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Semiconductor package

A semiconductor and packaging technology, applied in the field of fan-out semiconductor packaging, can solve problems such as corrosion and damage

Pending Publication Date: 2020-05-19
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, during the process of manufacturing the package, the connection pads of the semiconductor chip are exposed to air, moisture, chemical solutions, etc., which leads to corrosion and damage

Method used

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  • Semiconductor package
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Examples

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Embodiment Construction

[0024] Hereinafter, exemplary embodiments in the present disclosure will be described with reference to the accompanying drawings. In the drawings, the shapes, sizes, etc. of components may be exaggerated or reduced for clarity.

[0025] electronic device

[0026] figure 1 is a schematic block diagram illustrating an example of an electronic device system.

[0027] refer to figure 1 , the electronic device 1000 may accommodate the motherboard 1010 therein. The motherboard 1010 may include chip-related components 1020 , network-related components 1030 , other components 1040 , etc., physically connected or electrically connected thereto. These components may be connected to other components to be described below through various signal lines 1090 .

[0028] Chip-related components 1020 may include: memory chips, such as volatile memory (eg, dynamic random access memory (DRAM)), non-volatile memory (eg, read-only memory (ROM)), flash memory, etc.; application processors C...

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Abstract

The invention provides a semiconductor package, and the semiconductor package includes a semiconductor chip including a connection pad disposed on an active surface of the semiconductor chip, a passivation layer disposed on the connection pad and the active surface and having an opening exposing at least a portion of the connection pad, and a capping pad covering the connection pad exposed to theopening; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a connection via connected to the capping pad and a redistribution layer connected to the connection via, wherein the capping pad includes: a central portion disposed in the opening, and a peripheral portion extending fromthe central portion onto the passivation layer, and having a crystal grain having a size different from that of the crystal grain of the central portion.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2018-0138678 filed in the Korean Intellectual Property Office on November 13, 2018, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a semiconductor package, and more particularly, to a fan-out type semiconductor package. Background technique [0003] A significant recent trend in technology development related to semiconductor chips is to reduce the size of semiconductor chips. Therefore, in the field of packaging technology, in accordance with the rapidly increasing demand for small-sized semiconductor chips and the like, it has been required to realize a semiconductor package having a compact size while including a plurality of pins. One of the types of packaging technology proposed to meet the technical needs as described above is a fan-out type package. Such a fan-out package has a compact size and may ...

Claims

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Application Information

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IPC IPC(8): H01L23/488
CPCH01L24/02H01L24/05H01L24/08H01L2224/022H01L2224/02215H01L2224/0221H01L2224/0401H01L23/49816H01L23/5389H01L23/49822H01L23/3677H01L23/3128H01L2924/19105H01L2924/19042H01L2224/04105H01L2924/19043H01L2924/19041H01L24/20H01L2924/18162H01L2224/12105H01L2924/37001H01L24/06H01L23/31H01L23/525H01L23/485H01L23/13H01L23/49838H01L2224/05647H01L24/19H01L21/4857H01L2224/08238H01L2224/05624
Inventor 崔宰熏李斗焕金炳镐崔朱伶
Owner SAMSUNG ELECTRONICS CO LTD
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