Nickel plating method

Abstract

The invention belongs to the technical field of nickel plating, in particular to a nickel plating method. Nickel plating equipment used in the method comprises a housing, wherein the two ends of a pre-loading barrel communicate with a feeding tube; a plurality of extrusion rods are uniformly arranged on the outer ring of the pre-loading barrel; pushing rods are arranged in through holes; the diameters of the pushing rods are smaller than those of the through holes; the outer rings of the pushing rods are connected to the inner walls of the through holes through springs I; ends of the pushing rods are positioned at joints of the extrusion rods and the pre-loading barrel; the joints are equipped with two boards I; ends of the boards I are connected onto the side walls of the through holes through torsion springs, and the other ends of the boards I cling to each other for separating the through holes from the pre-loading barrel; crystalline grains in the pre-loading barrel indirectly flowout, and are prevented from dropping into a nickel plating solution for being accumulated; and elastic cloth is matched with a high-pressure gas spraying tube which is arranged in an inclined mode, and crystalline grains which drop to positions near a bump flatly spread on the elastic cloth, so that accumulation of the crystalline grains is further prevented, and nickel plating effect of the surfaces of the crystalline grains is promoted.

Description

technical field [0001] The invention belongs to the technical field of nickel plating, in particular to a nickel plating method. Background technique [0002] The fastest growing type of electroless plating; the plating solution generally uses nickel sulfate, nickel acetate, etc. as the main salt, hypophosphite, sodium borohydride, borane, hydrazine, etc. as the reducing agent, and various additives are added. Work in an acidic solution at 90°C or a neutral solution or an alkaline solution close to room temperature; it is divided into two categories according to the use of reducing agents: electroless nickel-phosphorus and electroless nickel-boron; the coating is uniform and durable. Corrosion, hardness, weldability, magnetism, and decoration all show superiority. [0003] Semiconductor wafers have uneven coating before cutting, which is not easy to be found in many cases. Only when the wafer is cut into grains and the tensile test is done on the welded parts after welding ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the existing technology, the problem that the crystal grains are easy to accumulate together during operation because of the small grain size has been solved, the nickel plating solution can only fully react with some grain grains on the surface, and the grains accumulated in the interior react less. The invention provides a nickel plating method

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