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Quartz surface chemical roughening treatment method

A surface chemical and rough treatment technology, which is applied in the field of surface treatment of semiconductor quartz components, can solve the problems of long treatment cycle and long time consumption, achieve uniform surface roughness, reduce time consumption, and improve the effect of cleanliness

Inactive Publication Date: 2019-11-29
SHENYANG HANKE SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The patent notification number of CN101367618B provides a chemical roughening method for quartz surface. The surface roughness of quartz products treated by this method is more uniform without obvious unevenness, which avoids the occurrence of chemical vapor deposition (CVD) on the quartz surface. Particle phenomenon prevents the generation and shedding of deposited film cracks and prolongs the service life of quartz products. However, in the subsequent production and processing of quartz components for semiconductors, it takes a long time to process the surface of quartz components. long, so its processing cycle is longer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The quartz surface chemical roughening method of the present invention comprises the following steps:

[0032] (1) Pretreatment: firstly perform surface polishing and annealing treatment on the quartz parts to be treated, then clean the surface of the treated quartz parts with deionized water for 5 minutes, and finally dry the surface of the quartz parts with nitrogen;

[0033] (2) Preparation of treatment solution: the analytical pure hydrofluoric acid with a solution concentration of 40% and the solid analytical pure ammonium fluoride with a solution concentration of 99% are mixed, and then the analytical pure acetic acid with a solution concentration of 99.5% is added to prepare a treatment solution for subsequent use , wherein the addition mass ratio of each composition is: hydrofluoric acid: ammonium fluoride: acetic acid=3:5:9;

[0034] (3) Temperature adjustment of the treatment liquid: use electric heating to raise the temperature of the treatment liquid to 33°C...

Embodiment 2

[0040] The quartz surface chemical roughening method of the present invention comprises the following steps:

[0041] (1) Pretreatment: firstly perform surface polishing and annealing treatment on the quartz parts to be treated, then clean the surface of the treated quartz parts with deionized water for 5 minutes, and finally dry the surface of the quartz parts with nitrogen;

[0042] (2) Preparation of treatment solution: the analytical pure hydrofluoric acid with a solution concentration of 40% and the solid analytical pure ammonium fluoride with a solution concentration of 99% are mixed, and then the analytical pure acetic acid with a solution concentration of 99.5% is added to prepare a treatment solution for subsequent use , wherein the addition mass ratio of each composition is: hydrofluoric acid: ammonium fluoride: acetic acid=5:6:10;

[0043] (3) Temperature adjustment of the treatment liquid: use electric heating to raise the temperature of the treatment liquid to 34°...

Embodiment 3

[0049] The quartz surface chemical roughening method of the present invention comprises the following steps:

[0050] (1) Pretreatment: firstly perform surface polishing and annealing treatment on the quartz parts to be treated, then clean the surface of the treated quartz parts with deionized water for 5 minutes, and finally dry the surface of the quartz parts with nitrogen;

[0051] (2) Preparation of treatment solution: the analytical pure hydrofluoric acid with a solution concentration of 40% and the solid analytical pure ammonium fluoride with a solution concentration of 99% are mixed, and then the analytical pure acetic acid with a solution concentration of 99.5% is added to prepare a treatment solution for subsequent use , wherein the addition mass ratio of each composition is: hydrofluoric acid: ammonium fluoride: acetic acid=4:5.5:9.5;

[0052] (3) Temperature adjustment of the treatment liquid: the temperature of the treatment liquid is raised to 35°C by means of ele...

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Abstract

The invention relates to the technical field of semiconductor quartz part surface treatment, in particular to a quartz surface chemical roughening treatment method, which can effectively reduce consumed time and shorten the surface treatment period of a quartz part for a semiconductor. The method includes the steps of: (1) pretreatment: carrying out surface polishing and annealing treatment on a quartz part needing treatment, and then performing cleaning with deionized water for 5min; (2) preparation of a treatment solution: mixing analytically pure hydrofluoric acid with a solution concentration of 40% and solid analytically pure ammonium fluoride with a solution concentration of 99%, and then adding analytically pure acetic acid with a solution concentration of 99.5% to prepare the treatment solution for standby use; (3) temperature regulation of the treatment solution; (4) reaction treatment: completely immersing the pretreated quartz part in the prepared treatment solution subjected to temperature regulation, and letting a uniform ammonium fluorosilicate attachment gradually form on the surface of the quartz part; (5) flushing; (6) repeating and thickening; and (7) detection ofthe surface roughness.

Description

technical field [0001] The invention relates to the technical field of surface treatment of semiconductor quartz components, in particular to a method for chemically roughening the surface of quartz. Background technique [0002] At present, most of the quartz surface treatment technologies widely used in the semiconductor quartz processing industry are sandblasting or fire polishing. Sand blasting is a method that uses high-speed airflow to carry diamond abrasive grains to hit the quartz surface to make the quartz produce a rough (concave-convex) surface. The blasted quartz surface is roughened to attract and keep deposits attached. Fire polishing is to directly heat the quartz surface with a flame (hydrogen-oxygen flame), and melt the surface to form a transparent state (only for transparent quartz) without deformation. The above two processes utilize physical methods. [0003] However, due to the complex shape of quartz products used in semiconductor production, during...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C15/00
CPCC03C15/00
Inventor 吕辉强
Owner SHENYANG HANKE SEMICON MATERIALS
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