High-temperature-resistant adhesive and high-temperature-resistant protective adhesive film formed by coating high-temperature-resistant adhesive
A high-temperature-resistant adhesive technology, applied in the field of high-temperature-resistant adhesives and high-temperature-resistant protective adhesive films coated and formed, can solve the problems of tape peel strength reduction, inability to process operations, and inability to quickly bond, etc.
Pending Publication Date: 2020-05-12
上海席亚高分子材料有限公司
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the disadvantage of rubber-type adhesives is that they cannot withstand temperatures of 260 degrees or higher and cannot maintain a fixed viscosity at high temperatures, and rubber-type adhesives need to be coated to a certain thickness to have proper bonding strength, so they are not applicable. Requirements for the process of thinning circuit boards
At present, the rubber-type heat-resistant tapes on the market include CM8R and CM8G high-temperature masking paper-plastic composite tapes from Siwei Tape Co., Ltd., and the maximum temperature used is 250 o C and only lasts for 1 minute
[0004] The common acrylic series solvent-based adhesives have excellent adhesive properties, non-toxicity, and low cost, but their heat resistance is average, and the peel strength of the tape will gradually decrease as the temperature rises.
In addition, some one-component acrylic adhesives rely on the reduction of molecular weight to improve the initial adhesion of the system, but after peeling off, there will be residual adhesive on the substrate, which not only affects the appearance and electrical properties of the product, but also makes it impossible to carry out subsequent processing Operation
In addition, some two-component adhesives rely on the addition of curing agents to increase the cohesive strength of the system to reduce the amount of residual glue, but it will result in extremely low initial adhesion of the system, which cannot be bonded quickly and affects production efficiency.
[0005] In addition, there are many problems in the base materials and adhesives selected for high temperature resistant tapes. For example, the base materials are mostly single-layer traditional materials, such as fabrics, foams, plastic films and non-woven fabrics with general heat resistance and moisture resistance. The properties cannot meet the client's process requirements such as heat resistance and clean room cleanliness requirements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0039] Take the preparation of one kilogram of glue as an example, first get 0.3g of the organic peroxide as claimed in claim 5 and mix it in the solvent of equal weight as claimed in claim 2. Then get 1.5 g of epoxy resin as claim 4 and mix in the solvent of equal weight as claim 2; then mix the aforementioned two solutions and add 90 g of polyacrylic resin as claim 1; finally add the aforementioned solvent The components are made into a glue solution with a solid content of about 50%; finally coated on the high temperature resistant film of claim 10 and finally pressed onto the release film of claim 11. Based on this formula design, we selected two optimized formulas as examples; in addition, in order to compare the superiority of the present invention, comparative examples 3 and 4 with different resin ratios were added for comparison. The test conditions are as follows
[0040] Tensile force at room temperature
[0041] 175 o C tension value and
[0042] 230 o C tensio...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a high-temperature-resistant adhesive and a high-temperature-resistant protective adhesive film formed by coating the high-temperature-resistant adhesive. The high-temperature-resistant adhesive structurally comprises a high-temperature-resistant plastic film layer (or called as a base material film layer), a high-temperature-resistant adhesive layer (or called as a glue layer) and a release film layer from top to bottom. The high-temperature-resistant protective adhesive film disclosed by the invention can be used for protecting the contact surfaces of different materials of a circuit board, such as raw copper, or the surfaces subjected to roughening treatment, such as browned copper, and the surfaces of other insulating materials, such as polyimide films and insulating pre-impregnated materials (Prepreg), to have high adhesion. In subsequent process requirements of a circuit board, such as a high-temperature condition or an acid-base proess, the adhesive filmstill has good peeling strength and peeling retention; and meanwhile, after the process is completed, the adhesive film can be easily peeled off from the surfaces of different materials without adhesive residues.
Description
technical field [0001] A high-temperature-resistant adhesive and a high-temperature-resistant protective adhesive film formed by coating thereof are structured from top to bottom including a high-temperature-resistant plastic film layer, a high-temperature-resistant adhesive layer and a release film layer. The high temperature resistant protective adhesive film of the present invention can be used to protect the contact surface of different materials of circuit boards, such as raw copper, or the surface after rough super-treatment such as brown copper, and other insulating materials such as polyimide film and insulating prepreg High adhesion to surfaces such as materials (Prepreg). Moreover, in the follow-up process requirements of circuit boards, such as high temperature conditions or acid-base processes, it still has good peel strength and peel retention. At the same time, it can be easily peeled off the surface of different materials without residual glue after the process ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/04C09J163/00C09J7/30C09J7/40
CPCC09J133/04C09J7/30C09J7/40C08L2205/03C08L2205/025C08L2205/035C08L2201/08C09J2203/326C08L63/00C08L33/04
Inventor 不公告发明人
Owner 上海席亚高分子材料有限公司