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A kind of preparation method of layered copper chromium zirconium-pure copper composite plate

A composite plate, copper chromium zirconium technology, applied in the direction of manufacturing tools, heat treatment equipment, furnaces, etc., can solve the problems of poor interface bonding, low material utilization, and limited material strength improvement, so as to avoid grain recovery or Recrystallization, improving comprehensive mechanical properties, and realizing the effect of back stress strengthening

Active Publication Date: 2021-05-04
NANJING UNIV OF SCI & TECH
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  • Claims
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Problems solved by technology

[0004] However, this material preparation method also has many disadvantages: first, the use of hot rolling limits the increase in the strength of the material; second, it is difficult to rely solely on hot rolling to make two different metals have a good interface bond, In the process of welding, it will also cause cracks at the interface due to poor interface bonding, resulting in low material utilization; finally, the cumulative lap welding process is cumbersome, and it is easy to introduce impurities, thereby polluting the interface and causing poor interface bonding

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  • A kind of preparation method of layered copper chromium zirconium-pure copper composite plate
  • A kind of preparation method of layered copper chromium zirconium-pure copper composite plate
  • A kind of preparation method of layered copper chromium zirconium-pure copper composite plate

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preparation example Construction

[0033] A method for preparing a layered copper-chromium-zirconium-pure copper heterogeneous composite plate, comprising the following steps:

[0034] (1) Plate cutting and surface deoxidation treatment

[0035] Cut the copper-chromium-zirconium (C18150 grade) and pure copper (T2 grade) plates with a thickness of 0.1-5mm into the same length and width dimensions, and the thickness ratio of the copper-chromium-zirconium and pure copper layers is 7:3 (according to literature and theory It is concluded that the ratio of soft and hard phases is 3:7, which is the ratio with the best back stress strengthening effect (because the soft phase mainly provides electrical conductivity and plasticity, too high a ratio will lead to insufficient strength; while the hard phase mainly provides strength and hardness, too high a ratio High conductivity and plasticity will decrease)), at least two layers, the more layers the better (because the back stress strengthening mainly depends on the effec...

Embodiment 1

[0045] First of all, this embodiment adopts the following equipment: high temperature diffusion pressure welding equipment, Two-roll reversible temperature rolling mill, tube furnace with protective gas filling for heat treatment.

[0046] The process flow chart for preparing a layered copper chromium zirconium-pure copper heterogeneous composite plate in this example is as follows figure 1 As shown, the specific operation is as follows:

[0047] The pure copper used in this embodiment is 0.5mm, the thickness of the copper-chromium-zirconium plate is 1mm, and the size is 200×200mm 2, the chemical composition (wt.%) of pure copper used is: Cu: 99.94, Zn: 0.0041, Pb: 0.0007, Sn: 0.0005, Fe: 0.0031, Ni: 0.0028, Si: 0.028, and the rest are unavoidable impurities , the chemical composition (wt.%) of copper, chromium and zirconium is: Cu: 99.1565, Cr: 0.732, Zr: 0.067, Al: 0.001, Fe: 0.022, Mg: 0.014, P: 0.0005, Si: 0.007, and the rest are unavoidable of impurities.

[0048] Se...

Embodiment 2

[0056] First of all, this embodiment adopts the following equipment: high temperature diffusion pressure welding equipment, Two-roll reversible temperature rolling mill, tube furnace with protective gas filling for heat treatment.

[0057] The process flow chart for preparing a layered copper chromium zirconium-pure copper heterogeneous composite plate in this example is as follows figure 1 As shown, the specific operation is as follows:

[0058] The pure copper used in this embodiment is 0.5mm, the thickness of the copper-chromium-zirconium plate is 1mm, and the size is 200×200mm 2 , the chemical composition (wt.%) of pure copper used is: Cu: 99.94, Zn: 0.0041, Pb: 0.0007, Sn: 0.0005, Fe: 0.0031, Ni: 0.0028, Si: 0.028, and the rest are unavoidable impurities , the chemical composition (wt.%) of copper, chromium and zirconium is: Cu: 99.1565, Cr: 0.732, Zr: 0.067, Al: 0.001, Fe: 0.022, Mg: 0.014, P: 0.0005, Si: 0.007, and the rest are unavoidable of impurities.

[0059] S...

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Abstract

The invention belongs to the field of material preparation, in particular to a method for preparing a layered copper-chromium-zirconium-pure copper composite plate. It includes the following steps: (1) pretreatment: cut copper chromium zirconium and pure copper plates with the same length and width and a thickness ratio of 7:3, and process them; (2) diffusion pressure welding treatment: put the pretreated Copper chromium zirconium and pure copper plates are stacked sequentially and placed in an anaerobic atmosphere for diffusion pressure welding; (3) re-solution treatment: the precipitated second phase reinforcement is re-solid-dissolved into the matrix; (4) Cold rolling: obtain layered copper-chromium-zirconium-pure copper heterogeneous composite plate; (5) heat treatment. The present invention adopts the method of multi-layer stacking diffusion welding, and can prepare copper-chromium-zirconium-pure copper composite plate with a specified number of layers at one time; The phase redissolves back into the matrix, and the prepared layered plate has a good bonding interface, which improves the comprehensive mechanical properties of the material.

Description

technical field [0001] The invention belongs to the field of material preparation, in particular to a method for preparing a layered copper-chromium-zirconium-pure copper composite plate. Background technique [0002] In today's electrified industrial age, copper and copper alloys play an extremely important role in human society. There is a large demand for copper and copper alloys in fields such as electrical machinery, communication, machinery manufacturing, construction industry, and national defense industry. Pure copper has excellent thermal conductivity and electrical conductivity, but its low strength (coarse crystal tensile strength is about 200MPa) limits its further application. At present, the methods for obtaining high-strength and high-conductivity copper alloys are basically to partially sacrifice the good electrical conductivity of copper alloys when improving the strength of copper alloys. The more mature method is the alloying method. There are four main ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08C21D9/00C22F1/02
CPCC21D9/0081C22F1/02C22F1/08
Inventor 李玉胜张逸卿李建生王帅卓周浩曹阳聂金凤
Owner NANJING UNIV OF SCI & TECH
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