A kind of preparation method of ultra-thin heat pipe

An ultra-thin heat pipe and heat pipe technology, applied in the field of heat pipes, can solve the problems of not being suitable for mass production or effective application, difficult to process liquid absorbing cores, low manufacturing efficiency, etc., achieving good infiltration and reflux characteristics, and increasing apparent specific area. , to achieve the effect of automated production

Active Publication Date: 2021-04-20
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] ①Low surface strength, prone to cracks or microstructure shedding;
[0006] ②The process is more complicated and the manufacturing cost is higher;
[0007] ③ Low manufacturing efficiency, not suitable for mass production or effective application;
[0008] ④ Poor process flexibility, it is difficult to process liquid-absorbent cores with different thickness requirements or the relationship between processing parameters and processing surface quality cannot be well controlled
However, there is no report on the use of electroforming technology to manufacture high-performance ultra-thin heat pipes

Method used

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  • A kind of preparation method of ultra-thin heat pipe
  • A kind of preparation method of ultra-thin heat pipe
  • A kind of preparation method of ultra-thin heat pipe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of ultra-thin copper heat pipe with a thickness of 0.2mm:

[0045]Step (1): 1. select heat pipe 1 material to be copper, design heat pipe 1 as (such as figure 1 Shown) the shape shown, its size is 100×100×0.2mm ( figure 1 Middle A-A);

[0046] ②According to the material, size and surface profile of heat pipe 1, select the mold electrode to be processed as titanium alloy, and the surface profile diameter is Φ200mm. figure 2 As shown) a rectangular area with an area of ​​120×120mm is drawn in the outline as the outline structure processing area;

[0047] ③ According to the designed inner surface structure of the heat pipe 1, the surface microstructure of the mold electrode 2 is designed to be microgrooves with a width of 60 μm, a depth of 30 μm, and an interval of 60 μm.

[0048] ④According to step ②, the titanium rod is processed into a Φ200×300mm block electrode by machining technology, and the Φ200mm surface is the electrode processing surface;

[0049...

Embodiment 2

[0056] Prepare an ultra-thin nickel heat pipe with a thickness of 0.2mm. The preparation method is the same as in Example 1, except that 350g of nickel sulfamate, 10g of nickel chloride, 35g of boric acid and deionized water are completely mixed to prepare a 1000mL electric tube. Cast salt solution.

[0057] The process in the present invention can use different electrodes and electroforming solutions to prepare heat pipes of different materials such as iron and nickel on the same equipment, and the process has strong flexibility.

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Abstract

The invention discloses a preparation method of an ultra-thin heat pipe, which comprises the following steps: (1): designing a heat pipe, and preparing a mold electrode having the same structure as the inside of the metal heat pipe; (2): adding heat-dissipating powder into the electroforming salt solution Stir evenly to obtain the electroforming liquid; (3): Clamp the mold electrode on the electrolytic cell, pour the electroforming liquid into the electrolytic cell, set the electroforming parameters and use the three-electrode power supply for electroforming processing to obtain the electroforming layer Step (4): The electroforming layer is removed and cleaned, dried, etched to obtain a metal film with the same microstructure as the mold electrode shape and size; (5): the metal film is folded and welded along the edge to obtain A heat pipe with a welding gap; step (6): shaping the pressure of the heat pipe, and evacuating the inner cavity of the heat pipe from the welding gap, filling the working liquid after vacuuming, and sealing the welding gap to obtain an ultra-thin heat pipe. The preparation method of the invention can flexibly control the thickness of the ultra-thin heat pipe.

Description

technical field [0001] The invention relates to the technical field of heat pipes, in particular to a preparation method of ultra-thin heat pipes. Background technique [0002] In actual production applications, heat pipes with an overall thickness of less than 2mm are collectively referred to as ultra-thin heat pipes, including one-dimensional heat pipes and vapor chambers. At present, ultra-thin heat pipes have been widely used in mobile electronic devices such as smartphones, tablets, laptops and smart watches. In recent years, due to the rapid development of the mobile Internet field, people's demand for mobile smart devices such as smartphones and tablet computers has increased sharply, and at the same time new requirements have been put forward for the performance and portability of mobile devices, which has accelerated its transition to high-performance With the development of thinner and thinner, a series of heat dissipation problems have also arisen. The ultra-thi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04
CPCF28D15/0283F28D15/04F28D15/046
Inventor 赵航伍春霞伍晓宇唐恒徐斌朱立宽高畅萧永昌
Owner SHENZHEN UNIV
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