A kind of highly hydrophobic colorless transparent heat-resistant polyimide film and preparation method thereof

Abstract

The invention discloses a highly hydrophobic colorless transparent heat-resistant polyimide film and a preparation method thereof. Firstly, a certain proportion of 2-(4-aminophenyl)-5-aminobenzimidazole and X monomers are used as two diamine monomers, together with 4,4'-(hexafluoroisopropylene) diphthalic anhydride The dianhydride monomer is solution polymerized to form a polyamic acid copolymer, which is cast on a glass plate to form a film, desolventized at high temperature, and imidized to obtain a highly hydrophobic colorless transparent heat-resistant polyimide film. The method of the invention is simple to operate and easy to be popularized and applied on a large scale, and the prepared polyimide film is not only colorless and transparent, but also has excellent heat resistance and hydrophobicity, and can be better applied to flexible display devices.

Description

technical field [0001] The invention relates to a polyimide material and a preparation method thereof, in particular to a highly hydrophobic transparent heat-resistant polyimide material and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] In recent years, flexible electronics and flexible display technologies have developed rapidly in the field of electronic information. The research of flexible electronic products with the characteristics of light weight, bendability, foldability and even rollability has become the goal of the flexible display industry. The flexible substrate is an important part of the entire flexible display device, and its performance has an important impact on the quality and life of the flexible display device. Due to its outstanding heat resistance, chemical stability, excellent mechanical properties and good dielectric properties, polyimide has become the material of choice for flexib...

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Problems solved by technology

Chinese patent application 201711413756.9 introduces fluorine-containing groups and pyridine rings into the main chain of polyimide through molecular design to improve the dissolution resistance of the polymer and maintain its mechanical properties and thermal stability, and obtain a new type of thermosetting fluorine-containing polyimide imine polymer with a glass transition temperature of 346°C, T 5% The thermal weight loss temperature is 575°C, T 10% The thermal weight loss temperature is 602°C, and the contact angle is lower than 95°. Although the heat resistance is excellent, the hydrophobicity is not excellent enough

Chinese patent application 201710574815.4 synthesized a highly transparent and low dielectric polyimide film by fluorinated dianhydride 6FDA and fluorinated diamine TFDB, with a maximum light transmittance of over 91%, a dielectric constant of less than 3, and high tensile strength At 150MPa, the contact angle is between 72 and 74°. Although high transparency and low dielectric properties have been achieved, the hydrophobic performance needs to be improved

[0007] In the field of flexible display, polyimide imide materials are required to have better transparency, higher heat resistance and hydrophobicity. It is difficult for transparent polyimides on the market to have these characteristics.