Composite cooling water disc and manufacturing method and application thereof

Abstract

The invention provides a composite cooling water disc. The problem that an existing cooling water disc is low in heat transfer coefficient is solved by arranging the aluminum shell and the copper layer wrapped in the aluminum shell, copper is completely wrapped in the aluminum shell, it can be guaranteed that copper metal cannot leak out. The composite cooling water disc is applied to the field ofsemiconductors, and the stability of chip manufacturing can be guaranteed. The invention further provides a manufacturing method of the cooling water disc. Firstly, a copper layer is welded in an aluminum shell through hot isostatic pressing to obtain a welded assembly. After the assembly is machined out of the water tank, the assembly and the upper aluminum layer are combined and subjected to vacuum diffusion welding to obtain the cooling water disc, the copper layer is completely wrapped in the aluminum shell, the water tank cannot be blocked, and the manufactured cooling water disc is highin cooling efficiency and has high industrial application value.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a composite cooling water pan and a manufacturing method and application thereof. Background technique [0002] In the semiconductor chip manufacturing process, temperature control is a very important task. Temperature not only plays an important role in the process of wafer production, but also "plays waste heat" on the performance of devices on the wafer after the related process is completed. For example, for a wafer that has just been removed from a high-temperature process chamber such as a dry etching chamber, a vapor deposition chamber, or a furnace chamber, due to the different device densities distributed on the wafer, the temperature at various places on the surface of the wafer appears to be different. If the temperature difference is not resolved in time and the wafer is naturally exposed to the atmospheric environment, the surface of the wafer may ca...

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Problems solved by technology

[0003] CN109817544A discloses a semiconductor equipment heating and cooling composite tray device, which improves the processing and cooling efficiency of wafers by reducing the transfer path of wafers between the heating zone and the cooling zone, but the structure of the device is complex, and the cooling zone The heat transfer coefficient is still high

[0004] CN202205717U discloses a wafer cooling device, which blows gas to the wafer through an additional gas injection element, which not only avoids residual moisture on the surface of the wafer after cooling, but also reduces the cooling time of the wafer and improves the wafer cooling performance. Cooling efficiency, but the heat transfer coefficient of the gas injection method is still low, and the energy consumption is high

[0005] CN208738190U discloses a kind of wafer cooling chamber, by adopting a plurality of driving devices to transport wafers to the cooling chamber respectively, thereby avoiding the problem of uneven heat dissipation between wafers, but the heat transfer coefficient of the device does not improve

[0006] To sum up, at present, people have not thought of improving the cooling efficiency by improving the material of the cooling water plate. This is because the material for making the cooling plate is generally aluminum alloy. If the cooling device in semiconductor equipment is generally made of copper, although the thermal conductivity of copper The coefficient is 1.5 times that of aluminum, and the cooling capacity will be greatly improved. However, in semiconductor equipment, copper cannot be exposed outside, otherwise copper ions will leak and the wafer will be scrapped.

[0007] Therefore, it is necessary to develop a cooling water tray with a high heat transfer coefficient and a manufacturing method thereof, so that copper ion leakage does not occur while solving the problem of low heat transfer coefficient of the cooling water tray

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