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Integrated circuit manufacturing device and manufacturing method thereof

A technology for integrated circuits and manufacturing devices, which is applied in circuits, semiconductor/solid-state device manufacturing, resistors, etc., can solve the problems such as the inability to improve the yield of integrated circuit substrate preparation devices, and achieve convenient production and use, convenient use, and improved production efficiency. Effect

Active Publication Date: 2021-01-15
伊犁师范大学
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing integrated circuit cannot work in a humid environment and the production rate of the integrated circuit substrate preparation device cannot be improved. A kind of integrated circuit manufacturing device and its manufacturing method

Method used

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  • Integrated circuit manufacturing device and manufacturing method thereof
  • Integrated circuit manufacturing device and manufacturing method thereof
  • Integrated circuit manufacturing device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: refer to Figure 1-3 ;

[0033] An integrated circuit manufacturing device includes an ion sputtering machine and a packaging machine, and also includes a substrate preparation machine. The substrate preparation machine is provided with a substrate preparation box 1, and the bottom surface of the substrate preparation box 1 is fixedly equipped with a moving wheel 3. The substrate preparation box 1. There are handles 2 on the upper ends of the left and right sides. The front of the substrate preparation box 1 is movably connected with the box door 4. A control panel 5 is installed on the outer surface of the box door 4. An intelligent production system is installed inside the control panel 5. The left side surface of the substrate preparation box 1 The middle part is provided with a side slot 6, and the lower slot surface of the side slot 6 is provided with a lower notch 7, and the inner slot surface of the side slot 6 is provided with a side slot 8, and a ...

Embodiment 2

[0035] Embodiment 2: refer to Figure 4 , the basis of the embodiment 1 is different in that;

[0036] The pushing mechanism 10 includes a first roller sleeve 16, a second roller sleeve 17 and a rolling platform 20. The peripheral surface of the first roller sleeve 16 is movably connected with the inner surface of one side of the rolling platform 20, and the peripheral surface of the second roller sleeve 17 is It is movably connected with the inner surface on the other side of the rolling table 20, and the middle part of the upper surface of the rolling table 20 is fixedly connected with a push block 24, which matches the lower notch 7, and the two ends of the first roller sleeve 16 are rotatably connected with the second One support connecting shaft 18, the lower end of the first supporting connecting shaft 18 is fixedly connected with the inner bottom surface of the substrate preparation box 1, the two ends of the second roller sleeve 17 are rotatably connected with the seco...

Embodiment 3

[0039] Embodiment 3: refer to Figure 5 , the basis of the embodiment 1 is different in that;

[0040] The fixed mechanism 13 includes a fixed frame 25, the lower surface of the fixed frame 25 is fixedly connected with the inner bottom surface of the substrate preparation box 1 through the support legs 26, the upper and lower sides and the left and right sides of the fixed frame 25 are all connected, and the front and rear lower frames of the fixed frame 25 are fixedly installed with Induction transmission table 27, induction transmission table 27 is electrically connected with control panel 5, electric control hydraulic rod 28 is fixedly installed on the front and rear upper frame surfaces of fixed frame 25, and the lower end of electric control hydraulic rod 28 is fixedly connected with a pressure plate for fastening large substrate 9 29. The right end of the fixed frame 25 is provided with a prolongation groove 30 for the circulation of waste boards. The prolongation groove...

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Abstract

The invention discloses an integrated circuit manufacturing device and a manufacturing method thereof, belonging to the technical field of integrated circuit manufacturing. An integrated circuit manufacturing device includes an ion sputtering machine and a packaging machine, and also includes a substrate preparation machine. The preparation box is connected to the box door. A control panel is installed on the outer surface of the box door. An intelligent production system is installed inside the control panel. There is a side slot in the middle of the left surface of the substrate preparation box, and a lower notch on the lower side of the side slot. There are side notches on the surface of the side tank, and there are multiple groups of large substrates in the side tank. The substrate preparation box is equipped with a pushing mechanism, an electronically controlled stamping rod, a stamping mechanism, a fixing mechanism, a finished product storage tank and a waste Board storage slot. The invention can quickly and conveniently press and form the substrate, facilitates the preparation and use of the integrated circuit, saves time and labor, and can improve the productivity of the integrated circuit in combination with the manufacturing method of the integrated circuit.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to an integrated circuit manufacturing device and a manufacturing method thereof. Background technique [0002] An integrated circuit is a tiny electronic device or component. It is a semiconductor manufacturing process such as oxidation, photolithography, diffusion, epitaxy, aluminum evaporation, etc., which integrates semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and the connecting wires between them into a small piece of silicon. On-chip, and then weld the electronic device packaged in a tube to become a microstructure with the required circuit function; all the components have been integrated in the structure, making the electronic components towards miniaturization, low power consumption and intelligence. And a big step forward in terms of high reliability. The emergence and application of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/329H01L23/64H01L21/56G01N27/02
CPCG01N27/02H01L21/56H01L21/67092H01L21/67155H01L21/67207H01L21/6776H01L21/67778H01L28/20H01L29/6609
Inventor 蒋中英雷一腾肖璐梅李阳
Owner 伊犁师范大学
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