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A kind of white opaque polyimide film and preparation method thereof

A technology of transparent polyimide and polyamic acid, applied in the field of polymer materials, can solve the problems of the influence of polyimide mechanical properties, increase cost, etc., and achieve the effect of improving opacity and improving mechanical properties

Active Publication Date: 2021-09-28
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent 201510375731.9 and Chinese patent 201110214091.5 provide a method for preparing white polyimide by filling white fillers, but the former does not explain the whiteness and light transmittance of the obtained film, and the minimum light transmittance of the latter can only be It is guaranteed to be below 5%, and a catalyst is added during the process. The removal of the catalyst increases the cost of the process. In addition, the addition of fillers will affect the mechanical properties of polyimide

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Add 11.8714 g of 2,6-diamino-3-cyano-4-methylpyridine and 100 mL of N,N-dimethylethyl Amide (DMAC), stirred at 20~25°C for half an hour until completely dissolved, lowered the system temperature to 15°C, added 3.8202g 4,4-hexafluoroisopropylphthalic anhydride, 2.5301g 3,3' , 4,4'-biphenyltetracarboxylic dianhydride and 15mL DMAC, continue to react for 1h. Lower the system temperature to 8°C, continue to add 3.8202g of 4,4-hexafluoroisopropylphthalic anhydride, 2.5301g of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 15mL of DMAC to continue the reaction 1h. Maintain the system temperature at 8°C, add the remaining 3.8202g 4,4-hexafluoroisopropylphthalic anhydride, 2.5301g 3,3',4,4'-biphenyltetracarboxylic dianhydride and an appropriate amount of DMAC, continue After reacting for 35 hours, a viscous polyamic acid solution was obtained with an apparent viscosity of 14000 cP.

[0024] (2) Stir 0.3g of 3-phenoxy-7-dimethylamino-2-carbonylquinoline ultrasonically ...

Embodiment 2

[0027] (1) Add 3.7907 g of 2,6-diamino-3-cyano-4-methylpyridine and 35 mL of N,N-dimethylethyl Amide (DMAC), stirred at 20~25°C for half an hour until completely dissolved, lowered the system temperature to 15°C, added 1.7078g 4,4-hexafluoroisopropylphthalic anhydride, 0.4847g 3,3' , 4,4'-biphenyltetracarboxylic dianhydride and 5mL DMAC, continue to react for 1h. Lower the system temperature to 8°C, continue to add 1.7078g 4,4-hexafluoroisopropylphthalic anhydride, 0.4847g 3,3',4,4'-biphenyltetracarboxylic dianhydride and 5mL DMAC, continue Reaction 1h. Maintain the system temperature at 8°C, add the remaining 1.7078g 4,4-hexafluoroisopropylphthalic anhydride, 0.4847g 3,3',4,4'-biphenyltetracarboxylic dianhydride and an appropriate amount of DMAC, continue After reacting for 40 hours, a viscous polyamic acid solution was obtained with an apparent viscosity of 10000 cP.

[0028] (2) Ultrasonically stir 0.6g of 3-phenoxy-7-dimethylamino-2-carbonylquinoline in 5mL of DMAC solv...

Embodiment 3

[0031](1) Add 8.3202 g of 2,6-diamino-3-cyano-4-methylpyridine and 70 mL of N,N-dimethylethyl Amide (DMAC), stirred at 20~25°C for half an hour until completely dissolved, lowered the system temperature to 15°C, added 1.5907g 4,4-hexafluoroisopropylphthalic anhydride, 2.4582g 3,3' , 4,4'-biphenyltetracarboxylic dianhydride and 10mL DMAC, continue to react for 1h. Lower the system temperature to 8°C, continue to add 1.5907g of 4,4-hexafluoroisopropylphthalic anhydride, 2.4582g of 3,3',4,4'-biphenyltetracarboxylic dianhydride and 10mL of DMAC to continue the reaction 1h. Maintain the system temperature at 8°C, add the remaining 1.5907g 4,4-hexafluoroisopropylphthalic anhydride, 2.4582g 3,3',4,4'-biphenyltetracarboxylic dianhydride and an appropriate amount of DMAC, continue After reacting for 40 hours, a viscous polyamic acid solution was obtained with an apparent viscosity of 16000 cP.

[0032] (2) Ultrasonically stir 0.9g of 3-phenoxy-7-dimethylamino-2-carbonylquinoline in ...

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Abstract

The invention discloses a white opaque polyimide film and a preparation method thereof. A solution of 3-phenoxy-7-dimethylamino-2-carbonylquinoline and a polyamic acid solution are evenly mixed and subjected to defoaming treatment. The cast coating method is used to coat the film, and then vacuum removes the solvent, imidizes, and releases the film to obtain a white polyimide film with excellent whiteness, opacity, mechanical properties and heat resistance. The whiteness of the polyimide film can be higher than 85, the optical transmittance is lower than 1%, the decomposition temperature is higher than 553°C, and the tensile strength is higher than 232 MPa, which can improve the performance of existing liquid crystal displays, light-emitting diodes and electronic circuits. The comprehensive performance of the devices used in the protection and other fields.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a high-strength white opaque polyimide film and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] As a class of polymers with excellent comprehensive properties, polyimide is widely used in aerospace, microelectronics industry and other fields due to its outstanding properties such as heat resistance, mechanical properties, and dielectric properties. In the production process of flexible printed circuit board substrates, that is, flexible copper clad laminates, it is the preferred insulating substrate. In recent years, opaque polyimide films, especially white opaque polyimide films, have been used in LED packaging, protection of circuit technical information, and prevention of incident light in optical devices. Most of the traditional PI films are brown or yellow, and have high light transmittance, which makes it difficult to pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K5/3437C08J5/18
CPCC08J5/18C08J2379/08C08K5/3437
Inventor 许可心叶志凤徐勇张盈盈
Owner NANJING UNIV OF SCI & TECH