A kind of dismantling and debonding method of sapphire wafer and metal parts
A technology for sapphire wafers and metal parts, which is applied in the field of disassembly and degumming of sapphire wafers and metal parts, can solve problems such as inability to use Haval glue to disassemble and degumming, and achieves a solution that reduces the risk of falling off, improves work efficiency, and has high drying efficiency. Effect
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Embodiment 1
[0028] A dismantling and debonding method of a sapphire wafer and a metal part, comprising the steps of:
[0029] Step 1): Place the camera product to be reworked on the special graphite fixture of the hot bending machine, keep the flow rate of nitrogen gas at 130±0.5L / min, and heat at 350°C for 30min to make the Haval glue layer occur Carbonization, at this time, a gap is formed between the sapphire wafer and the metal part.
[0030] Step 2): Soak the camera that has completed step 1) in a container filled with degumming potion, so that the carbonized adhesive layer and ink fall off or dissolve in the degumming potion. The temperature of the degumming potion is 70°C and the degumming time is 60 minutes. , Cooperate with ultrasonic synchronization when degumming.
[0031] Step 3): Place the metal parts that have completed step 2) on the Teflon fixture and put them into a single-slot ultrasonic cleaning basket, add pure water with a resistance of not less than 15MΩ and keep th...
Embodiment 2
[0035] The difference from Example 1 is that the degumming solution used is the PA-3302 type degumming solution purchased from Hunan Lier Electronic Materials Co., Ltd., its pH value is 7 and the specific components include 20% methyl ethyl alcohol base ketone, 10% xylene, 10% N,N-dimethylformamide, 5% acetone and 55% ethanol.
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