Electronic grade glass fiber low in dielectric constant and preparation method thereof

Abstract

The invention discloses an electronic grade glass fiber low in dielectric constant. The electronic grade glass fiber low in dielectric constant is composed of following raw materials: silica sand, kaolin, boric acid, magnesium carbonate, dolomite, fluorite, lithium carbonate, soda ash, zinc oxide powder, carbon powder and titanium dioxide. The preparation method comprises following steps: 1, the raw materials at the formula ratio are crushed, sieved, and mixed so as to obtain a mixture; 2, the mixture is introduced into a kiln for stirring melting so as to obtain glass liquid; 3, the glass liquid obtained in step 2 is subjected to wire drawing and cooling so as to obtain fiberglass; and 4, the fiberglass obtained in step 3 is subjected to coating of an impregnating compound and wire drawing so as to obtain the electronic grade glass fiber low in dielectric constant. The dielectric constant of the electronic grade glass fiber low in dielectric constant is 4.2 to 4.3; the dielectric lossis 7.12 to 7.62, the water resistance factor ranges from 0.45 to 0.48%, the alkali resistance factor ranges from 1.3 to 1.3%, the production cost is low, and the preparation method is suitable for large scale production.

Description

technical field [0001] The invention belongs to the technical field of glass fibers, and in particular relates to a low dielectric constant electronic grade glass fiber and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the electronic information industry, the feature size of electronic components has been continuously reduced, and the VLSI has been continuously upgraded. The demand for high-performance substrates in the global electronic market is increasing day by day. With the development of integrated circuits and surface mount technology, the assembly density, application frequency and signal transmission speed of printed circuit boards have increased significantly, and the heating phenomenon of circuit boards has become more serious with the increase in power. Therefore, in order to improve the signal in the circuit board Higher transmission speed, lower signal transmission delay, higher signal-to-noise ratio,...

AI Technical Summary

Problems solved by technology

[0004] At present, the low-dielectric glass fibers commonly used at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric loss is large, greater than 10 -3 , cannot meet the requirements of high density and high-speed information processing

The composition of D glass fiber is: 72-76% SiO 2 , 0~5% Al 2 o 3 , 20-25% B 2 o 3 , 3~5% Na 2 O+K 2 O, its dielectric constant is about 4.1, and its dielectric loss is 8×10 -4 Or so, but D glass fiber has the following disadvantages: (1) Compared with E glass fiber, D glass fiber has a higher content of SiO 2 , leading to poor drilling performance of D glass fiber reinforced laminates, which is not conducive to subsequent processing; (2) D glass fiber has a high glass softening point and poor melting property, and it is easy to produce veins and air bubbles, resulting in difficulties in drawing operations. There are many broken glass fibers in the silk process, so the productivity and workability are very poor, the production cost is high, and it is not easy to produce on a large scale; (3) D glass fiber has a very high melting temperature and drawing temperature, generally at 1400 Above ℃, the quality requirements of the kiln are very strict, which will reduce the life of the kiln; (4) The water resistance of the glass fiber is poor, which is easy to cause the peeling of the fiber and the resin

[0006] CN101012105A discloses a kind of low dielectric constant glass fiber, and its composition is: 50~60% SiO 2 , 6-9.5% Al 2 o 3 , 30.5-35% B 2 o 3 , 0-5% CaO, 0-5% ZnO, 0.5-5% TiO 2 , among them, ZnO replaces part of CaO and MgO to reduce the dielectric constant, the dielectric constant is 3.9-4.4, and the dielectric loss is 4×10 -4 ~8.5×10 -4 , however, the drawing temperature of the glass fiber is higher, and its B 2 o 3 The high content will not only pollute the environment, but also easily lead to large fluctuations in composition and increase the corrosion of the kiln

The dielectric constant of the glass of this invention is <4.0, and the electric loss under the condition of 1 MHz is <0.0020, but the invention has poor water resistance, and the BaO used improves the dielectric constant, and at the same time, it is highly corrosive to the furnace material of the kiln.