Manufacturing process of embedded radar antenna PCB
A technology of radar antenna and manufacturing process, which is suitable for antennas on movable objects, printed circuit manufacturing, and structural forms of radiating elements, etc. It can solve the problem of large line width and line gap tolerance, rough plating on the board surface, and affecting radar performance, etc. problem, to achieve the effect of zero line width and gap tolerance, precise graphics, and avoid dents and copper bumps
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[0069] Example 1
[0070] Anything that uses a non-etching process to make a radar antenna circuit board and embeds it in a PCB substrate or embeds it on a PCB substrate by a laminating method is within the scope of protection of this patent. Radar sensor antenna circuit board (radar sensor includes microwave, millimeter wave, ultrasonic, laser, infrared, camera).
[0071] Since the microstrip feed line and the microstrip copper chip array element are coplanar and can be etched together during processing, it is very convenient to feed the microstrip array unit with the microstrip line. The feeding structure adopts microstrip line to feed the wide side center, and the feed line and the copper pad are on the same plane, such as figure 1 As shown, a slot with a width of Sw is opened on the copper sheet, and the feeder line is extended into the middle of the copper pad for electricity. Sl is the distance between the feeding point and the edge of the copper PAD, and Sw is the slot wid...
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[0072] Example 2
[0073] In order to achieve the best antenna performance, the feeder line width of the microstrip antenna is generally designed with 0.124mm and the distance from the feeder to the slot edge is 0.10mm. Then in order to take into account the 25um copper thickness in the hole during PCB processing, the general surface copper thickness should be at least 38um .
[0074] Because traditional DES and SES etching are affected by the etching temperature, concentration, pH value, etching factor and pool effect, it is difficult to accurately etch the line width and line gap pattern for 0.124mm line width and 0.1mm line gap, which will affect the performance of Laida sensor .
[0075] To this end, this patent studies a new antenna circuit board manufacturing process technology. The millimeter wave radium antenna is made by a method of non-etching embedded circuits, thereby avoiding pattern variation caused by etching factors, uneven line width, and line width. Large gap tole...
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