Low-loss and low-thermal-expansion magnesium-aluminum-silicon-based glass-ceramic material and preparation method thereof

Abstract

The invention provides a low-loss and low-thermal-expansion magnesium-aluminum-silicon-based glass-ceramic material and a preparation method thereof, and belongs to the field of electronic ceramic materials. A glass ceramic is prepared from the following components in percentage by weight: 10-20% of MgO, 20-30% of Al2O3, 45-50% of SiO2, 5-10% of ZrO2, 1-5% of B2O3, and 1-5% of CaO. The glass ceramic prepared at the low temperature of 900-950 DEG C has the characteristics that the low dielectric constant is 5.2-6.2 (@1MHz), the low dielectric loss is 5-20*10<-4> (@1MHz), the high bending strength is 140-190 MPa, the high Young modulus is 80-100 GPa, and the low thermal expansion coefficient is 2.5-4.5*10<-6> / DEG C, the glass ceramic is used for ultra-large-scale integrated circuit packaging, signal transmission delay can be significantly reduced, power consumption is lowered, the glass ceramic is matched with a silicon chip well, the whole preparation technological process is simple, the raw material source is rich, and the glass ceramic is of great significance to industrial production.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a low-loss and low-thermal-expansion magnesium-aluminum-silicon-based glass-ceramic material and a preparation method thereof; the material is suitable for ultra-large-scale integrated circuit packaging. Background technique [0002] In recent years, the rapid development of information technology has promoted the ultra-large-scale and multi-functionalization of integrated circuits, and promoted the development of packaging technology in the direction of advanced high-density packaging. Packaging materials are an important part of it, and the rapidly developing low-temperature co-firing Ceramics (LTCC) have attracted great attention. MgO-Al 2 o 3 -SiO 2 It is a glass-ceramic, which has the characteristics of large sintering temperature range, low sintering temperature, high bending strength, low thermal expansion coefficient, and excellent low-frequency dielectric pro...

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Problems solved by technology

[0006] The present invention aims at the problems of thermal expansion coefficient mismatch, high dielectric constant, large dielectric loss and high sintering temperature in the existing ceramic materials in the background technology, resulting in poor matching with silicon chips, large signal transmission delay and high power consumption, etc. The problem is to provide a low thermal expansion coefficient and low loss glass-ceramic material and its preparation method, which can not only achieve good thermal matching with silicon chips, but also have high mechanical strength and Young's modulus, and excellent dielectric properties

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