Rolled aluminum-copper composite board with high peeling strength and preparation method of composite board

A technology of aluminum-copper composite board and rolling composite, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the influence of aluminum-copper composite board interface shear strength and peel strength, copper strip heating temperature Impossible to be very high, oxidation coloring temperature is low, etc., to achieve the effect of improving peel strength, reducing deformation resistance, and simplifying production steps

Inactive Publication Date: 2020-02-07
JIANGSU RUNBANG NEW MATERIAL GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with extrusion-drawing method and explosive composite method, this method has simple process and high degree of mechanization: the disadvantage is that the heating temperature of copper strip cannot be very high due to the low oxidation and coloring temperature of copper (180°C), which limits The compound effect brought by heating before rolling has a certain influence on the shear strength and peel strength of the aluminum-copper composite plate interface.

Method used

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  • Rolled aluminum-copper composite board with high peeling strength and preparation method of composite board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Raw material preparation: first cut the industrial 1060 pure aluminum plate with a thickness of 5mm and the industrial TU2 pure copper plate with a thickness of 40mm into aluminum and copper raw material plates with a width of 400mm and a length of 2400mm, and then cut the two raw material plates Carry out annealing treatment, the temperature is 350 ℃ and 300 ℃ respectively, and the holding time is 45min and 30min respectively, and then take out and polish the surface to be combined to remove the surface oxide;

[0026] (2) Rolling and compounding: heat the surface-treated 1060 pure aluminum plate in a heat treatment furnace at a heating temperature of 280°C, take it out after 30 minutes of heat preservation, and roll and compound it with a TU2 pure copper plate at room temperature to form an aluminum-copper composite plate;

[0027] (3) Post-rolling annealing: put the rolled and composited aluminum-copper composite plate into an annealing furnace for annealing, the ...

Embodiment 2

[0029] (1) Raw material preparation: first cut the 10mm thick 6061 aluminum alloy plate and the 80mm thick industrial TU2 pure copper plate into aluminum and copper raw material plates with a width of 600mm and a length of 3000mm, and then cut the two raw material plates Annealing treatment, the temperature is 350°C and 300°C, and the holding time is 45min and 30min respectively, and then take out and polish the surface of the two to be combined to remove the surface oxide;

[0030] (2) Rolling and compounding: heat the surface-treated 6061 aluminum alloy plate in a heat treatment furnace at a temperature of 300°C, take it out after 30 minutes of heat preservation, and roll and compound it with a TU2 pure copper plate at room temperature to form an aluminum-copper composite plate ;

[0031] (3) Post-rolling annealing: Put the rolled and composited aluminum-copper composite plate into an annealing furnace for annealing. The annealing temperature is 210°C, and the temperature is...

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Abstract

The invention discloses a rolled aluminum-copper composite board with high peeling strength and a preparation method of the composite board. The method comprises the three steps of raw material preparation, rolling-bonding and after-rolling annealing, wherein according to raw material preparation, firstly, an aluminum board and a copper board are subjected to annealing treatment under the temperature of 350 DEG C and 300 DEG C respectively for 45min and 30min respectively, then the two boards are taken out, and to-be-bonded surfaces of the two boards are subjected to polishing treatment; according to rolling-bonding, the aluminum board subjected to surface treatment is maintained under the temperature of 280-300 DEG C for 30min and then is taken out to be rolled-bonded with the copper board to form an aluminum-copper composite board; and according to after-rolling annealing, the aluminum-copper composite board obtained after rolling-bonding is placed in an annealing furnace for annealing under the annealing temperature of 200-210 DEG C for 20min, so that a layer of aluminum-copper intermetallic compounds with the thickness of 3 microns is formed at an interface between an aluminumlayer and a copper. The aluminum-copper composite board prepared through the preparation method has high peeling strength and bending strength; and in the rolling process, it is needless to control afurnace atmosphere, so that the production steps are reduced, and production efficiency is improved.

Description

technical field [0001] The invention relates to a rolled aluminum-copper composite plate and a preparation method thereof, in particular to a rolled aluminum-copper composite plate with high peel strength and a preparation method thereof. Background technique [0002] With the continuous development and progress of science and technology, people have higher and higher requirements on the performance of materials, and single component materials can no longer meet the harsh use environment. For example, in the process of large-scale industrial production, on the one hand, it is necessary to consider reducing the use of precious metals to save costs; on the other hand, it is necessary to ensure that the performance of materials meets actual needs. [0003] Aluminum and copper, as two metals with good electrical and thermal conductivity, are widely used in thermoelectric transmission, electronic communication and other projects. However, copper resources on the earth are relati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B38/00
CPCB32B37/06B32B37/10B32B38/00
Inventor 周杰史和生杨文芬
Owner JIANGSU RUNBANG NEW MATERIAL GRP CO LTD
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