failure of piezoelectric ceramics, poor contact, etc., and achieve good chemical resistance and working life. Improved, less prone to material breakage

Pending Publication Date: 2019-09-03
SHENZHEN SHANGJIN ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2. Since the carrier for transmitting deformation energy is a chemical adhesive, and the electrical conductivity of the adhesive cannot be compared with that of metal materials, there is a certain resistance, resulting in the loss of current transmission;
[0006] 3. Since the micron-scale mesh needs to be processed on the stainless steel sheet, the power requirements for the punching equipment are relatively high. The punching equipment needs enough energy to form a conical hole on the surface of the metal, and due to the metal The heat conduction speed is fast, so a lot of splashed metal residues will be generated due to uneven heat transfer during the drilling process, and some metal residues will be attached to the inner wall of the hole in a semi-molten state, so the tapered inner wall of the mesh and The edge is very rough, which affects the efficiency of liquid passage. At the same time, when the atomizing sheet is in the process of working, the repeated deformation of the metal is easy to form stress concentration points on the rough surface, causing the metal to break; Therefore, after punching, the metal flakes must be cleaned for a long time, forming a large amount of wastewater containing heavy metal particles;
[0007] 4. The high temperature generated during the wire welding process can easily lead to the failure of some areas of the annular piezoelectric ceramics. The failure temperature of conventional piezoelectric ceramics is only 250°C, but the local temperature of the wire welding process can reach 380°C, resulting in the failure of piezoelectric ceramics. Some areas failed due to high temperature, which led to poor consistency of the product as a whole;
[0008] 5. Since the stainless steel sheet is not an ideal welding material, whether the solderability between its surface and the solder is poor, it is necessary to use acidic chemicals to corrode the position of the protruding part of the stainless steel sheet before welding the wire on the stainless steel sheet, so that The local surface becomes rough to improve the weldability, but in fact, due to the poor weldability of the material itself during the welding process, the welding strength is not high, and it is easy to form bad contact, which affects the conductivity and is easy to fall off; and the acidic chemical agent is used during the use process. Medium and high risk, and the pollutants formed are not easy to handle, and the process does not meet the requirements of environmental protection;
[0009] 6. In the actual production process of the product, the process flow is too long, the production complexity is relatively high, and some processes are difficult to realize automatic manufacturing

Method used

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  • Mesh type ultrasonic atomization sheet and manufacturing process thereof
  • Mesh type ultrasonic atomization sheet and manufacturing process thereof
  • Mesh type ultrasonic atomization sheet and manufacturing process thereof

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Embodiment Construction

[0042] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0043] Such as figure 2 , image 3 , Figure 5As shown, a mesh type ultrasonic atomizing sheet includes an upper FPC material PCB board 1 and a lower FPC material PCB board 2, and the upper FPC material PCB board 1 includes a first PI film 11, a first copper foil 12 and an upper PI film 13 The lower FPC material PCB board 2 includes a second PI film 21, a second copper foil 22 and a lower PI film 23. An annular piezoelectric ceramic 3 is connected between the first copper foil 12 and the second copper foil 22, and the annular piezoelectric ceramic 3 Lead-free solder paste 31 is provided on the upper and lower surfaces of the upper and lower surfaces, and the annular piezoelectric ceramic 3 is welded to the first copper foil 12 and the sec...

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Abstract

The invention belongs to the technical field of ultrasonic atomization, and particularly relates to a mesh type ultrasonic atomization sheet and a manufacturing process thereof. The mesh type ultrasonic atomization sheet comprises an upper FPC material PCB and a lower FPC material PCB, wherein the upper FPC material PCB comprises a first PI film, a first copper foil and an upper PI film, the lowerFPC material PCB comprises a second PI film, a second copper foil and a lower PI film, an annular piezoelectric ceramic is connected between the first copper foil and the second copper foil, lead-free solder paste is arranged on the upper surface and the lower surface of the annular piezoelectric ceramic, the annular piezoelectric ceramic is welded with the first copper foil and the second copperfoil through the lead-free solder paste, the middle of the second PI film is provided with an arc-shaped transition surface, the arc-shaped transition surface is provided with micron-scale small holes, and the micron-scale small holes are of conical table structures.

Description

technical field [0001] The invention belongs to the technical field of ultrasonic atomization, and in particular relates to a mesh type ultrasonic atomization sheet and a manufacturing process. Background technique [0002] At present, the net-hole atomization drive technology in the market has become mature, and more industries have begun to introduce ultrasonic atomization technology. Through the introduction of ultrasonic atomization technology, some shortcomings in the original application have been solved, such as energy consumption has been greatly reduced, and fog Particles shrink, the consistency of fog particles is good, etc.; [0003] Such as figure 1 As shown, the main structure of the traditional mesh-type ultrasonic atomizing sheet consists of annular piezoelectric ceramics, a stainless steel sheet with a large number of micron-sized holes in the center of the circle, a wire welded on an electrode of the annular piezoelectric ceramic, and a stainless steel shee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B17/06B32B15/20B32B15/08B32B27/28B32B3/24B32B37/14B32B38/04B32B38/14B32B38/18
CPCB05B17/06B32B15/20B32B15/08B32B27/281B32B3/266B32B37/14B32B38/04B32B38/145B32B38/1816B32B2250/40B32B2038/047B32B2457/08B05B17/0646B06B1/0666B06B1/0651G10K9/122B32B7/12B32B15/18B32B2535/00B32B2307/20B32B2307/202B32B2255/205B32B9/005B32B9/041B05B17/0661B32B37/1292B32B37/182B32B38/0008B32B2310/0843B32B2311/12B32B2311/30B32B2315/02B32B2379/08
Inventor 郑瑶苏秋红
Owner SHENZHEN SHANGJIN ELECTRONICS TECH CO LTD
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