Thermosetting epoxy resin composition as well as prepreg, laminated board and printed circuit board thereof

Abstract

The invention provides a thermosetting epoxy resin composition, and a prepreg, a laminated board and a printed wiring board using the same. The thermosetting epoxy resin composition is prepared from the following components in parts by weight: 2 to 10 parts of phosphorus-containing anhydride, 5 to 40 parts of phosphorus-free anhydride, 5 to 45 parts of epoxy resin, 40 to 70 parts of a filler, and0 to 15 parts of a phosphorus-containing flame retardant, wherein the total parts by weight of the components is 100 parts. The phosphorus-containing anhydride has a structure as shown in a formula Ior a formula II; wherein the epoxy resin is selected from one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin and biphenyl epoxy resin. After being cured, the thermosetting epoxy resin composition provided by the invention also has good heat discoloration resistance and dimensional stability while ensuring V0-grade flame retardancy, and can be used for preparing printed circuit board base materials in the field of LEDs.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thermosetting epoxy resin composition and prepregs, laminates and printed circuit boards using the composition. Background technique [0002] In recent years, optical semiconductors represented by LEDs have been used in display applications, mobile devices, mobile phone lamp backlights, sensors, and automotive parts. With the improvement of LED power and brightness, laminates / metal foil clad laminates used in printed circuit boards for LED installation are required to have excellent light resistance, especially high whiteness after high temperature. In addition, as people pay more and more attention to the environment and the promotion of lead-free reflow soldering process, in order to ensure the stability of the installation, the flame retardancy and dimensional stability of the laminate / metal-clad laminate are also increasingly stringent requirement...

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Problems solved by technology

[0003] CN 109181604A uses bisphenol A / bisphenol F epoxy resin, methyltetrahydrophthalic anhydride or nadic anhydride, catalyst to obtain highly transparent epoxy resin glue, but this combination is not flame retardant and is not used for prepreg and laminate

[0004] CN 108641650A discloses the use of bisphenol F epoxy, carboxyl-terminated butyl rubber, diaminodiphenyl sulfone, imidazole, surfactants, aluminum oxide, boron nitride, and ethylene glycol methyl ether for LED circuit epoxy resin glue, However, this system does not have high whiteness and poor heat discoloration resistance after high temperature treatment

[0005] CN 103459493A uses bisphenol A skeleton epoxy resin, alicyclic epoxy resin, anhydride of complete hydrogenation or partial hydrogenation of aromatic polycarboxylic acid, titanium dioxide and dispersant to prepare resin composition to achieve high peel strength and heat treatment The purpose of high reflectivity, but the composition can not achieve flame retardancy and poor dimensional stability

[0006] CN 107815280A uses bisphenol A epoxy resin, dicyandiamide, magnesium hydroxide, silicon micropowder, etc. to improve the insulation of LED copper clad laminates, but this system does not have high whiteness and high heat discoloration resistance

[0007] CN 106381111A uses liquid bisphenol A resin, solid bisphenol A resin, phenolic resin, inorganic filler, whitening agent to make copper clad laminate glue to achieve high whiteness, good adhesion and anti-ultraviolet function, but the system is extremely weak after high temperature. Easy to change color

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