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Ceramic/polytetrafluoroethylene composite dielectric substrate and preparation method thereof

A polytetrafluoroethylene and ceramic technology, applied in the field of composite dielectric substrates, can solve the problems of high requirements on dispersibility, stability and rheology, unsuitable for casting process, and inability to flow, etc., and achieves a wide range of viscosity adjustment and uniformity. Good performance and high filling volume

Active Publication Date: 2020-05-08
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the casting method has high requirements on the dispersion, stability and rheology of the slurry, and the viscosity must be within an appropriate range, and the slurry behaves as a shear-thinning fluid, which is beneficial to the casting process. However, the currently used Polytetrafluoroethylene (PTFE) emulsion has a low viscosity and behaves as a dilatant fluid, which is not suitable for the tape casting process, and defects such as unevenness and inability to flow will occur

Method used

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  • Ceramic/polytetrafluoroethylene composite dielectric substrate and preparation method thereof
  • Ceramic/polytetrafluoroethylene composite dielectric substrate and preparation method thereof
  • Ceramic/polytetrafluoroethylene composite dielectric substrate and preparation method thereof

Examples

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Effect test

Embodiment 1

[0041] The silica powder and 60wt% polytetrafluoroethylene emulsion (brand name SFN-2H) were uniformly mixed at a ratio of 35:101.7 parts by weight. Then 4 parts by weight of the additive polyvinyl alcohol are added to adjust the slurry viscosity to the range of 500mPa·s-1500mPa·s. Adjust the height of the scraper to 2mm, cast the slurry on a 0.04mm thick glass fiber cloth substrate at a speed of 15cm / min, put it in an oven for drying, and use a gradient temperature program to discharge additives and other impurities in the cast sheet. Then cool at room temperature. The specific gradient heating program is: 80°C for 2h, 180°C for 2h, 260°C for 4h, and 330°C for 4h. Cut the cooled sheet and use a hot press to perform double-sided copper-clad hot pressing in a vacuum, high temperature and high pressure environment, where the pressure is 18MPa, the holding time is 1h, and the thickness of the copper foil is 35μm to obtain a ceramic with a thickness of 1mm. / PTFE composite dielec...

Embodiment 2

[0043] The ceramic / polytetrafluoroethylene composite dielectric substrate was prepared according to the method of Example 1, except that the weight ratio of silica powder, polytetrafluoroethylene emulsion and polyvinyl alcohol was 30:110:4.

Embodiment 3

[0045] The ceramic / polytetrafluoroethylene composite dielectric substrate was prepared according to the method of Example 1, except that the weight ratio of silica powder, polytetrafluoroethylene emulsion and polyvinyl alcohol was 25:118.3:4.

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Abstract

The invention relates to the field of composite dielectric substrates, in particular to a composite material for a tape casting process, a ceramic / polytetrafluoroethylene tape casting sheet prepared from the composite material and taking glass fibers cloth as a substrate, a ceramic / polytetrafluoroethylene composite dielectric substrate and a preparation method thereof. The ceramic / polytetrafluoroethylene composite dielectric substrate is simple in preparation process and environment-friendly in raw materials, can meet the requirements of high-content ceramic filling and large ceramic / resin layer thickness, and has excellent electrical performance and low thermal expansion coefficient.

Description

Technical field [0001] The invention relates to the field of composite medium substrates, in particular to a ceramic / polytetrafluoroethylene composite medium substrate prepared by a water-based casting method. Background technique [0002] Copper clad laminate (Copper Clad Laminate, CCL), referred to as copper clad laminate, is a plate-shaped material formed by covering one or both sides of an insulating material with copper foil and hot pressing. Copper clad laminates are often used as substrate materials for printed circuit boards (PCBs), which play the role of interconnection, insulation, and support in the printed circuit boards, and their performance directly affects the quality of electronic products. In recent years, with the rapid development of electronic information technology, the performance requirements of copper clad laminates have become higher and higher, and composite dielectric substrates have received more and more attention. [0003] Polytetrafluoroethylene (PT...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/32B32B27/18B32B9/00B32B9/04B32B27/12B32B17/02B32B17/10B32B15/20B32B15/14B32B15/085B32B33/00C08L27/18C08L29/04C08K3/36B29D7/01B29C65/02
CPCB29C65/02B29D7/01B32B5/02B32B9/005B32B9/047B32B15/085B32B15/14B32B15/20B32B17/10B32B27/12B32B27/18B32B27/322B32B33/00B32B2262/101B32B2457/08C08K2201/003C08L27/18C08L29/04C08K3/36
Inventor 沈杰李强志周静金伟祁琰媛陈文
Owner WUHAN UNIV OF TECH
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