Mesh type ultrasonic atomization sheet and manufacturing process thereof
An ultrasonic and atomizing sheet technology, applied in the field of mesh type ultrasonic atomizing sheet and manufacturing process, can solve the problems of low welding strength, failure of piezoelectric ceramics, poor contact, etc., and achieve good chemical resistance and working life. Improved, less prone to material breakage
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[0042] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0043] Such as figure 2 , image 3 , Figure 5As shown, a mesh type ultrasonic atomizing sheet includes an upper FPC material PCB board 1 and a lower FPC material PCB board 2, and the upper FPC material PCB board 1 includes a first PI film 11, a first copper foil 12 and an upper PI film 13 The lower FPC material PCB board 2 includes a second PI film 21, a second copper foil 22 and a lower PI film 23. An annular piezoelectric ceramic 3 is connected between the first copper foil 12 and the second copper foil 22, and the annular piezoelectric ceramic 3 Lead-free solder paste 31 is provided on the upper and lower surfaces of the upper and lower surfaces, and the annular piezoelectric ceramic 3 is welded to the first copper foil 12 and the sec...
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