An improved method for the preparation of ion beam sputtering coating plugging sensor

Abstract

The invention discloses an improved preparation method of an ion beam sputtering coating blocking sheet sensor. In the structural design of the sensor designed in the present invention, the design of the lead wire welding positioning structure and the breaking position mechanism are added, which not only improves the operability of welding, but also significantly improves the consistency of the resistance value and the controllability of the breaking position .

Description

technical field [0001] The invention relates to an improved preparation method of an ion beam sputtering film-coated blocking sensor, which belongs to the field of sensor measuring devices. Background technique [0002] In recent years, with the development of aerospace vehicle technology, in order to realize the detection of the opening signal of the engine block, it is necessary to provide a sensor based on a flexible substrate. The two ends of the sensor are respectively connected to the nozzle of the engine for the control system to perform Blocking plate opening signal detection, when the engine is ignited, the pressure in the combustion chamber increases rapidly to a certain value, the sensor’s blocking plate is opened, and the sensor is pulled off, thereby providing an opening signal to the control system. [0003] At present, the plugging sensor commonly used in this field is a structure in which the strain gauge sensitive layer is directly pasted on the substrate wi...

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Problems solved by technology

[0004] (1) There is no lead wire welding positioning structure design in the structural design of the sensor, which will lead to inconvenient welding operation and poor consistency of resistance value caused by welding deviation;

[0005] (2) There is no pull-off position positioning structure design in the structural design of the sensor. When the engine is ignited and the sensor is pulled off, the pull-off position of each sensor will be random, making it uncontrollable;

However, since the thickness of the conductive film is relatively thin, and the surface of the Cu film is prone to oxidation, creases are easily generated in the free bending state, which reduces the reliability of the product;

[0007] (4) The process of depositing the same metal film at the same time as the conductive pattern film layer and the edge frame metal film, because the conductive pattern film layer is thicker, it takes a long time to clean the excess film between the edge frame metal film and the conductive pattern film, and the cleaning is not clean The edge sawtooth caused by secondary manual processing is required, which reduces production efficiency and product quality;

[0008] (5) The conductive pattern film layer (Cu) adopts silicon nitride Si 3 N 4 The protective film is used for protection. Due to the poor ductility of the silicon nitride dielectric film, cracks will appear in the dielectric film during the tensile test, resulting in reduced protection and affecting product quality.

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