ASA 3D printing wire with low warpage at low temperature and preparation method thereof

Abstract

The invention relates to an ASA 3D printing wire with low warpage at low temperature and a preparation method thereof. According to the method, the ASA 3D printing wire with the low warpage at low temperature is prepared by taking 55-70 parts of ASA resin as a raw material adding 20-35 parts of an elastomer-aramid pulp composite, 3-12 parts of a compatibilizer, 3-8 parts of a tackifier, 0.2-1 partof an antioxidant and 0.2-1 part of paraffin oil through drying and dehumidifying, material mixing, melting blending, extrusion molding and traction winding. The wire rod does not generate shrinkageand warpage when molded under the condition of lower bottom plate temperature, has excellent mechanical property, good bonding property and excellent weather resistance, and has wide application fieldand high application value.

Description

technical field [0001] The invention relates to an ASA 3D printing wire material with low temperature and low warpage and a preparation method thereof. Background technique [0002] Additive manufacturing, also known as 3D printing, is a new manufacturing technology that integrates digital software, machinery and materials. It is characterized by material accumulation and forming, and is widely used in medical, education, military and other fields. As one of the mainstream technologies of 3D printing, fused deposition modeling has attracted people's attention due to its low cost, low temperature molding, and safe operation. [0003] The resin is a block copolymer obtained by polymerization of styrene, acrylonitrile and acrylate rubber. This material not only has excellent processing properties, mechanical properties and chemical corrosion resistance, but also has good weather resistance. However, in the fused deposition molding process of ASA resin, due to the open molding...

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Problems solved by technology

[0004] Chinese patent CN104448598A discloses an ASA 3D printing composite material prepared by adding inorganic powder and bamboo powder. This patent improves and optimizes the quality stability of the material and the fluidity of the molding process by adding inorganic powder and bamboo powder, while reducing the Nozzle printing temperature, but the patent does not take into account the possible disadvantages of adding inorganic materials, such as cracked material toughness, interlayer stress cracking, reduced nozzle life, etc.; at the same time, the patent does not address shrinkage warping An effective solution, not to mention printing and molding at a lower base temperature without shrinkage and warping

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