Quartz surface chemical roughening treatment method

Abstract

The invention relates to the technical field of semiconductor quartz part surface treatment, in particular to a quartz surface chemical roughening treatment method, which can effectively reduce consumed time and shorten the surface treatment period of a quartz part for a semiconductor. The method includes the steps of: (1) pretreatment: carrying out surface polishing and annealing treatment on a quartz part needing treatment, and then performing cleaning with deionized water for 5min; (2) preparation of a treatment solution: mixing analytically pure hydrofluoric acid with a solution concentration of 40% and solid analytically pure ammonium fluoride with a solution concentration of 99%, and then adding analytically pure acetic acid with a solution concentration of 99.5% to prepare the treatment solution for standby use; (3) temperature regulation of the treatment solution; (4) reaction treatment: completely immersing the pretreated quartz part in the prepared treatment solution subjected to temperature regulation, and letting a uniform ammonium fluorosilicate attachment gradually form on the surface of the quartz part; (5) flushing; (6) repeating and thickening; and (7) detection ofthe surface roughness.

Description

technical field [0001] The invention relates to the technical field of surface treatment of semiconductor quartz components, in particular to a method for chemically roughening the surface of quartz. Background technique [0002] At present, most of the quartz surface treatment technologies widely used in the semiconductor quartz processing industry are sandblasting or fire polishing. Sand blasting is a method that uses high-speed airflow to carry diamond abrasive grains to hit the quartz surface to make the quartz produce a rough (concave-convex) surface. The blasted quartz surface is roughened to attract and keep deposits attached. Fire polishing is to directly heat the quartz surface with a flame (hydrogen-oxygen flame), and melt the surface to form a transparent state (only for transparent quartz) without deformation. The above two processes utilize physical methods. [0003] However, due to the complex shape of quartz products used in semiconductor production, during...

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Problems solved by technology

[0006] The patent notification number of CN101367618B provides a chemical roughening method for quartz surface. The surface roughness of quartz products treated by this method is more uniform without obvious unevenness, which avoids the occurrence of chemical vapor deposition (CVD) on the quartz surface. Particle phenomenon prevents the generation and shedding of deposited film cracks and prolongs the service life of quartz products. However, in the subsequent production and processing of quartz components for semiconductors, it takes a long time to process the surface of quartz components. long, so its processing cycle is longer