Forming method and product of multilevel microstructure on metal surface

Abstract

The present invention is a technical field prepared on the surface microstructure, and a method and product of a multi -level microstructure of metal surfaces are disclosed.When the micro -structured substrate is set on the substrate, it is a single layer or a multi -layer structure. The width of the rules and orderly distribution in each layer of micro -structures is less than a bar -shaped microcontroller of 200 μm.) Divide the substrate on the surface; divide the slicing layer according to the number of layers of the micro -structure to be formed, set the layer of the layer of the powder, plan the forming path of the slicing layer, (b) use the substrate as a forming plane, from the bottom up layer by layer by layer by layer by layer.The laser constituency melted the forming layer to obtain the required micro -structures on the substrate.Through the present invention, the large -scale metal surface rules are used in an orderly and multi -level micro -structures to be prepared in an orderly manner. It is suitable for a variety of common metal materials such as titanium alloy, aluminum alloy, stainless steel, and nickel -based alloy, and the process is simple.

Description

technical field [0001] The invention belongs to the technical field of surface microstructure preparation, and more specifically relates to a forming method and product of a multilevel microstructure on a metal surface. Background technique [0002] Surface microstructure preparation technology can play an important role in changing the surface characteristics of materials. By preparing microstructures on the surface of materials, special functions can be endowed on materials, surface function modification can be realized, and the original performance of materials can be improved. Therefore, it has great potential in various fields. Value. The preparation of surface microstructures has gone through decades since it was proposed, and it has been involved in many fields such as medicine, biology, sensors, architecture, aerospace, etc., and solves various problems for human beings in life and industry. [0003] At present, the preparation methods of metal surface microstructur...

AI Technical Summary

Problems solved by technology

However, most of the above-mentioned surface microstructure preparation methods have the following problems: (1) they are selective to forming materials and have poor material adaptability; (2) the prepared microstructures are disordered or irregular, and it is difficult to effectively control the microstructure morphology; (3) The preparation process has gone through many processes, and the preparation efficiency is low; (4) The prepared microstructure is affected by many factors such as the material environment temperature, humidity, surface material components, etc., and the repeatability is poor; The processing and preparation costs are expensive, the environmental hazards are great, and more importantly, the surface adhesion strength of the microstructure substrate prepared by most methods is low, and the mechanical strength itself is low. , impact, etc.) are easily destroyed, and the practical application effect is poor, which leads to the extremely limited application range of the above microstructure preparation method

Images