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Al-TiC composite film and preparation process thereof

A composite thin film and preparation technology, which is applied in metal material coating technology, ion implantation plating, coating, etc., can solve the problems of poor high temperature stability and low strength (hardness), and achieve good compactness and temperature stability The effect of good resistance and fast deposition speed

Inactive Publication Date: 2019-11-05
SHANGHAI DIANJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the common problems of low strength (hardness) and poor high-temperature stability in traditional bimetallic solid-solution alloy films, and provide an Al-TiC composite film and its preparation process, which have high product strength and hardness, and can withstand high temperatures. Good stability, high production efficiency, coating material for specific parts

Method used

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  • Al-TiC composite film and preparation process thereof

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Embodiment 1

[0045] The specific technological parameters of the preparation method of the prepared Al-TiC composite film of the present invention are: TiC target sputtering power is 15W, Al target (DC) sputtering current is 0.4A, Al target (RF) sputtering power 220W, deposition After 2 hours, the film thickness is about 2 microns. In the Al-TiC composite thin film thus obtained, the content of TiC was 0.6% (atomic fraction, the same below), and the hardness of the thin film was 2.0 GPa. After annealing at 250°C, the hardness of the film is 1.9GPa; after annealing at 400°C, the hardness of the film is 1.64GPa. Without annealing at 250°C, the hardness of the film is 1.4GPa after direct annealing at 400°C.

Embodiment 2

[0047] The specific technological parameters of the preparation method of the prepared Al-TiC composite thin film of the present invention are: TiC target sputtering power is 30W, Al target (DC) sputtering current is 0.4A, Al target (RF) sputtering power 220W, deposition After 2 hours, the film thickness is about 2 microns. In the Al-TiC composite thin film thus obtained, the content of TiC was 1.5%, and the hardness of the thin film was 2.80 GPa. After annealing at 250°C, the hardness of the film is 2.60GPa; after annealing at 400°C, the hardness of the film is 1.86GPa. Without annealing at 250°C, the hardness of the film is 1.6GPa after direct annealing at 400°C.

Embodiment 3

[0049] The specific technological parameters of the preparation method of the prepared Al-TiC composite thin film of the present invention are: TiC target sputtering power is 100W, Al target (DC) sputtering current is 0.4A, Al target (RF) sputtering power 220W, deposition After 2 hours, the film thickness is about 2 microns. In the Al-TiC composite thin film thus obtained, the content of TiC was 5.4%, and the hardness of the thin film was 5.9 GPa. After annealing at 250℃, the hardness of the film is 5.56GPa; after annealing at 400℃, the hardness of the film is 3.33GPa. Without annealing at 250°C, the hardness of the film is 3.0GPa after direct annealing at 400°C.

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Abstract

The invention discloses an Al-TiC composite film and a preparation process thereof. The Al-TiC composite film is prepared from 0.1 at.%-11 at.% of TiC and the balance Al, and a double-ultra supersaturated solid solution has displacement solid solution and interstitial solid solution characteristics. The preparation process of the Al-TiC composite film includes the steps of magnetron sputtering andannealing treatment. The step of magnetron sputtering includes the procedures that the surface of a stainless steel substrate is pre-treated, the stainless steel substrate is subjected to argon plasma sputtering cleaning, and the Al-TiC composite film is vapor-deposited on the surface of the stainless steel substrate. According to annealing treatment, vacuum annealing is carried out at the temperature of 250 DEG C. The Al-TiC composite film is high in strength and hardness, good in high-temperature stability and high in production efficiency, and can be used for coating materials of specificparts.

Description

technical field [0001] The invention belongs to the technical field of metal matrix composite materials, and in particular relates to an Al-TiC composite film with high strength and high thermal stability and a preparation process thereof. Background technique [0002] With the development of metal thin film technology, it is widely used in microelectronics, micromechanics, optics, and surface modification. At present, electroplating and fusion plating are more commonly used methods for preparing metal thin films, but there are problems such as unstable quality of electroplating films. , environmental pollution problems, and the problems of complex process conditions, high cost and limited industrial application of molten plating and organic solvent plating, and the following problems exist in the metal thin films of electroplating and molten plating: [0003] 1) The protection effect is poor, that is, the strength and hardness are poor. The existing reports about the hardne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/16C23C14/35C23C14/58C22C32/00C22C21/00
CPCC22C21/00C22C32/0052C23C14/165C23C14/352C23C14/5806
Inventor 尚海龙刘达康旭徐浩曹胜彬马冰洋
Owner SHANGHAI DIANJI UNIV
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