Vacuum insulator with secondary microstructure on surface and preparation method thereof

A technology of vacuum insulation and microstructure, applied in the direction of insulators, electrical components, circuits, etc., can solve the problems of ineffective control of micropore density, pore diameter parameters, poor controllability and stability of insulator surface microstructure, narrow application range, etc. Achieve the effects of improved stability, improved controllability and stability, and a wide range of applications

Inactive Publication Date: 2020-05-19
NORTHWEST INST OF NUCLEAR TECH
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Problems solved by technology

[0005] The purpose of the present invention is to provide a vacuum insulator with a secondary microstructure on the surface and its preparation method to solve the existing method of preparing a secondary microstructure on the surface of a vacuum insulator through single laser etching and induced hole formation. Narrow, unable to effectively control the density and pore diameter parameters of the micropores, and the controllability and stability of the microstructure on the surface of the insulator are poor technical problems

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  • Vacuum insulator with secondary microstructure on surface and preparation method thereof
  • Vacuum insulator with secondary microstructure on surface and preparation method thereof
  • Vacuum insulator with secondary microstructure on surface and preparation method thereof

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preparation example Construction

[0051] see Figure 7 , the present invention also provides a method for preparing the vacuum insulator with a secondary microstructure on the surface, comprising the following steps:

[0052] Step 1: Mix the polymer matrix and the pore-forming agent uniformly to prepare a composite material; when the polymer matrix and the pore-forming agent are mixed, the mass percentage of the pore-forming agent is 0.5% to 10%; the particle size of the pore-forming agent is the same as The surface of the V-shaped microgroove 2 of the vacuum insulator to be prepared requires the same diameter of the micropores 3 to be processed, which is 0.5 μm to 10 μm; if the density of the processed micropores 3 is required to be high, the mixing ratio of the pore-forming agent is high;

[0053] Step 2: According to the size parameter requirements of the vacuum insulator to be prepared, process the composite material prepared in step 1 into an insulator sample of corresponding size;

[0054] Step 3: Turn ...

Embodiment 1

[0061] (1) Weigh silica microspheres with a mass fraction of 10%, and the diameter of the silica microspheres is 10 μm, and disperse the silica microspheres in styrene by ultrasonic stirring; then add the crosslinking agent diethylene Basebenzene, initiator azobisisobutyronitrile, pre-polymerized under nitrogen protection; when the viscosity of the liquid in the bottle reaches the viscosity of glycerin, pour the liquid into the mold to continue the polymerization. The post-polymerization is under the protection of nitrogen, and the temperature-programmed polymerization is adopted to obtain the silica / cross-linked polystyrene composite material at last;

[0062] (2) Process the prepared silicon dioxide / cross-linked polystyrene composite material into a cylindrical insulator sample with a diameter of 30 mm and a thickness of 5 mm;

[0063] (3) Turn on the wavelength carbon dioxide infrared laser, set the laser parameters, and process 2 arrays of V-shaped microgrooves with a widt...

Embodiment 2

[0066] (1) Weigh titanium dioxide microspheres with a mass fraction of 0.5%, and the diameter of the titanium dioxide microspheres is 0.5 μm, and disperse the titanium dioxide microspheres in the epoxy resin prepolymerization liquid by means of ultrasonic stirring; then add a curing agent, and the mixed solution Pour into a mold for curing to obtain a titanium dioxide / epoxy resin composite;

[0067] (2) Processing the prepared titanium dioxide / epoxy resin composite material into a cylindrical insulator sample with a diameter of 30 mm and a thickness of 5 mm;

[0068] (3) Turn on the fiber laser, set the laser parameters, and process a V-shaped microgroove 2 array with a width of 1000 μm, a depth of 1500 μm, and a period of 1500 μm on the surface of the insulator sample by laser etching.

[0069] (4) Utilize the dilute hydrochloric acid solution with a concentration of 30% by mass to perform ultrasonic corrosion on the above-mentioned insulator sample with 2 arrays of V-shaped ...

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Abstract

The invention relates to a vacuum insulator and a preparation method thereof, in particular to a vacuum insulator with a secondary microstructure on the surface and a preparation method thereof. The problems that an existing method for preparing a secondary microstructure on the surface of a vacuum insulator through single laser etching and induced pore forming is narrow in application range, thedensity and pore diameter parameters of micropores cannot be effectively controlled, and the controllability and stability of the microstructure on the surface of the insulator are poor are solved. The insulator comprises an insulator body. The insulator is characterized in that the material of the insulator body is a composite material prepared by uniformly mixing a polymer matrix and a pore-forming agent; the surface of the insulator body is provided with periodic and parallel hundred-micron V-shaped microgroove arrays; micron-sized micropores are formed in the surface of the insulator bodyand the surfaces of the V-shaped microgrooves; the V-shaped microgrooves are formed by laser etching; and the micropores are prepared from an acid liquor corrosion pore-forming agent. The invention also provides a preparation method of the vacuum insulator with the secondary microstructure on the surface.

Description

technical field [0001] The invention relates to a vacuum insulator and a preparation method thereof, in particular to a vacuum insulator with a secondary microstructure on the surface and a preparation method thereof. Background technique [0002] With the development of high-power pulse technology in the direction of high power and miniaturization, the withstand voltage performance of insulators can no longer meet the current development needs, and has increasingly become a technical bottleneck restricting the development of high-power pulse technology; the main factors limiting the withstand voltage performance of insulators are Vacuum flashover [Miller H C.Flashover of insulators in vacuum: the last twenty years[J].IEEE Transactions on Dielectrics&Electrical Insulation.2016,22(6):3641-3657.], which is a kind of penetration along the surface of insulators The phenomenon of permanent discharge, the discharge voltage is lower than the breakdown voltage of the insulating mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B17/36H01B17/42H01B17/50H01B19/00H01B19/04
CPCH01B17/36H01B17/42H01B17/50H01B19/00H01B19/04
Inventor 柯昌凤霍艳坤刘文元程军陈昌华孙钧郭跃文唐运生
Owner NORTHWEST INST OF NUCLEAR TECH
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