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Manufacturing method of passive flexible temperature sensor based on micromachining process

A temperature sensor, passive flexible technology, applied in the field of microelectronics, can solve the problems such as the inability to quickly prepare flexible conductive lines in a large area, the difficulty of processing technology, and the limitation of circuit development, etc., to achieve rapid and accurate etching, low cost, and promotion of effect of development

Inactive Publication Date: 2020-05-15
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

(WebbRC, Bonifas AP, Behnaz A et al (2013) Ultrathin conformal devices for precise and continuous thermal characterization of human skin. Nat Mater 12:938–944), while using photolithography or plasma etching alone to make flexible wires, processing The technical difficulty is high, the cost is high, and there are certain requirements for the cleanliness, temperature, and air pressure of the processing environment, and the flexible conductive wire cannot be prepared quickly and in a large area, which limits the development of the circuit

Method used

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  • Manufacturing method of passive flexible temperature sensor based on micromachining process
  • Manufacturing method of passive flexible temperature sensor based on micromachining process

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Embodiment 1

[0027] Embodiment 1: A kind of manufacturing method of passive flexible temperature sensor based on micromachining technology, etching processing: use microelectronics technology to print flexible coil and microelectrode on flexible substrate, and the material of flexible substrate is polyethylene terephthalate Ethylene glycol formate, the flexible substrate with flexible coils and micro-electrodes is a flexible substrate for one-time processing, and the width of the flexible coil on the flexible substrate for one-time processing is 5 μm; temperature-sensitive material alignment transfer: after sintering the temperature-sensitive material to The quasi-transfer to the micro-electrodes of the primary processing flexible substrate and overlap the micro-electrodes of the primary processing flexible substrate to obtain the secondary processing flexible substrate of the temperature-sensing module with temperature-sensitive characteristics; the IC chip is aligned and bonded; The IC ch...

Embodiment 2

[0028] Embodiment 2: A kind of manufacturing method of the passive flexible temperature sensor based on micromachining process, etching processing: plate a metal layer on the flexible substrate, the thickness of the metal layer is 30nm, and the material of the flexible substrate is polyimide Amine, when plating the metal layer, vacuum evaporation is used to etch the metal layer on the flexible substrate. The etching method is laser direct writing. After laser etching, flexible coils and micro electrodes are left, and the rest of the metal layer is removed by laser , after etching, the flexible coil and micro-electrode on the flexible substrate are obtained. The flexible substrate with the flexible coil and the micro-electrode is a flexible substrate for one-time processing, and the width of the flexible coil on the flexible substrate for one-time processing is 5 μm; the temperature sensitive material Alignment transfer: After sintering, the temperature sensitive material is ali...

Embodiment 3

[0029] Embodiment 3: A kind of manufacturing method of the passive flexible temperature sensor based on micromachining process, etching processing: plate a metal layer on the flexible substrate, the thickness of the metal layer is 1 μm, and the material of the flexible substrate is polydimethylformaldehyde Silicone-based siloxane, sputtering coating is used when coating the metal layer, and the metal layer on the flexible substrate is etched. The etching method is a combination of laser direct writing and photolithography. The photoresist is positive photolithography during photolithography. After the positive photoresist is spin-coated on the surface of the metal layer, the photolithographic exposure is carried out. During the photolithographic exposure, it is placed under a mask with flexible coils and micro-electrode patterns. The pattern of the mask is opaque and the non-pattern is transparent. After photolithography exposure, it is developed with a photolithography develop...

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Abstract

The invention discloses a manufacturing method of a passive flexible temperature sensor based on a micromachining process. The manufacturing method comprises the following steps: arranging a flexiblecoil and a microelectrode, aligning and transferring a temperature sensitive material, aligning and bonding an IC chip, and packaging. The method disclosed by the invention is low in cost, can be carried out at normal temperature and normal pressure, has low requirements on the environment, can be used for industrially establishing an assembly line operation mode to process the high-precision passive flexible temperature sensor, and can be used for greatly improving the processing efficiency.

Description

technical field [0001] The invention relates to the field of microelectronics, in particular to a method for manufacturing a passive flexible temperature sensor based on a micromachining process. Background technique [0002] Traditional temperature sensors are mostly based on semiconductor materials, which are bulky and heavy, and their portability and flexibility are greatly limited. They are not suitable for wearable electronic devices that monitor human vital signs. Moreover, the traditional microelectrode processing technology generally uses processes such as photolithography and plasma etching. Webb et al. reported an ultrathin, compliant skin-like temperature sensor array using thin (50 nm) narrow (20 μm) gold films in serpentine shapes fabricated using microlithography. (WebbRC, Bonifas AP, Behnaz A et al (2013) Ultrathin conformal devices for precise and continuous thermal characterization of human skin. Nat Mater 12:938–944), while using photolithography or plasma...

Claims

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Application Information

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IPC IPC(8): G01K7/00
CPCG01K7/00
Inventor 王学文李玥许曼章郑璐黄维
Owner NORTHWESTERN POLYTECHNICAL UNIV
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