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A kind of processing method of thin plate sapphire wafer

A sapphire wafer, plate-like technology, applied in metal processing equipment, manufacturing tools, grinding machine tools, etc., can solve problems such as poor surface shape, and achieve the effects of reducing waviness, fast processing efficiency, and good surface shape control.

Active Publication Date: 2021-05-25
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the guided mold method is based on the principle of the capillary action of the narrow gap of the mold on the melt, the traction of the capillary action and the extrusion of the mold will cause a large waviness on the surface of the molded wafer, and the surface has a hilly undulating appearance. Poor type

Method used

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  • A kind of processing method of thin plate sapphire wafer
  • A kind of processing method of thin plate sapphire wafer
  • A kind of processing method of thin plate sapphire wafer

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Such as figure 2 Shown, a kind of processing method of thin plate-shaped sapphire wafer has the following steps:

[0067] S1, double-sided free abrasive grinding:

[0068] First, fully mix W20 diamond micropowder and deionized water at a mass ratio of 1:15 to 1:20, and stir continuously with a magnetic stirrer to maintain a suspension state to obtain a grinding liquid; the material of the upper grinding disc and the lower grinding disc is HT250 gray cast iron. The thin plate-shaped sapphire wafer is placed in the planetary wheel groove of the constant pressure double-sided grinding machine, and the grinding liquid is continuously injected by the peristaltic pump and the internal flow channel of the grinding machine. The upper and lower surfaces of the plate-shaped sapphire wafer; the rotation speed of the upper grinding disc is 15r / min, the rotation speed of the lower grinding disc is 30r / min, the grinding pressure is 0.05MPa, the flow rate of the grinding liquid is ...

Embodiment 2

[0077] Such as image 3 Shown, a kind of processing method of thin plate-shaped sapphire wafer has the following steps:

[0078] S1, double-sided free abrasive grinding.

[0079]First, fully mix W20 SiC micropowder and deionized water at a mass ratio of 1:15 to 1:20, and stir continuously with a magnetic stirrer to maintain a suspension state to obtain a grinding liquid; the material of the upper grinding disc and the lower grinding disc is HT200 gray Cast iron; thin plate-shaped sapphire wafers are placed in the star wheel groove of the constant pressure double-sided grinding machine, and the grinding liquid is continuously injected by the peristaltic pump and the internal flow channel of the grinding machine. Flow to the upper and lower surfaces of the thin plate-shaped sapphire wafer; the speed of the upper grinding disc is 10r / min, the rotational speed of the lower grinding disc is 25r / min, the grinding pressure is 0.03MPa, the flow rate of the grinding liquid is controll...

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Abstract

The invention discloses a processing method for a thin plate-shaped sapphire wafer, which is characterized in that it has the following steps: the thin plate-shaped sapphire wafer is ground by double-sided free abrasives, coarsely ground by double-sided consolidated hard abrasive discs, and double-sided consolidated hard abrasives. Fine grinding of abrasive discs and mechanochemical polishing of double-sided solidified soft abrasive discs. The free abrasive double-sided grinding mainly reduces the waviness of the thin plate-shaped sapphire wafer and controls the flatness. The double-sided bonded abrasive disc grinding can increase the grinding pressure, improve the material removal rate, the processing accuracy and surface quality are highly controllable, and the processing efficiency is fast. The mechanical and chemical polishing of consolidated soft abrasive discs can greatly improve the efficiency of wafer grinding and polishing, avoid a large loss of traditional silica sol polishing fluid, reduce costs, and be environmentally friendly. The invention can process and manufacture thin plate-shaped sapphire wafers with high precision, high quality and high efficiency.

Description

technical field [0001] The invention belongs to the technical field of sapphire ultra-precision processing, and mainly relates to a processing method of a thin plate-shaped sapphire wafer. Background technique [0002] Sapphire is a kind of (α-Al 2 o 3 ) alumina crystal, commonly known as corundum, its lattice structure is hexagonal lattice structure. Single crystal sapphire has excellent optical properties and chemical stability, high strength, high hardness, good impact resistance and wear resistance, and is widely used in infrared optical materials, high-intensity laser window materials, high-temperature superconducting thin film wafers and LEDs Substrate material, etc. Compared with other types of crystal materials, single crystal sapphire has slow growth rate, low processing efficiency and high cost, which severely limit the application of sapphire wafers. [0003] Such as figure 1 As shown, the traditional thin plate sapphire wafer is cut to size by diamond multi-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B24B37/08
CPCB24B1/00B24B37/08
Inventor 康仁科高尚李洪钢董志刚朱祥龙牟宇
Owner DALIAN UNIV OF TECH