Packaging method of MEMS sensor

A packaging method and sensor technology, applied in the field of MEMS, can solve the problems of excessive packaging shell cost and lower sensor performance, and achieve the effects of expanding the use range of devices, enhancing mechanical protection, and improving performance

Active Publication Date: 2019-10-08
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the high performance and high density of the sensor, the traditional multi-chip component package will adopt a fully hermetic package, usually: metal package, ceramic package or glass package, but the cost of the package shell of these materials exceeds the device itself
However, although the cost of non-hermetic plastic packa

Method used

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  • Packaging method of MEMS sensor
  • Packaging method of MEMS sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A method for encapsulating a MEMS sensor, the prepared MEMS sensor such as figure 1 with figure 2 As shown, the method includes the following steps:

[0043] 1. Handling of multilayer circuit boards 5

[0044] A multi-layer circuit board 5 is selected, cleaned and dried, and lead pads are printed on the multi-layer circuit board by screen printing technology, and gold balls 4 are welded on the pads for lead wires.

[0045] Wherein, the multilayer circuit board of the present embodiment has not been subjected to solder resist treatment; the specific process steps of the screen printing technology are: printing the solder resist ink onto the layout of the multilayer circuit board 5 through a screen, and printing the solder resist ink on the layout of the multilayer circuit board 5 at a certain temperature, time and ventilation Under the condition of a certain amount, the solvent in the ink is initially volatilized, and then the required pads and through holes are prote...

Embodiment 2

[0067] This embodiment is a packaging method for MEMS sensors, the main steps are the same as in Embodiment 1, the difference lies in the process parameters in the preparation process; specifically:

[0068] A method for encapsulating a MEMS sensor, the prepared MEMS sensor such as figure 1 with figure 2 As shown, the method includes the following steps:

[0069] 1. Handling of multilayer circuit boards 5

[0070] A multi-layer circuit board 5 is selected, cleaned and dried, and lead pads are printed on the multi-layer circuit board by screen printing technology, and gold balls 4 are welded on the pads for lead wires.

[0071] Wherein, the multilayer circuit board of the present embodiment has not been subjected to solder resist treatment; the specific process steps of the screen printing technology are: printing the solder resist ink onto the layout of the multilayer circuit board 5 through a screen, and printing the solder resist ink on the layout of the multilayer circui...

Embodiment 3

[0085] This embodiment is a packaging method for MEMS sensors, the main steps are the same as in Embodiment 1, the difference lies in the process parameters in the preparation process; specifically:

[0086] A method for encapsulating a MEMS sensor, the prepared MEMS sensor such as figure 1 with figure 2 As shown, the method includes the following steps:

[0087] 1. Handling of multilayer circuit boards 5

[0088] A multi-layer circuit board 5 is selected, cleaned and dried, and lead pads are printed on the multi-layer circuit board by screen printing technology, and gold balls 4 are welded on the pads for lead wires.

[0089] Wherein, the multilayer circuit board of the present embodiment has not been subjected to solder resist treatment; the specific process steps of the screen printing technology are: printing the solder resist ink onto the layout of the multilayer circuit board 5 through a screen, and printing the solder resist ink on the layout of the multilayer circui...

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Abstract

The invention relates to a packaging method of an MEMS sensor, which comprises the following steps: providing a multilayer circuit board, carrying out cleaning and drying, printing bonding pad for leads on the multilayer circuit board, and welding gold balls on the pads for leads; providing an MEMS sensor chip, printing a chip bonding pad on the back face of the MEMS sensor chip, and depositing multiple layers of metal films on the chip bonding pad through sputtering; inversely arranging the MEMS sensor chip on the multilayer circuit board; bonding a bonding pad for the leads and a chip bonding pad by using a hot-pressing bonding technology by taking the welding gold ball as a salient point, and filling a filler between the bonding pad for the leads and the chip bonding pad; bonding a protective cover on the front surface of the MEMS sensor chip by using an adhesive; and providing an elastic cover of which the upper surface is covered with a glass film, and adhering the elastic cover to the protective cover by adopting an adhesive to obtain the MEMS sensor. Compared with the prior art, the invention has the advantages of low production cost, easiness in batch production, good air tightness and the like.

Description

technical field [0001] The invention relates to the technical field of MEMS, in particular to a packaging method of a MEMS sensor. Background technique [0002] The tactile sensor used in the robot uses single crystal silicon as the structural material, and uses a semiconductor strain gauge to detect the magnitude of the applied pressure. This is a small, high-performance sensor that can be attached to a robot's fingertip, which enables the robot to perform complex assembly tasks and perform object recognition in environments where vision sensors cannot be used, such as darkness. Silicon has many excellent properties as a structural material for sensors for detecting force, for example, it is completely elastic, and its small size is conducive to maintaining a good affinity for circuits. A triaxial tactile sensor array is an array of 1 x 1 mm sensor elements that can resolve an applied force into three components through the piezoresistive effect and detect it as a change i...

Claims

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Application Information

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IPC IPC(8): B81B7/00B81C1/00G01L1/16
CPCB81B7/0058B81B7/007B81C1/00301B81C1/00269G01L1/16
Inventor 李以贵涂云婷王欢张成功蔡金东
Owner SHANGHAI INST OF TECH
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