Cyanide-free alkaline copper electroplating solution, preparation method thereof and application thereof in flexible printed circuit board

A copper electroplating and alkaline technology, applied in jewelry and other directions, can solve the problems of reducing the leveling ability, poor copper coating quality, weakening the copper thickness in the hole, etc., and achieves the smoothness of the electroplated copper layer, the simple wastewater treatment, and the optimized copper plating. Effects of Layer Properties

Active Publication Date: 2019-11-08
GUANGZHOU SANFU NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the research work shows that the electroplating effect of the through hole of the FPC board without the leveling agent system is obviously better than that under the leveling agent system, but the quality of the copper plating obtained under the condition of no leveling agent is poor
This is because the FPC board is thin and the thickness and diameter are relatively small. Under the convection of the plating solution, it is easier for the leveling agent to enter the hole, so the leveling agent can not only act on the hole, but also in the hole; When the leveling agent acts in the hole, it will inhibit the deposition of copper, weaken the copper thickness in the hole, and reduce the throwing power TP

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1, cyanide-free alkaline electroplating copper solution of the present invention and its preparation method and application in flexible printed circuit board

[0025] Formula: It consists of the following components: copper sulfate pentahydrate 120g / L, hydroxyethylidene diphosphonic acid 30g / L, sodium citrate 20g / L, sodium polydithiodipropane sulfonate 1g / L, lauryl disulfide Hydroxyethylamine oxide 2g / L and potassium carbonate 60g / L, the balance is deionized water; the pH value of this cyanide-free alkaline electroplating copper solution is 9.0.

[0026] Preparation method: Take the calculated amount of copper sulfate pentahydrate, hydroxyethylidene diphosphonic acid, sodium citrate, sodium polydithiodipropane sulfonate, lauryl dihydroxyethylamine oxide and potassium carbonate, and dissolve them in deionized water respectively Prepare an aqueous solution; then mix copper sulfate pentahydrate with hydroxyethylidene diphosphonic acid solution and sodium citrate...

Embodiment 2

[0028] Embodiment 2, cyanide-free alkaline electroplating copper solution of the present invention and its preparation method and application in flexible printed circuit board

[0029] Formula: It consists of the following components: copper sulfate pentahydrate 200g / L, hydroxyethylidene diphosphonic acid 50g / L, potassium citrate 10g / L, 3-mercapto-1-propanesulfonate sodium 10g / L, coconut Oleyl dihydroxyethyl amine oxide 8g / L and sodium carbonate 35g / L, the balance is deionized water; the pH value of this cyanide-free alkaline copper plating solution is 8.0.

[0030] Preparation method: Take the calculated amount of copper sulfate pentahydrate, hydroxyethylidene diphosphonic acid, potassium citrate, sodium 3-mercapto-1-propane sulfonate, cocoyl dihydroxyethylamine oxide and sodium carbonate, and dissolve them in Prepare an aqueous solution in deionized water; then mix copper sulfate pentahydrate solution with hydroxyethylidene diphosphonic acid solution and potassium citrate so...

Embodiment 3

[0032] Embodiment 3, cyanide-free alkaline electroplating copper solution of the present invention and its preparation method and application in flexible printed circuit board

[0033]Formula: It consists of the following components: copper sulfate pentahydrate 160g / L, hydroxyethylidene diphosphonic acid 40g / L, potassium tartrate 15g / L, sodium 3-mercapto-1-propanesulfonate 5g / L, tallow Dihydroxyethylamine oxide 4g / L and potassium hydroxide 5g / L, and the balance is deionized water; the pH value of this cyanide-free alkaline copper plating solution is 8.5.

[0034] Preparation method: Take the calculated amount of copper sulfate pentahydrate, hydroxyethylidene diphosphonic acid, potassium tartrate, sodium 3-mercapto-1-propane sulfonate, tallow dihydroxyethylamine oxide and potassium hydroxide, respectively dissolve in Prepare an aqueous solution in deionized water; then mix copper sulfate pentahydrate solution with hydroxyethylidene diphosphonic acid solution and potassium tartr...

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PUM

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Abstract

The invention belongs to the technical field of electroplating, and particularly relates to a cyanide-free alkaline copper electroplating solution, a preparation method thereof and application thereofin a flexible printed circuit board. The cyanide-free alkaline copper electroplating solution comprises the following components in concentration: 120-200 g/L of copper salt, 30-50 g/L of main complexing agent, 10-20 g/L of auxiliary complexing agent, 1-10 g/L of brightener, 2-8 g/L of amphoteric surfactant, 5-60 g/L of pH value regulator and the balance of deionized water. The cyanide-free alkaline copper electroplating solution of the invention has good dispersion performance and covering performance, the TP value reaches more than 180 percent, the crystallization of a plating layer can berefined, the binding force between a copper layer and a board surface is improved, the performance of the copper plating layer is optimized, and the quality requirement of the flexible printed circuitboard is met.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a cyanide-free alkaline electroplating copper solution, a preparation method thereof and an application in flexible printed circuit boards. Background technique [0002] With the increasingly higher requirements for portability of consumer electronic products and the gradual popularization of smart wearable devices, printed circuit boards have higher requirements for miniaturization, thinner, higher integration and installation flexibility. [0003] Flexible printed circuit board (also known as flexible circuit board or FPC for short) is a highly reliable flexible printed circuit board made of polyimide, polyester film, etc., with wiring density High, light weight, thin thickness, good bending characteristics. Therefore, more and more attention has been paid to the fabrication technology of flexible printed circuit boards. [0004] At present, there are mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00
CPCC25D3/38C25D7/00
Inventor 田志斌詹益腾邓正平
Owner GUANGZHOU SANFU NEW MATERIALS TECH
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