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A Gold Wire Bonding Structure Based on Multi-channel Digital Optical Transceiver Module

A transceiver module, gold wire bonding technology, applied in the coupling of optical waveguides, electromagnetic transceivers, optics, etc., can solve the problems of difficult gold wire bonding, decreased production efficiency, increased production costs, etc., to reduce production costs. , the effect of prolonging the service life and reducing the difficulty

Active Publication Date: 2021-10-01
BEIJING AEROSPACE TIMES OPTICAL ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the existing multi-channel digital optical transceiver module design scheme, a very important step in the optical transceiver module is gold wire bonding. The more channels there are, the higher the production requirements for gold wire bonding will be. Increase in production costs and decrease in production efficiency
Gold wire bonding of existing optical transceiver modules is difficult, resulting in long production cycle and low production efficiency

Method used

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  • A Gold Wire Bonding Structure Based on Multi-channel Digital Optical Transceiver Module
  • A Gold Wire Bonding Structure Based on Multi-channel Digital Optical Transceiver Module
  • A Gold Wire Bonding Structure Based on Multi-channel Digital Optical Transceiver Module

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Embodiment Construction

[0031] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments disclosed in the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0032] like figure 1 , in this embodiment, the gold wire bonding structure based on the multi-channel digital optical transceiver module includes: laser 1, light source driver chip 2, high frequency heat sink I31, gold wire I71 and gold wire II72. Among them, the laser 1 is bonded to the high-frequency heat sink I31 through gold wire I71, and the light source driver chip 2 is bonded to the high-frequency heat sink I31 through gold wire II72 to realize the conversion of electrical signals into optical signals; among them, the laser 1 and the light source driver chip 2 are respectively located on both sides of the high-frequency heat sink I31.

[0033] In a preferred embodiment of the present invention, as figure 2 , the gold wire bon...

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Abstract

The invention discloses a gold wire bonding structure based on a multi-channel digital optical transceiver module, including: a laser, a light source driver chip, a high-frequency heat sink I, a gold wire I and a gold wire II; the laser and the high-frequency heat sink I pass through The gold wire I is bonded, and the light source driver chip and the high-frequency heat sink I are bonded through the gold wire II to realize the conversion of electrical signals into optical signals; among them, the laser and the light source driver chip are located on both sides of the high-frequency heat sink I. The gold wire bonding structure based on the multi-channel digital optical transceiver module of the present invention improves the coupling effect and various performance indexes of the multi-channel digital optical transceiver module.

Description

technical field [0001] The invention belongs to the technical field of optical fiber communication, and in particular relates to a gold wire bonding structure based on a multi-channel digital optical transceiver module. Background technique [0002] An optical transceiver is a device that realizes mutual conversion (O / E, E / O) of optical signals and electrical signals in an optical fiber communication system and has a standard optical interface. It is one of the important devices in an optical fiber communication system. In the military, it is widely used in airborne electronic loads, radar, satellite communications, telemetry and remote control systems, etc., and is also a key unit supporting downstream industries such as cloud computing, broadband networks, digital medical care, and the Internet of Things. [0003] In modern communication, the volume requirements of communication equipment are getting smaller and higher, and the interface density is getting higher and highe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42H04B10/40
CPCG02B6/4272G02B6/4274G02B6/4296H04B10/40
Inventor 张晓杰杜茂顺张东旭
Owner BEIJING AEROSPACE TIMES OPTICAL ELECTRONICS TECH
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