Anisotropic conductive adhesive and preparation method thereof

An anisotropic, conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of high material cost and high processing cost, and achieve improved application range, strong bonding strength, and low contact The effect of resistance

Pending Publication Date: 2020-04-07
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention proposes an anisotropic conductive adhesive to solve the problems of expensive material cost and processing cost in the prior art

Method used

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  • Anisotropic conductive adhesive and preparation method thereof
  • Anisotropic conductive adhesive and preparation method thereof
  • Anisotropic conductive adhesive and preparation method thereof

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Effect test

preparation example Construction

[0030] The present invention also discloses a preparation method for the above-mentioned anisotropic conductive adhesive, which can be used to prepare the anisotropic conductive adhesive in the embodiment of the present invention. The preparation method includes:

[0031] Step a. preparing low-melting-point metal conductive particles of 0.5-100 microns;

[0032] Wherein, the low melting point metal conductive particles are in the state of metal droplets or metal powder;

[0033] Step b. Stir and mix the curable resin and the low-melting-point metal conductive particles according to a certain mass ratio for 0.1-10 hours to form a uniformly mixed liquid to form a thermosetting anisotropic conductive adhesive.

[0034] Wherein, the method of preparing low-melting-point metal conductive particles in step a can adopt traditional micronization processing technology, and can also adopt the following methods:

[0035] Step a1. Put a certain mass of molten metal with a low melting poi...

Embodiment 1

[0070] Embodiment 1: A heat-cured anisotropic conductive adhesive, the proportion of each component is as follows:

[0071]

[0072] The preparation process of the anisotropic conductive adhesive is as follows:

[0073] a. Stir the liquid metal Ga79In21 (melting point 16° C.) in absolute ethanol at a speed of 1000 r / min for 2 hours by using the liquid phase stirring method to obtain liquid metal conductive droplets with an average particle size of about 80 microns;

[0074] b. Mix all materials except liquid metal conductive particles according to the formula, and stir at a speed of 800r / min for 0.2h;

[0075] c. Mix the liquid metal conductive droplets obtained in step a with the mixture obtained in step b in proportion, and stir at a speed of 800r / min for 0.5h to obtain a mixed solution in which the metal conductive droplets are uniformly dispersed.

[0076] Using the above-mentioned mixed solution as the interconnection material, the flip chip (0.6×0.6mm2, RFID UHF Chip...

Embodiment 2

[0077] Embodiment 2: a kind of anisotropic conductive glue, each component distribution ratio (mass) is as follows:

[0078]

[0079] The preparation process of the anisotropic conductive adhesive is as follows:

[0080] a. Ultrasonic treatment of liquid metal (Ga67In20Zn13, melting point 11° C.) in isopropanol for 0.5 h by ultrasonic dispersion method to obtain liquid metal conductive droplets with an average particle size of about 2 microns;

[0081] b. Mix all materials except liquid metal conductive particles according to the formula, and stir for 1 hour at a speed of 800r / min;

[0082] c. Mix the liquid metal conductive droplets obtained in step a with the mixture obtained in step b in proportion, and stir at a speed of 800r / min for 0.5h to obtain a mixed solution in which the metal conductive droplets are uniformly dispersed.

[0083] Use the mixed solution prepared above as the interconnection material, and mount the flip chip (0.6×0.6mm2, RFID UHF Chip) on Al / coated ...

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Abstract

The invention provides an anisotropic conductive adhesive and a preparation method thereof. According to the invention, low-melting-point metal is used as conductive particles of the anisotropic conductive adhesive, so high conductivity and low cost of the conductive adhesive can be ensured; by selecting curable resin and a curing agent, the anisotropic conductive adhesive can be quickly cured atroom temperature and can be used on various substrates with poor temperature resistance, so the application range of the anisotropic conductive adhesive is widened, and the mounting production efficiency of electronic product components can be remarkably improved; and the anisotropic conductive adhesive with the low-melting-point metal as the conductive particles has relatively low contact resistance, relatively high bonding strength and excellent damp-heat resistance stability when applied to various substrates.

Description

technical field [0001] The invention relates to the field of conductive materials, in particular to an anisotropic conductive adhesive and a preparation method thereof. Background technique [0002] Anisotropic conductive adhesive film is a polymer-based microelectronic interconnection material that only conducts electricity in the vertical direction and does not conduct electricity in the horizontal direction. Anisotropic conductive adhesives are widely used in electronic products such as flexible printed circuit boards and RFID tags. They play the role of electrical connection and mechanical fixation of semiconductor components and components, so as to keep the opposite electrodes connected to each other and the adjacent electrodes insulated from each other. Anisotropic conductive adhesives are usually composed of conductive fillers, curable resins, curing agents, diluents and other components. The conductive fillers are evenly dispersed in the curable resin. After the res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J133/00C09J163/10C09J4/02C09J161/06
CPCC09J4/00C09J9/02C09J133/00C09J161/06C09J163/00C09J163/10C08K3/08
Inventor 朱唐李亿东梁赟
Owner BEIJING DREAM INK TECH CO LTD
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