CPU top cover

Abstract

The invention provides a CPU top cover. Sunken grooves surrounding a cover body are formed in the top face, making contact with a radiator, of the cover body. The sunken grooves are formed in a squareshape or an O shape; and when the number of the sunken grooves is two or more, the surrounding size of the sunken grooves is reduced step by step, and the sunken grooves are concentrically arranged on the surface of the cover body in a sleeving mode. According to the invention, the leakage of liquid metal can be thoroughly avoided, the volatilization and oxidation of the liquid metal can be effectively prevented, and the service life is greatly prolonged; loss caused by liquid metal leakage to a user is effectively eradicated; meanwhile, the applying amount of silicone grease for protection is reduced, thereby facilitating later cleaning and maintenance; and a sealing gasket ring can be used for assisting in improving the sealing performance.

Description

technical field [0001] The invention relates to the field of CPUs, in particular to a CPU top cover. Background technique [0002] The central processing unit (CPU) is one of the main devices of an electronic computer and the core component of a computer. Its function is mainly to interpret computer instructions and process data in computer software. The CPU is the core component in a computer responsible for reading instructions, decoding them, and executing them. The central processing unit mainly includes two parts, namely the controller and the arithmetic unit, which also include the cache memory and the data and control bus that realize the connection between them. The three core components of an electronic computer are the CPU, internal memory, and input / output devices. The function of the central processing unit is mainly to process instructions, perform operations, control time, and process data. [0003] Among them, the performance of the CPU produced by the wor...

AI Technical Summary

Problems solved by technology

[0003] Among them, the performance of the CPU produced by the world's two major CPU industry giants Intel (toothpaste factory) and AMD is constantly improving, and the heat generation of the CPU is also increasing. Although the current 7-nanometer production process can effectively reduce the heat generation, its high Frequency and multi-core flagship CPUs still generate a lot of heat under overclocking conditions, which also puts forward requirements on the cooling effect of radiators. Therefore, boxed flagship CPUs with K generally do not come with original radiators (because cannot meet the heat dissipation requirements, and consider the cost), users need to purchase by themselves; the existing radiator cooling methods are divided into two types, namely air cooling and water cooling, for CPUs with large heat generation, general users will choose top-level air cooling or water cooling for heat dissipation However, no matter how good the heat dissipation effect of the radiator is, the heat dissipated by the CPU chip needs to go through the following process from generation to dissipation: chip→silicon grease (brazing)→CPU top cover→silicon grease→air-cooled / water-cooled radiator base , The CPU top cover and radiator base are generally made of copper with good thermal conductivity, but between the chip and the CPU top cover, between the CPU top cover and the radiator base, it is still necessary to use silicone grease to fill the gap to transfer heat, although Intel AMD and AMD have used brazing between the chip and the CPU top cover instead of silicone grease to achieve more efficient heat transfer, but between the CPU top cover and the base of the air-cooled / water-cooled radiator is still filled with silicone grease for heat conduction. host

[0004] The thermal conductivity of silicone grease is generally 6w / m.k, and the highest on the market is 13.5 w / m.k; the thermal conductivity of silicone grease greatly affects the heat dissipation performance of the CPU, so a new type of thermal conductivity material (liquid gold) has been produced. Gold, also known as gallium-based alloy, is a silver-colored metallic paste. Its state is similar to mercury at room temperature. Its thermal conductivity is excellent. The label can reach 128w / m.k. The thermal conductivity is close to 20 times that of thermal grease. After the liquid gold is filled between the cover and the radiator base, the temperature in the overclocking state can be reduced by 20 degrees compared with ordinary silicone grease, and the heat dissipation effect is significantly improved. However, there are certain risks in using liquid gold as the heat conduction medium. Conductivity, if the filling is too much or the protective measures are not done well, it is easy to cause liquid gold to leak and flow to the CPU socket or the electrical components of the motherboard. Coat a large amount of silicone grease around the CPU for protection, and when the radiator base is pressed tightly on the CPU top cover, it can block the leakage of liquid gold in time, but this will cause a large amount of silicone grease to adhere to the CPU top cover and even the CPU socket. On the CPU buckle, it will become extremely troublesome to replace or maintain and upgrade the CPU in the later stage; in view of the current development trend with higher and higher CPU frequency and more and more cores, silicone grease will eventually face the doom of being eliminated. Liquid metal heat dissipation will gradually be put on the agenda and will be recognized by Intel and AMD to replace silicon grease heat dissipation and become a brand-new installed heat conduction material in the new century. Therefore, liquid metal leakage prevention is bound to become a new problem.

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