A method of producing circuit boards for harsh environments

Abstract

The invention discloses a production method of a circuit board used in a severe environment. The method comprises the following steps of cutting, trepanning, copper coating, pattern printing and electroplating; making a bonding layer; making a bonding sheet; making a light plate; then, carrying out windowing treatment on a bonding sheet substrate and a light plate substrate according to a positionof a bonding pad at a plated-through hole and a position of a non-plated-through hole in a circuit diagram; in order to prevent blocking and covering of circuit lines of the bonding sheet substrate and the light plate substrate during overall cooperation, combining and arranging the light plate substrate, the bonding sheet substrate, an upper substrate, the bonding sheet substrate, a bonding layer substrate, the bonding sheet substrate and a lower substrate successively from top to bottom in an assembling process; and using a pressing machine to press. By changing arrangement of a multi-layercomposite substrate, heat dissipation performance and insulation performance of the circuit board under damp and high temperature environments are improved, and meanwhile, an insulation light plate is bonded on a line of a printed board to protect the circuit board and related equipment from being eroded by the environment or a high voltage.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a production method of a circuit board used in harsh environments. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. According to the number of layers, the circuit board is divided into three major types: single-panel, double-panel, and multi-layer circuit board. Classification, at first is single-panel board, and on the most basic PCB, parts are concentrated on one side, and wire is then concentrated on the other side. Because wires only appear on one side, this PCB is called a single-sided circuit board. Single-sided panels are usually simple to make and low in cost, but the disadvantage is that they cannot be applied to too complex products. They are the extension of single-sided panels. ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a production method for circuit boards used in harsh environments. The requirements for improving the environment and life of existing circuit boards are also getting higher and higher. Common printed boards are exposed to chemical, vibration, high Corrosion, softening, deformation, mildew, and breakdown are likely to occur in environments such as dust, salt spray, humidity, and high temperature, resulting in circuit failures. When the current is high, the components cannot withstand the overloaded power and are easy to burn out.