Ultraviolet LED epitaxial wafer and preparation method thereof
A kind of LED epitaxial wafer and ultraviolet technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of crystal dislocation, limit the large-scale application of glass materials, lattice mismatch, etc., achieve good conductivity and realize large-scale Production application, the effect of low production cost
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Embodiment 1
[0048] Such as figure 1 As shown, the present embodiment provides a structure of an ultraviolet LED epitaxial wafer, including:
[0049] glass substrate 10;
[0050] A copper metal layer 11 grown on the glass substrate 10, the thickness of the copper metal layer 11 is 150-300 μm;
[0051] A silver metal layer 12 grown on the copper metal layer 11, the thickness of the silver metal layer 12 is 100-300nm;
[0052] A polycrystalline AlN layer 13 grown on the silver metal layer 12, the thickness of the polycrystalline AlN layer 13 is 30-100 nm;
[0053] A single crystal AlN layer 14 grown on the polycrystalline AlN layer 13, the thickness of the single crystal AlN layer 14 is 50-200 nm;
[0054] A non-doped AlGaN layer 15 grown on the single crystal AlN layer 14, the thickness of the non-doped AlGaN layer 14 is 500-1000 nm;
[0055] An n-type doped AlGaN layer 16 grown on the non-doped AlGaN layer 15, the thickness of the n-type doped AlGaN layer 15 is 3000-5000 nm;
[0056] ...
Embodiment 2
[0061] The preparation method of the ultraviolet LED epitaxial wafer of the present embodiment comprises:
[0062] (1) Selection of substrate and its crystal orientation: use ordinary glass substrate;
[0063] (2) Substrate surface polishing and cleaning treatment;
[0064] The surface of the substrate is polished and cleaned, specifically:
[0065] Put the glass substrate into deionized water and ultrasonically clean it at room temperature for 3 minutes to remove the dirt particles on the surface of the glass substrate, then wash it with acetone and ethanol in order to remove the surface organic matter, and dry it with high-purity dry nitrogen;
[0066] (3) Growth of the copper metal layer: Firstly, the glass substrate was treated with plasma for 3 minutes under the condition of oxygen atmosphere, and then the glass substrate was placed in the electroplating solution, and a copper layer with a thickness of 150 μm was prepared at room temperature. metal layer;
[0067] (4) ...
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