Method for connecting transparent ceramics by adopting ultra-narrow laser

Abstract

The invention belongs to the field of transparent ceramic connection, and particularly relates to a method for connecting transparent ceramic through ultra-narrow laser. A to-be-connected part of a transparent ceramic is scanned by adopting ultra-short pulse laser with the pulse width of 10<-12> s to 10<-15> s to realize connection of the transparent ceramic. Ultra-narrow laser with an ultra-strong light intensity characteristic is utilized, and nonlinear absorption can be generated in the transparent ceramic; when the ultra-narrow laser acts on the transparent ceramic, due to the threshold effect of multi-photon absorption and the Gaussian characteristic of laser beams, the structural size of ultra-narrow laser processing can break through the optical diffraction limit, even nano-scale precision processing with the wavelength smaller than the laser wavelength can be achieved, and selective micro-welding of the three-dimensional space of the transparent ceramic can be achieved.

Description

technical field [0001] The invention belongs to the field of transparent ceramic connection, and in particular relates to a method for connecting transparent ceramics by using an ultra-narrow laser. Background technique [0002] Transparent ceramics are ceramics that can transmit light. Transparent ceramics not only have good transparency and optical properties, but also maintain high strength, corrosion resistance, high temperature resistance, good electrical insulation, high thermal conductivity and good dielectric properties of structural ceramics. Therefore, in new lighting technology, high temperature and high pressure Observation windows in corrosive environments, windows for infrared detection, protective fairings for missiles, transparent armor for military use and other fields have been more and more used, and new requirements are constantly being put forward for the connection of transparent ceramics. [0003] The existing main ways to connect transparent ceramics...

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Problems solved by technology

[0004] Adhesive bonding is the use of adhesives to join two surfaces. Although adhesives can join different materials, the adhesives release gases, photobleaching causes premature aging, and may cause contamination of surrounding devices. At the same time, in aerospace applications and high-power laser design, etc. Stress buildup from adhesive thermal degradation and thermal expansion can reduce adhesive life when subjected to large temperature changes

[0005] Solid-state diffusion welding refers to the connection method that the material does not melt and mainly relies on the diffusion between atoms. Diffusion welding can weld different ceramic materials and can achieve large-area welding, but the preparation of the surface to be welded requires high requirements and the welding time is long

[0006] Laser micro-welding refers to the welding technology that uses laser to achieve a size of less than 100mm in at least one dimension. As an alternative to precision resistance spot welding, laser micro-welding has the advantages of high connection strength, high precision, flexibility, non-contact, heat-affected zone and thermal It has the advantages of extremely small distortion, less restrictions on the shape of the workpiece, and single-step operation; however, the existing laser micro-welding mainly uses continuous and long-pulse lasers, which can only process the surface of the medium that is opaque to its wavelength and the energy is difficult to be absorbed by transparent materials. At the same time, the texture of the ceramic material itself is relatively brittle, and the thermal expansion during the welding process can easily cause it to crack. In addition, the thermal effect will also greatly affect the transmittance and other properties of the ceramic, so that the micro-welding of transparent ceramics is widely considered to be a major problem.

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