Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electrochemical polishing method for surface of copper material

An electrochemical and polishing solution technology, applied in the field of electrochemical polishing, can solve the problems of generating tiny burrs, affecting the transmission loss of vacuum electronic devices, gain output power and stability, poor surface roughness, etc., and achieve the effect of preventing corrosion.

Active Publication Date: 2020-02-28
NANJING SANLE GROUP
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, in order to ensure the transmission loss, gain, output power and stability of vacuum electronic devices, the surface roughness of the parts is required to reach Ra0. Oxygen-free copper, soft, relatively poor surface roughness after processing, can only reach Ra0.4μm, and there will be tiny burrs on the corners and edges
If not treated, it will affect the transmission loss, gain, output power and stability of vacuum electronic devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrochemical polishing method for surface of copper material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Step (1): Prepare a polishing solution with a total volume of 1L, including:

[0021] (a) take by weighing 50ml phosphoric acid, 80ml glycerol import in corrosion-resistant container, add the water of 2 / 3L, stir and dissolve to obtain the first intermediate solution;

[0022] (b) Weigh 2g thiourea and join in the first intermediate solution, stir and dissolve to obtain the second intermediate solution;

[0023] (c) Measure 0.5ml of polyoxyethylene alkanolamide and add it into the second intermediate solution, add water to 1L, and stir evenly to obtain a polishing solution.

[0024] Step (2): immerse the copper material to be polished in the polishing solution, turn on the power and perform polishing at room temperature. The current density of the turned on power supply is 5A / dm 2 , the duty cycle is 5%, and the polishing time is 15s.

[0025] Step (3): Turn off the power, take out the copper material, rinse it, dehydrate it with ethanol, and dry it in a dryer.

Embodiment 2

[0027] Different from Example 1, in step (1), the component contents of each solute are respectively:

[0028] Phosphoric acid: 55ml

[0029] Glycerol: 90ml

[0030] Thiourea: 2.5g

[0031] Polyoxyethylene alkanolamide: 0.6ml

[0032] In step (2), the current density of the turned on power supply is 5.5A / dm 2 , the duty cycle is 10%, and the polishing time is 17s.

Embodiment 3

[0034] Different from Example 2, in step (1), the components of each solute are respectively:

[0035] Phosphoric acid: 60ml

[0036] Glycerol: 100ml

[0037] Thiourea: 3g

[0038] Polyoxyethylene alkanolamide: 0.8ml

[0039] In step (2), the current density of the turned on power supply is 6A / dm 2 , the duty cycle is 15%, and the polishing time is 20s.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Roughnessaaaaaaaaaa
Login to View More

Abstract

The invention relates to an electrochemical polishing method for a surface of a copper material. The electrochemical polishing method comprises the following step of preparing a polishing solution; and switching on a power supply to polish after a to-be-polished copper material is immersed into the polishing solution, wherein the step of preparing the polishing solution comprises the following steps of calculating the dosages of solutes according to the total volume of the to-be-prepared solution, the solutes comprising phosphoric acid, glycerin, thiourea and polyoxyethylene alkanolamide; weighing phosphoric acid and glycerin according to the calculating result and importing the same into a corrosion-resistant container, adding water to the total volume, and stirring and dissolving the mixture to obtain a first intermediate solution; weighing thiourea according to the calculating result and adding the thiourea into the first intermediate solution, and stirring and dissolving the mixture to obtain a second intermediate solution; and weighing polyoxyethylene alkanolamide according to the calculating result and adding the polyoxyethylene alkanolamide into the second intermediate solution, and uniformly stirring the mixture to obtain the polishing solution. According to the electrochemical polishing method, the surface roughness of a copper precision part can be increased from Ra0.4 [mu]m to Ra0.2 [mu], so that the using demand on a vacuum electronic apparatus is met.

Description

technical field [0001] The invention relates to an electrochemical polishing method, in particular to an electrochemical polishing method for the surface of a copper material. [0002] technical background [0003] Copper materials are widely used in vacuum electronic devices due to their excellent high electrical conductivity and low loss performance, but for some high-precision parts, the key parts of the slow wave system - micro high frequency cavity and L-band The connecting ring of the traveling wave tube is represented. Generally speaking, in order to ensure the transmission loss, gain, output power and stability of vacuum electronic devices, the surface roughness of the parts is required to reach Ra0. It is oxygen-free copper, soft in quality, and the surface roughness after processing is relatively poor, only reaching Ra0.4μm, and there will be tiny burrs on the corners and edges. If it is not treated, it will affect the transmission loss, gain, output power and sta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25F3/22
CPCC25F3/22
Inventor 刘洋董笑瑜梁田吴亚琴成红霞唐中华吕婧
Owner NANJING SANLE GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com