Manufacturing process of embedded radar antenna PCB

A technology of radar antenna and manufacturing process, which is suitable for antennas on movable objects, printed circuit manufacturing, and structural forms of radiating elements, etc. It can solve the problem of large line width and line gap tolerance, rough plating on the board surface, and affecting radar performance, etc. problem, to achieve the effect of zero line width and gap tolerance, precise graphics, and avoid dents and copper bumps

Inactive Publication Date: 2020-01-07
GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The circuit pattern is plated on the surface of the PCB, which is higher than the surface of the PCB, and it is easy to scratch and touch, resulting in dents and pollution on the board surface, resulting in rough plating on the board surface
F

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing process of embedded radar antenna PCB

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0069] Example 1

[0070] Anything that uses a non-etching process to make a radar antenna circuit board and embeds it in a PCB substrate or embeds it on a PCB substrate by a laminating method is within the scope of protection of this patent. Radar sensor antenna circuit board (radar sensor includes microwave, millimeter wave, ultrasonic, laser, infrared, camera).

[0071] Since the microstrip feed line and the microstrip copper chip array element are coplanar and can be etched together during processing, it is very convenient to feed the microstrip array unit with the microstrip line. The feeding structure adopts microstrip line to feed the wide side center, and the feed line and the copper pad are on the same plane, such as figure 1 As shown, a slot with a width of Sw is opened on the copper sheet, and the feeder line is extended into the middle of the copper pad for electricity. Sl is the distance between the feeding point and the edge of the copper PAD, and Sw is the slot wid...

Example Embodiment

[0072] Example 2

[0073] In order to achieve the best antenna performance, the feeder line width of the microstrip antenna is generally designed with 0.124mm and the distance from the feeder to the slot edge is 0.10mm. Then in order to take into account the 25um copper thickness in the hole during PCB processing, the general surface copper thickness should be at least 38um .

[0074] Because traditional DES and SES etching are affected by the etching temperature, concentration, pH value, etching factor and pool effect, it is difficult to accurately etch the line width and line gap pattern for 0.124mm line width and 0.1mm line gap, which will affect the performance of Laida sensor .

[0075] To this end, this patent studies a new antenna circuit board manufacturing process technology. The millimeter wave radium antenna is made by a method of non-etching embedded circuits, thereby avoiding pattern variation caused by etching factors, uneven line width, and line width. Large gap tole...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a manufacturing process of an embedded radar antenna PCB. The manufacturing process sequentially comprises the steps: A, preliminary pattern electroplating; B, dry film removing; and C, embedded antenna manufacturing. According to a traditional millimeter wave radar antenna circuit board, an antenna pattern is obtained through outer-layer pattern transfer, pattern electroplating and outer-layer wet etching. The radar antenna circuit board is manufactured through a non-etching method; an antenna is directly electroplated on a copper-foil-loaded substrate through pattern electroplating; and then, the antenna is embedded into a PCB through lamination. The process has the advantages of accurate pattern, zero line width and line gap tolerance and zero undercut; and sincethe antenna is embedded in the PCB, dents and copper nodules caused by scratching and pollution in the outer layer machining process are avoided, and the performance and the yield of the PCB are improved.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a PCB manufacturing process for an embedded radar antenna. Background technique [0002] Due to the continuous improvement of automobile safety standards and the level of automobile electronics in various countries around the world, as well as the growing demand for driving safety, the Advanced Driver Assistance System (ADAS) with active safety technology is showing a momentum of rapid development. Sensor technology is one of the key core technologies of automotive electronics. The innovative development of various sensor technologies provides technical feasibility for active safety. Automotive microwave / millimeter wave radar sensors are one of the core components to realize this function. Microwave / millimeter-wave radar uses the target's reflection of electromagnetic waves to find the target and determine its position. The millimeter wave frequency is high and the wavelength is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/18H05K3/06H01Q1/32H01Q1/38
CPCH01Q1/32H01Q1/38H05K3/06H05K3/18H05K2203/052
Inventor 周国新陈伟唐兵英
Owner GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products